Abstract: An internal rotor type nail drive device of electric nail gun, comprising a nailing rod and an internal rotor type rotary actuator that can output a specific rotation angle and can drive the nailing rod to move downward for nailing. Specifically, the rotary actuator comprises a stator and a rotor arranged inside the stator, even groups of electromagnetic mutual action components are configured in pairs between the stator and the rotor, to generate a tangential force to drive the rotor to rotate for a specific rotation angle, and to drive the nailing rod to move for a nailing stroke. The nailing stroke can be determined by a specific rotation angle. Thus, through the above configuration of the rotary actuator, the structure of the electric nail gun can be simplified, and the kinetic energy for nailing can be increased.

Abstract: A semiconductor device includes a substrate, a heat dissipation dielectric layer, a conductive interconnect structure, and a blocking dielectric layer. The heat dissipation dielectric layer is disposed on the substrate and has a thermal conductivity greater than 10 W/mK. The conductive interconnect structure is disposed in the heat dissipation dielectric layer. The blocking dielectric layer is disposed in the heat dissipation dielectric layer to isolate the conductive interconnect structure from the heat dissipation dielectric layer.

Abstract: An immersion cooling system is provided. The immersion cooling system includes a box, an upper cover, plural fixing components, plural latches and a link module. The box has an opening upwardly. The upper cover covers the opening. The fixing components are disposed on the box and arranged adjacent to the outer perimeter of the opening. The latches corresponding to the fixing components are disposed on the upper cover. The link module includes plural crossbars corresponding to the latches. The link module moves downwardly close to the upper cover, scroll-wheels of the latches roll along limiting surfaces of corresponding fixing components and press against the upper cover, the upper cover closes the opening to form an airtight space. The link module moves upwardly away from the upper cover, the scroll-wheels are separated away from the limiting surfaces of corresponding fixing components, allows the upper cover to separate from the opening.

Abstract: A semiconductor structure includes a base structure including a substrate and a device unit disposed on a front surface of the substrate, a front dielectric portion disposed on the front surface to cover the device unit, a front conductive layer disposed in the front dielectric portion and connected to the device unit, a back dielectric unit disposed on a back surface of the substrate opposite to the front surface and including at least one first part which includes a first dielectric portion having a thermal conductivity which is greater than that of the front dielectric portion, and a back conductive unit which is disposed in the back dielectric unit and connected to the device unit, and which includes at least one first conductive layer disposed in the at least one first part.

Abstract: A semiconductor device and method of manufacture are provided. In some embodiments a treatment process is utilized to treat a work function layer. The treatment prevents excessive oxidation of the work function layer during subsequent processing steps, such as application of a subsequent photoresist material, thereby allowing the work function layer to be thinner than otherwise.

Abstract: A structure includes a semiconductor substrate including a first semiconductor region and a second semiconductor region, a first transistor in the first semiconductor region, and a second transistor in the second semiconductor region. The first transistor includes a first gate dielectric over the first semiconductor region, a first work function layer over and contacting the first gate dielectric, and a first conductive region over the first work function layer. The second transistor includes a second gate dielectric over the second semiconductor region, a second work function layer over and contacting the second gate dielectric, wherein the first work function layer and the second work function layer have different work functions, and a second conductive region over the second work function layer.

Abstract: Semiconductor devices and methods of manufacturing semiconductor devices with differing threshold voltages are provided. In embodiments the threshold voltages of individual semiconductor devices are tuned through the removal and placement of differing materials within each of the individual gate stacks within a replacement gate process, whereby the removal and placement helps keep the overall process window for a fill material large enough to allow for a complete fill.

Abstract: A process-management system and a process-management method are provided. The process-management system includes a process-planning module, a process-management module, and a process-executing module. The process-planning module stores a preset workflow and is configured to receive a first input instruction and a second input instruction. The process-planning module provides the preset workflow according to the first input instruction, and adjusts the preset workflow according to the second input instruction to generate a customized workflow. The process-management module is electrically connected to the process-planning module and is configured to generate a work instruction according to the preset workflow or the customized workflow. The process-executing module is electrically connected to the process-management module and configured to process a workpiece according to the work instruction.

Abstract: An electronic device includes a metal back cover and an antenna module. The metal back cover includes a slit. The antenna module is separated from the metal back cover and disposed far away from the slit. The antenna module includes an antenna radiator, a first ground radiator, and a connection radiator. The antenna radiator includes a first section, a second section, and a third section that are sequentially connected and form bends, and the first section has a feeding end. A first slot is formed between the first ground radiator, the first section, the second section, and a part of the third section. A width and length of the first slot are associated with a center frequency and impedance matching of a high frequency band.

Abstract: An electronic device, including a metal back cover, a front cover, a metal wall, and at least one antenna radiator, is provided. The front cover covers the metal back cover and includes a frame area. The metal wall is disposed between the metal back cover and the front cover, and forms a metal cavity corresponding to the frame area together with the metal back cover. Each of the at least one antenna radiator is disposed in the metal cavity, is connected to a first side wall of the metal back cover, and is spaced apart from the metal wall by a distance.

