Patents by Inventor Chia-Ching Chen
Chia-Ching Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11983680Abstract: An intelligent monitoring system for waste disposal and the method thereof are provided, which include a plurality of operational devices and stages. First, a transportation stage is performed to loading a transport vehicle with a waste so as to transport the waste to a disposal station for further treatment. A camera and a sensor for detecting abnormal conditions are installed any one of the operational devices or installed in the operational path of any one of the operational devices. The camera records the videos of the operational stages, captures the images from the videos and recognizes the images in order to determine whether the abnormal conditions occur in any one of the operational stages. Alternatively, the camera is triggered to capture the images and recognize the images after the abnormal conditions are detected by the sensor in order to determine whether the abnormal conditions actually occur.Type: GrantFiled: June 12, 2021Date of Patent: May 14, 2024Assignee: CHASE SUSTAINABILITY TECHNOLOGY CO., LTD.Inventors: Yung-Fa Yang, Tsung-Tien Chen, Shao-Hsin Hsu, Bo-Wei Chen, Chia-Ching Chen, Ming-Hua Tang
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Publication number: 20240016954Abstract: A composition for improving the solubility of poorly soluble substances is provided. The composition for improving the solubility of poorly soluble substances includes 60-97% by weight of cyclodextrin and/or a derivative thereof, 0.5-4% by weight of at least one water-soluble polymer and 0.4-30% by weight of at least one water-soluble stabilizer, wherein the at least one water-soluble stabilizer includes caffeine, and wherein the poorly soluble substance is a tyrosine kinase inhibitor.Type: ApplicationFiled: September 21, 2023Publication date: January 18, 2024Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Wen-Chia HUANG, Yen-Jen WANG, Felice CHENG, Chia-Ching CHEN, Shao-Chan YIN, Chien Lin PAN, Tsan-Lin HU, Meng-Nan LIN, Kuo-Kuei HUANG, Maggie LU, Chih-Peng LIU
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Patent number: 11801310Abstract: A composition for improving the solubility of poorly soluble substances is provided. The composition includes about 40-99.5% by weight of cyclodextrin and/or derivatives thereof; about 0.05-10% by weight of at least one water-soluble polymer; and about 0.05-60% by weight of at least one water-soluble stabilizer.Type: GrantFiled: December 26, 2018Date of Patent: October 31, 2023Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Wen-Chia Huang, Yen-Jen Wang, Felice Cheng, Chia-Ching Chen, Shao-Chan Yin, Chien-Lin Pan, Tsan-Lin Hu, Meng-Nan Lin, Kuo-Kuei Huang, Maggie Lu, Chih-Peng Liu
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Patent number: 11597555Abstract: A delaminated container has a main body portion and an opening portion. An accommodation space of the delaminated container is formed by a body inner surface of the main body portion and an opening inner surface of the opening portion. The delaminated container includes a first layer and a second layer. The first layer includes a first tightly-attached section. At the main body portion, the first layer is located closer to the body inner surface than the second layer located thereto and is exposed on the body inner surface. The second layer includes a second tightly-attached section. The first tightly-attached section and the second tightly-attached section are tightly attached to each other. The first tightly-attached section and the second tightly-attached section are both located at the opening portion of the delaminated container.Type: GrantFiled: April 14, 2021Date of Patent: March 7, 2023Assignee: SR PACKAGING INC.Inventor: Chia-Ching Chen
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Publication number: 20220366379Abstract: An intelligent monitoring system for waste disposal and the method thereof are provided, which include a plurality of operational devices and stages. First, a transportation stage is performed to loading a transport vehicle with a waste so as to transport the waste to a disposal station for further treatment. A camera and a sensor for detecting abnormal conditions are installed any one of the operational devices or installed in the operational path of any one of the operational devices. The camera records the videos of the operational stages, captures the images from the videos and recognizes the images in order to determine whether the abnormal conditions occur in any one of the operational stages. Alternatively, the camera is triggered to capture the images and recognize the images after the abnormal conditions are detected by the sensor in order to determine whether the abnormal conditions actually occur.Type: ApplicationFiled: June 12, 2021Publication date: November 17, 2022Inventors: YUNG-FA YANG, TSUNG-TIEN CHEN, SHAO-HSIN HSU, BO-WEI CHEN, CHIA-CHING CHEN, MING-HUA TANG
