Patents by Inventor Chia-Ching Wang
Chia-Ching Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250149392Abstract: A package substrate includes a core layer, at least one functional component, at least one spacer, a filler, a first and a second build-up structures. The core layer has at least one opening and multiple conductive through vias. The functional component is disposed in the openings. The spacer is disposed on the functional component. The filler is filled in the opening, covering the functional component and spacer, and completely filling the gap between the opening, the functional component and the spacer. The first build-up structure is disposed on a first surface of the core layer and a third surface of the filler, and electrically connected to the functional component and the conductive through vias. The second build-up structure is disposed on a second surface of the core layer and a fourth surface of the filler, contacts the spacer and electrically connected to the conductive through vias.Type: ApplicationFiled: December 26, 2023Publication date: May 8, 2025Applicant: Unimicron Technology Corp.Inventors: Chia Ching Wang, Chien-Chou Chen, Hsuan Ming Hsu, Ho-Shing Lee, Yunn-Tzu Yu, Yao Yu Chiang, Po-Wei Chen, Wei-Ti Lin, Wen Chi Chang
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Publication number: 20240114632Abstract: A circuit board structure is provided. The circuit board structure includes a via hole, a conductive layer, and an alternate stacking of a plurality of circuit layers and a plurality of insulating layers. The via hole penetrates through the plurality of circuit layers and the plurality of insulating layers. The lateral ends of the plurality of insulating layers form the sidewall of the via hole. The conductive layer is conformally disposed within the via hole. The conductive layer exposes the first region of the sidewall and covers the second region of the sidewall. The sidewall extends in the longitudinal direction of the via hole and has no misalignments in the radial direction.Type: ApplicationFiled: December 7, 2022Publication date: April 4, 2024Applicant: UNIMICRON TECHNOLOGY CORP.Inventors: Ming-Hao WU, Chia-Ching WANG
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Publication number: 20180375737Abstract: A sensor estimation server and a sensor estimation method thereof are provided. The sensor estimation server receives first sensor values of deploying sensors to each of servers from the servers, and receives added sensor values of deploying added sensor to each of the servers from the servers. The sensor estimation server calculates correlations between the added sensor and the sensors based on the added sensor values and the first sensor values, and selects target sensors accordingly. The sensor estimation server calculates estimation parameters according to the added sensor values and target sensor values of deploying the target sensors to each of servers. The sensor estimation server receives second sensor values of deploying the target sensors to under-test servers from the under-test servers, and calculates a sensor estimation value based on the estimation parameters and the second sensor values.Type: ApplicationFiled: July 7, 2017Publication date: December 27, 2018Inventor: Chia-Ching WANG
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Patent number: 9270953Abstract: An image capture unit includes an image sensor and a lens structure disposed proximate to the image sensor to focus an image onto the image sensor. A movable color filter grouping is disposed over the lens structure. The movable color filter grouping includes a plurality of N color filters arranged therein such that all light that is incident upon the image sensor through the lens structure is directed through only one of the plurality of N color filters of the movable color filter grouping per each exposure of the image sensor. A positioning device is attached to the movable color filter grouping to reposition the movable color filter grouping such that substantially all of the light that is incident upon the image sensor through the lens structure is directed through a different one of the plurality of N color filters for each successive exposure of the image sensor.Type: GrantFiled: May 16, 2014Date of Patent: February 23, 2016Assignee: OmniVision Technologies, Inc.Inventors: Chia-Ching Wang, Jau-Jan Deng, Yun-Chiang Hsu
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Publication number: 20150334357Abstract: An image capture unit includes an image sensor and a lens structure disposed proximate to the image sensor to focus an image onto the image sensor. A movable color filter grouping is disposed over the lens structure. The movable color filter grouping includes a plurality of N color filters arranged therein such that all light that is incident upon the image sensor through the lens structure is directed through only one of the plurality of N color filters of the movable color filter grouping per each exposure of the image sensor. A positioning device is attached to the movable color filter grouping to reposition the movable color filter grouping such that substantially all of the light that is incident upon the image sensor through the lens structure is directed through a different one of the plurality of N color filters for each successive exposure of the image sensor.Type: ApplicationFiled: May 16, 2014Publication date: November 19, 2015Applicant: OMNIVISION TECHNOLOGIES, INC.Inventors: Chia-Ching Wang, Jau-Jan Deng, Yun-Chiang Hsu
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Patent number: 8988566Abstract: An apparatus includes an image sensor including N image sensor regions arranged thereon. N lens structures are included in a lens array disposed proximate to the image sensor. Each one of the N lens structures is arranged to focus a single image onto a respective one of the N image sensor regions. The N lens structures include a first lens structure having a red color filter, a second lens structure having a green color filter, and a third lens structure having a blue color filter. Each one of the N lens structures includes a glass wafer and a lens formed on the glass wafer. Each one of the red color filter, the green color filter, and the blue color filter is one of coated on the glass wafer underneath the lens and coated over the lens on the glass wafer.Type: GrantFiled: August 9, 2012Date of Patent: March 24, 2015Assignee: OmniVision Technologies, Inc.Inventors: Chia-Ching Wang, Jau-Jan Deng, Yun-Chiang Hsu
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Publication number: 20140043507Abstract: An apparatus includes an image sensor including N image sensor regions arranged thereon. N lens structures are included in a lens array disposed proximate to the image sensor. Each one of the N lens structures is arranged to focus a single image onto a respective one of the N image sensor regions. The N lens structures include a first lens structure having a red color filter, a second lens structure having a green color filter, and a third lens structure having a blue color filter. Each one of the N lens structures includes a glass wafer and a lens formed on the glass wafer. Each one of the red color filter, the green color filter, and the blue color filter is one of coated on the glass wafer underneath the lens and coated over the lens on the glass wafer.Type: ApplicationFiled: August 9, 2012Publication date: February 13, 2014Applicant: OMNIVISION TECHNOLOGIES, INC.Inventors: Chia-Ching Wang, Jau-Jan Deng, Yun-Chiang Hsu
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Publication number: 20110155242Abstract: A fluorescent material of Formula (I) is provided. In Formula (I), all the variables thereof are described in the specification. The invention also provides a solar cell with the disclosed fluorescent material. The solar cell with the fluorescent material includes a solar cell and a fluorescent layer including the disclosed fluorescent material of Formula (I) coating on the solar cell.Type: ApplicationFiled: April 3, 2010Publication date: June 30, 2011Applicants: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE, NEO SOLAR POWER CORPInventors: Ching-Yen Wei, Yi-Ling Chen, Wei-Jen Liu, Yi-Chen Chiu, Yang-Fang Chen, Kao-Chiang Hsu, Yu-Wei Tai, Chia-Ching Wang, Meng-Hsiu Wu