Abstract: A structure includes a semiconductor substrate including a first semiconductor region and a second semiconductor region, a first transistor in the first semiconductor region, and a second transistor in the second semiconductor region. The first transistor includes a first gate dielectric over the first semiconductor region, a first work function layer over and contacting the first gate dielectric, and a first conductive region over the first work function layer. The second transistor includes a second gate dielectric over the second semiconductor region, a second work function layer over and contacting the second gate dielectric, wherein the first work function layer and the second work function layer have different work functions, and a second conductive region over the second work function layer.

Abstract: Semiconductor devices and methods of manufacturing semiconductor devices with differing threshold voltages are provided. In embodiments the threshold voltages of individual semiconductor devices are tuned through the removal and placement of differing materials within each of the individual gate stacks within a replacement gate process, whereby the removal and placement helps keep the overall process window for a fill material large enough to allow for a complete fill.

Abstract: A thermal compensation system for machine tools includes a thermal compensation-monitoring device and a cloud processing device. The thermal compensation-monitoring device receives a plurality of temperature signals of a workpiece and corresponding processing tolerance data to build or update a thermal compensation database. The cloud processing device provides a thermal compensation model, and applies the model with the characterized temperature signals and the tolerance data to generate a compensation value so as to decide whether or not to modify the model or to run a compensation is necessary.

Abstract: A dummy gate electrode and a dummy gate dielectric are removed to form a recess between adjacent gate spacers. A gate dielectric is deposited in the recess, and a barrier layer is deposited over the gate dielectric. A first work function layer is deposited over the barrier layer. A first anti-reaction layer is formed over the first work function layer, the first anti-reaction layer reducing oxidation of the first work function layer. A fill material is deposited over the first anti-reaction layer.

Abstract: A nail drive method applied in an electric nail gun, in which a rotary actuator is driven to generate forward rotational kinetic energy for nailing. The rotary actuator has paired wire bundles and magnetic lines arranged in circumferential directions. The nail drive method comprises boosting a pre-loaded voltage of a battery to generate a peak voltage, and storing the electric charge generated by the peak voltage, and then releasing the peak voltage and its electric charge to the rotary actuator through a nailing signal, so that the wire bundles can generate a current to interact with the magnetic lines to generate a tangential force, so that the magnetic lines can drive the rotor to rotate for a specific angle, and the rotary actuator can directly generate a forward rotational kinetic energy for nailing. Thus, the energy conversion structure installed in the conventional electric nail gun can be omitted.

Abstract: A jacket for a handheld electronic device includes: a housing adapted to couple with a handheld electronic device; a fan mounted in the housing; and a control unit electrically connecting with the fan and adapted to electrically connect with the handheld electronic device, with the control unit capable of controlling the fan according to a control command outputted by the handheld electronic device.

Abstract: A motor casing includes a frame assembly and a motor base. The frame assembly includes a frame having an inner face defining an air channel, and a plurality of connection members disposed in the air channel. Each connection member has first and second ends. The first ends of the connection members are coupled to the inner face of the frame. The motor base includes a supporting member and a covering member. The supporting member has an inner surface defining a through-hole, and an outer surface coupled with the second ends of the connection members. An opening portion and a coupling portion are formed at two sides of the through-hole. The covering member is coupled to the opening portion of the supporting member and has first and second surfaces. The first surface faces the through-hole of the supporting member. The covering member includes at least one vent.

Abstract: A rotate-to-retract type storing apparatus including a U-shaped protective casing, a shell body and a storing arrangement. A disk member is protrudes adjacent to an open side at the surface of protecting casing, and a protrusion member is provided at a partial position of the disk member. The shell body defines a receiving cavity and includes an insertion hole at a front end thereof for a second end portion of the storing arrangement to get into the receiving cavity and a retention hole penetrating a bottom surface of the shell body for coupling with the disk member so that the shell body is capable of rotating with respect to the protective casing and directing the coupling slot to rotate with respect to the protrusion member. This defines a moving distance—just enough for a first end portion of the storing arrangement to move between an application position and a retraction position. The result is a minimized size of the storing apparatus.

Abstract: The invention discloses a motor casing including a frame assembly and a motor base. The frame assembly includes a frame having an inner face defining an air channel, and a plurality of connection members disposed in the air channel. Each connection member has first and second ends. The first ends of the connection members are coupled to the inner face of the frame. The motor base includes a supporting member and a covering member. The supporting member has an inner surface defining a through-hole, and an outer surface coupled with the second ends of the connection members. An opening portion and a coupling portion are formed at two sides of the through-hole. The covering member is coupled to the opening portion of the supporting member and has first and second surfaces. The first surface faces the through-hole of the supporting member. The covering member includes at least one vent.

Abstract: A motor base comprises a supporting member and an enclosure member. The supporting member has an outer surface and an inner surface, wherein the inner surface defines a through-hole. One side of the through-hole forms an opening portion and another side of the through-hole forms a coupling portion. The enclosure member is coupled to the opening portion of the supporting member and has a first surface and a second surface opposing to the first surface. The first surface faces the through-hole of the supporting member. The enclosure member further comprises at least one vent extending from the first surface to the second surface thereof.