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Publication number: 20220242604Abstract: A delaminated container has a main body portion and an opening portion. An accommodation space of the delaminated container is formed by a body inner surface of the main body portion and an opening inner surface of the opening portion. The delaminated container includes a first layer and a second layer. The first layer includes a first tightly-attached section. At the main body portion, the first layer is located closer to the body inner surface than the second layer located thereto and is exposed on the body inner surface. The second layer includes a second tightly-attached section. The first tightly-attached section and the second tightly-attached section are tightly attached to each other. The first tightly-attached section and the second tightly-attached section are both located at the opening portion of the delaminated container.Type: ApplicationFiled: April 14, 2021Publication date: August 4, 2022Inventor: Chia-Ching CHEN
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Patent number: 10984787Abstract: A multimedia apparatus includes a wireless transmission device, an audio receiving device, a processing device and a projection device. The audio receiving device is for receiving a first voice data. The processing device is coupled with the audio receiving device and the wireless transmission device. The processing device is for outputting the first voice data via the wireless transmission device. The projection device is coupled with the processing device. When the processing device receives a first image data corresponding to the first voice data via the wireless transmission device, the processing device operates the projection device to project a first projection picture according to the first image data. A multimedia system including the multimedia apparatus is also disclosed.Type: GrantFiled: March 21, 2018Date of Patent: April 20, 2021Assignee: PEGATRON CORPORATIONInventors: Po-Chun Chen, Tzu-Fang Huang, Chung-Kuan Wang, Chia-Ching Chen, Kuang-Hsun Hsieh, Chih-Hsien Tsung, Hsiang-Lin Yang, Tao-Hua Cheng, Cheng-Yu Kao, Nien-Chih Wang
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Patent number: 10908731Abstract: A fingerprint recognition device with a wake-up function is provided, which includes a signal wiring, a sensing array at least partially surrounded by the signal wiring, a first electrode, and a control circuit. The control circuit is coupled with the signal wiring, the first electrode, and the sensing array. The control circuit detects capacitance between the signal wiring and the first electrode in a first operation mode to generate a sensing result, and determines whether an object is on or near the sensing array according to the sensing result. If the control circuit determines that the object is on or near the sensing array, the control circuit switches from the first operation mode to a second operation mode. The control circuit drives the sensing array by the signal wiring to generate multiple sensing signals in the second operation mode, and calculates a sensed image according to the multiple sensing signals.Type: GrantFiled: June 19, 2020Date of Patent: February 2, 2021Assignee: AU OPTRONICS CORPORATIONInventors: Yi-Hsin Lin, Hung-Wen Chou, Yu-Jing Chen, Chia-Ching Chen, Tsun-Chien Cheng, Chun-Ku Kuo, Po-Yuan Liu
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Patent number: 10882240Abstract: A blow-molded lamination container includes an outer layer and an inner layer. The outer layer has a bottom and an air-inletting seam. The air-inletting seam is disposed through the bottom of the outer layer, and is formed from a tapering opening by cooling shrinkage. The inner layer is disposed in the outer layer, is capable of being filled with a content and contracts with respect to the outer layer, and is not nipped within the air-inletting seam by the outer layer. A width of a widest portion of the air-inletting seam is at least twice greater than a width of a narrowest portion of the air-inletting seam. A manufacturing method for the blow-molded lamination container is also provided.Type: GrantFiled: July 31, 2019Date of Patent: January 5, 2021Assignee: SR PACKAGING INC. TAIWAN BRANCH (SEYCHELLES)Inventor: Chia-Ching Chen
