Abstract: An electronic package is provided, in which an electronic component with a conductive layer on an outer surface thereof is embedded in an encapsulant, where at least one electrode pad is disposed on an active surface of the electronic component, and at least one wire electrically connected to the electrode pad is arranged inside the electronic component, so that the conductive layer is electrically connected to the wire, such that the electrode pad, the wire and the conductive layer are used as a power transmission structure which serves as a current path to reduce DC resistance and improve an impedance issue associated with the supply of power.

Abstract: In an example embodiment, the controller is designed with a single current sensing circuit that is able to measure the current on multiple LED channels, eliminating the need for each LED channel to have its own current sensing circuit. The current sensing circuit may further be utilized with a control unit, which has an LED control model selection multiplexor (MUX) that switches between real-time closed-loop control and open-loop control.

Abstract: An integrated circuit (IC) applicable to performing system protection through dynamic voltage change may include a monitoring circuit, at least one power voltage generation circuit and a voltage adjustment circuit. The monitoring circuit monitors at least one security checking result of a security engine to determine whether at least one security event occurs. The at least one power voltage generation circuit generates at least one internal power voltage within the IC according to at least one input voltage received from outside of the IC, to provide the internal power voltage to at least one internal component of the IC. In response to occurrence of the at least one security event, the voltage adjustment circuit controls the at least one power voltage generation circuit to dynamically adjust the at least one internal power voltage, to control the internal power voltage randomly exceed predetermined voltage range thereof, thereby performing the system protection.

Abstract: A charging device and a safety function control circuit and method thereof are provided. When a charging device is not connected to a load, a converted voltage value of a power connection terminal of the charging device is kept to be lower than a safe voltage value so as to maintain a safe mode. The safety function control circuit includes a first control module and a second control module for constant voltage control. The first control module and the second control module perform matching control on a power conversion circuit of the charging device, and in case of a single fault of one of the control modules, the other module is still capable of keeping the converted voltage value to be less than the safe voltage value. Thus, it is ensured that the safe mode stays functional in case of a concurrency of both a single hardware fault and a single firmware fault.

Abstract: A carrier structure is provided, in which a ground layer is formed on a dielectric body, a circuit layer is formed in the dielectric body, and a conductive via is formed in the dielectric body and electrically connected to the circuit layer and the ground layer, where the ground layer has at least one first groove that exposes a surface of the dielectric body, so that the noise of the circuit layer is easy to spread out of the dielectric body, so as to prevent the problem of crosstalk from occurring in the circuit layer.

Abstract: An electronic package and a manufacturing method thereof are provided, in which an electronic element is disposed on a carrier structure with a circuit layer, a first encapsulating layer and a second encapsulating layer are formed on the carrier structure to cover the electronic element, a first antenna layer is formed on the first encapsulating layer, and a second antenna layer communicatively connected to the first antenna layer is formed on the second encapsulating layer. Therefore, the thickness of the first encapsulating layer is used to control the resonance distance of the antenna frequency so as to generate better resonance effect, and the distance between the first antenna layer and the second antenna layer is controlled by the thickness of the second encapsulating layer to increase the bandwidth of the antenna.

Abstract: An electronic package is provided, in which an electronic component with a conductive layer on an outer surface thereof is embedded in an encapsulant, where at least one electrode pad is disposed on an active surface of the electronic component, and at least one wire electrically connected to the electrode pad is arranged inside the electronic component, so that the conductive layer is electrically connected to the wire, such that the electrode pad, the wire and the conductive layer are used as a power transmission structure which serves as a current path to reduce DC resistance and improve an impedance issue associated with the supply of power.

Abstract: A feature inspection lighting system includes an outer cover having a mounting structure at a first end thereof and defining an outer periphery at a second end thereof. The cover includes an inner surface between the first end and the second end. The inner surface has raised surfaces defined thereon. A plurality of light sources is coupled to the raised surfaces of the inner surface of the cover, and cables to provide electrical power to the light sources is routed between the raised surfaces of the outer cover. The outer periphery of the cover may have a cutout defined therein through which all or part of an object to be inspected can pass.

