Abstract: A sense amplifier circuit includes a sense amplifier, a switch and a temperature compensation circuit. The temperature compensation circuit provides a control signal having a positive temperature coefficient, based on which the switch provides reference impedance for temperature compensation. The sense amplifier includes a first input end coupled to a target bit and a second input end coupled to the switch. The sense amplifier outputs a sense amplifier signal based on the reference impedance and the impedance of the target bit.

Abstract: A spring brake includes a base, on which a first reel and a second reel are pivoted. A mainspring has opposite ends connected to the first reel and the second reel. A stop device has a pressing portion to press the mainspring when the mainspring is wound on the second reel. Therefore, the pressing portion of the stop device will touch the mainspring when the mainspring is wound on the second reel and give the mainspring a resistance to offset the recovery force of the mainspring.

Abstract: A cord fixer for venetian blind includes a headrail, a bottomrail, a plurality of slats, and a plurality of lift cords extending from the headrail to the slats and terminating at bottomrail. At least one cord fixer applied for receipt of the lift cords and thusly, securing the lift cords within the corresponding bottomrail. The cord fixer has an upper surface facing to the slat and a bottom surface facing to the bottomrail, at least one fitting member being positioned on the bottom surface allowing the lift cords to wrap around. And a fitting groove is constructed at the end of the fitting member for receipt of the lift cords. Conveniently, one can flexibly adjust the position of the corresponding rails and lift cord length in accordance to the actual blind size by means of lift cords and fitting members. Without engaging a knot-making process during the blind assembly, the present invention has proven to further reduce overall cost of the manufacturing and assembling process of venetian blinds.

Abstract: A profile control system for controlling a profile of a polishing pad, adapted in a chemical mechanical polishing (CMP) apparatus comprises: a polishing pad, a polishing table, a polishing head, and a conditioner, wherein the polishing pad has a transparent region. The control system includes at least one illuminant, a detector and a processor. The illuminant is in the polishing table and corresponds to the transparent region of the polishing pad. The detector is over the polishing pad to detect the light from the illuminant passing through the transparent region of the polishing pad. The processor is adapted to determine the thickness of the polishing pad according to the light detected by the detector and transmits a processing signal to the conditioner for adjusting processing recipes of the conditioner. Therefore, it is possible to obtain a polishing pad of a desired profile and the variations of the uniformity of the wafers can be reduced.