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Publication number: 20200047394Abstract: A blow-molded lamination container includes an outer layer and an inner layer. The outer layer has a bottom and an air-inletting seam. The air-inletting seam is disposed through the bottom of the outer layer, and is formed from a tapering opening by cooling shrinkage. The inner layer is disposed in the outer layer, is capable of being filled with a content and contracts with respect to the outer layer, and is not nipped within the air-inletting seam by the outer layer. A width of a widest portion of the air-inletting seam is at least twice greater than a width of a narrowest portion of the air-inletting seam. A manufacturing method for the blow-molded lamination container is also provided.Type: ApplicationFiled: July 31, 2019Publication date: February 13, 2020Inventor: Chia-Ching Chen
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Publication number: 20190209706Abstract: A composition for improving the solubility of poorly soluble substances is provided. The composition includes about 40-99.5% by weight of cyclodextrin and/or derivatives thereof; about 0.05-10% by weight of at least one water-soluble polymer; and about 0.05-60% by weight of at least one water-soluble stabilizer.Type: ApplicationFiled: December 26, 2018Publication date: July 11, 2019Applicant: Industrial Technology Research InstituteInventors: Wen-Chia HUANG, Yen-Jen WANG, Felice CHENG, Chia-Ching CHEN, Shao-Chan YIN, Chien-Lin PAN, Tsan-Lin HU, Meng-Nan LIN, Kuo-Kuei HUANG, Maggie LU, Chih-Peng LIU
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Publication number: 20180342246Abstract: A multimedia apparatus includes a wireless transmission device, an audio receiving device, a processing device and a projection device. The audio receiving device is for receiving a first voice data. The processing device is coupled with the audio receiving device and the wireless transmission device. The processing device is for outputting the first voice data via the wireless transmission device. The projection device is coupled with the processing device. When the processing device receives a first image data corresponding to the first voice data via the wireless transmission device, the processing device operates the projection device to project a first projection picture according to the first image data. A multimedia system including the multimedia apparatus is also disclosed.Type: ApplicationFiled: March 21, 2018Publication date: November 29, 2018Applicant: PEGATRON CORPORATIONInventors: Po-Chun Chen, Tzu-Fang Huang, Chung-Kuan Wang, Chia-Ching Chen, Kuang-Hsun Hsieh, Chih-Hsien Tsung, Hsiang-Lin Yang, Tao-Hua Cheng, Cheng-Yu Kao, Nien-Chih Wang
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Patent number: 9978705Abstract: A semiconductor package structure includes a substrate, a semiconductor chip, and a solder material. The substrate includes an insulating layer, a conductive circuit layer, and a conductive bump. The conductive circuit layer is recessed from a top surface of the insulating layer. The conductive circuit layer includes a pad, and a side surface of the pad extends along a side surface of the insulating layer. The conductive bump is disposed on the pad. A side surface of the conductive bump, a top surface of the pad and the side surface of the insulating layer together define an accommodating space. A solder material electrically connects the conductive bump and the semiconductor chip. A portion of the solder material is disposed in the accommodating space.Type: GrantFiled: July 28, 2016Date of Patent: May 22, 2018Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Guo-Cheng Liao, Chia-Ching Chen, Yi-Chuan Ding
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Publication number: 20170116672Abstract: A system for forming leader user accounts by analyzing investment activity, receiving user designations of leader user accounts to link financial account behavior, and executing financial purchase orders based on the linkages between active leader users and the following users.Type: ApplicationFiled: October 17, 2016Publication date: April 27, 2017Inventor: Chia-Ching Chen
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Patent number: 9615071Abstract: A camera tuning circuit has a first storage space, a second storage space and a controller. The first storage space stores a first reference camera correction setting for a reference camera module under a first color temperature. The second storage space stores a second reference camera correction setting for the reference camera module under a second color temperature, wherein the second color temperature is different from the first color temperature. The controller receives a default camera correction setting of a target camera module, the first reference camera correction setting, and the second reference camera correction setting, and generates a tuned camera correction setting for the target camera module according to the default camera correction setting, the first reference camera correction setting, and the second reference camera correction setting.Type: GrantFiled: June 10, 2014Date of Patent: April 4, 2017Assignee: MEDIATEK INC.Inventors: Chia-Ching Chen, Muge Wang, Chih-Ping Lin, Chia-Hui Kuo, Yu-Seng Tsai
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Publication number: 20160336287Abstract: A semiconductor package structure includes a substrate, a semiconductor chip, and a solder material. The substrate includes an insulating layer, a conductive circuit layer, and a conductive bump. The conductive circuit layer is recessed from a top surface of the insulating layer. The conductive circuit layer includes a pad, and a side surface of the pad extends along a side surface of the insulating layer. The conductive bump is disposed on the pad. A side surface of the conductive bump, a top surface of the pad and the side surface of the insulating layer together define an accommodating space. A solder material electrically connects the conductive bump and the semiconductor chip. A portion of the solder material is disposed in the accommodating space.Type: ApplicationFiled: July 28, 2016Publication date: November 17, 2016Inventors: Guo-Cheng LIAO, Chia-Ching CHEN, Yi-Chuan DING
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Patent number: 9478500Abstract: Described herein are interposer substrate designs for warpage control, semiconductor structures including said interposer substrates, and fabricating processes thereof. An interposer substrate defines a cavity and further includes a reinforcement structure, wherein the reinforcement structure is used to control warpage of the semiconductor package structure.Type: GrantFiled: February 17, 2015Date of Patent: October 25, 2016Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Chia-Ching Chen, Chin-Li Kao, Hung-Jen Chang, Tang-Yuan Chen, Wei-Hong Lai
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Patent number: 9437565Abstract: The present disclosure relates to a semiconductor package structure including a semiconductor substrate, a semiconductor chip and a conductive material. The semiconductor substrate includes an insulating layer, a conductive circuit layer and a conductive bump. The conductive circuit layer is recessed from the top surface of the insulating layer, and includes at least one pad. The conductive bump is disposed on the at least one pad. A side surface of the conductive bump, a top surface of the at least one pad and a side surface of the insulating layer together define an accommodating space. The conductive material is electrically connected the conductive bump and the semiconductor chip, and a portion of the conductive material is disposed in the accommodating space.Type: GrantFiled: December 30, 2014Date of Patent: September 6, 2016Assignee: ADVANCED SEMINCONDUCTOR ENGINEERING, INC.Inventors: Guo-Cheng Liao, Chia-Ching Chen, Yi-Chuan Ding
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Publication number: 20160240481Abstract: Described herein are interposer substrate designs for warpage control, semiconductor structures including said interposer substrates, and fabricating processes thereof. An interposer substrate defines a cavity and further includes a reinforcement structure, wherein the reinforcement structure is used to control warpage of the semiconductor package structure.Type: ApplicationFiled: February 17, 2015Publication date: August 18, 2016Applicant: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Chia-Ching CHEN, Chin-Li KAO, Hung-Jen CHANG, Tang-Yuan CHEN, Wei-Hong LAI
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Patent number: 9420506Abstract: A cellular communications system end-user transceiver (303) automatically determines (101) at least one received signal strength metric as corresponds to both a presently-utilized base station (307) and at least one presently un-utilized base station (309) to provide one or more corresponding received signal strength values. This transceiver then determines (102) whether to purposefully alter this received signal strength value(s). When deciding to make the alteration, the transceiver automatically alters (104) the received signal strength value(s) to provide one or more corresponding altered signal strength values. The transceiver then transmits (105) the latter in order to influence a handover decision in favor of handing over the transceiver from the presently-utilized base station to the presently un-utilized base station.Type: GrantFiled: July 30, 2009Date of Patent: August 16, 2016Assignee: Continental Automotive Systems, Inc.Inventors: James Snider, Chia-Ching Chen