Abstract: An antenna module is provided with a plurality of antenna structures and a shielding structure arranged on a plate body, and the shielding structure is located between two adjacent antenna structures, where the shielding structure includes a concave portion formed on the plate body and a dielectric material formed between the concave portion and the antenna structure to generate different impedance characteristics, thereby improving the antenna isolation.

Abstract: A method includes steps of: based on training sets of gastrointestinal images, using a predetermined machine learning algorithm to obtain a preliminary model; feeding preliminary validation sets of gastrointestinal images into the preliminary model to obtain estimation results; based on the estimation results, selecting, from the preliminary validation sets of gastrointestinal images, a series of successive images as a selected validation set of gastrointestinal images; based on the selected validation set of gastrointestinal images, tuning parameters of the preliminary model to result in a speed-determining model for determining a moving speed of an endoscope camera.

Abstract: A driving circuit is provided, including first to second output stage circuits that output, respectively, first and second voltages of a first polarity. The driving circuit further includes a first switch having a first terminal receiving the first voltage from the first output stage circuit and a second terminal coupled to a first output channel through a switching circuit, and a second switch having a first terminal receiving the second voltage from the second output stage circuit and a second terminal coupled to a second output channel through the switching circuit. The driving circuit further includes a first charge sharing circuit having a first terminal coupled to the first output channel and a second terminal coupled to the second output channel. The first charge sharing circuit is turned on to provide charge sharing between the first output channel and the second output channel.

Abstract: Embodiments predict genomic testing using machine learning. Embodiments receive one or more training datasets of a genomic pipeline comprising a plurality of training variables for each of a plurality of genomic tests and corresponding results of each of the genomic tests. Embodiments train a machine learning model using the training datasets and receive a new genomic workflow pipeline comprising new genomic testing variables. Embodiments then predict, using the trained machine learning model and new genomic testing variables, whether the new genomic workflow pipeline will be successfully completed within a first compute environment.

Abstract: An electronic module is provided, in which a first metal layer, an insulating layer and a second metal layer are sequentially formed on side faces and a non-active face of an electronic component to serve as a capacitor structure, where the capacitor structure is exposed from an active face of the electronic component so that by directly forming the capacitor structure on the electronic component, a distance between the capacitor structure and the electronic component is minimized, such that the effect of suppressing impedance can be optimized.

Abstract: An electronic package is provided, in which an electronic component with a conductive layer on an outer surface thereof is embedded in an encapsulant, where at least one electrode pad is disposed on an active surface of the electronic component, and at least one wire electrically connected to the electrode pad is arranged inside the electronic component, so that the conductive layer is electrically connected to the wire, such that the electrode pad, the wire and the conductive layer are used as a power transmission structure which serves as a current path to reduce DC resistance and improve an impedance issue associated with the supply of power.

Abstract: A virtual image display system includes a virtual image display device and a hand-held control device. The virtual image display device is coupled to the hand-held control device. The hand-held control device is configured to capture image information of the virtual image display device and analyze the image information to obtain relative angle information between the virtual image display device and the hand-held control device. The virtual image display device adjusts a pointing direction of a displayed virtual hand-held control device image according to the relative angle information.

Abstract: A circuit board and a layout method thereof are provided. The circuit board includes a first metal layer, a second metal layer, and a third metal layer. The first metal layer forms multiple first reference conductive wires. The second metal layer forms at least one signal transmission wire. The third metal layer forms multiple third reference conductive wires. The first metal layer, the second metal layer, and a third metal layer are overlapped with each other, and each of the first reference conductive wires is not completely overlapped with each of the second reference conductive wires.

Abstract: An electronic package and a manufacturing method thereof are provided, in which a magnetically permeable member and a plurality of supporting members having conductive through vias are disposed on a carrier structure having a circuit layer, the magnetically permeable member is located between two supporting members, and a conductive member is disposed on the supporting members to cover the magnetically permeable member, so that the circuit layer, the conductive through vias and the conductive member form a coil surrounding the magnetically permeable member to increase the inductance.

Abstract: An electronic package is provided, in which an electronic component with a conductive layer on an outer surface thereof is embedded in an encapsulant, where at least one electrode pad is disposed on an active surface of the electronic component, and at least one wire electrically connected to the electrode pad is arranged inside the electronic component, so that the conductive layer is electrically connected to the wire, such that the electrode pad, the wire and the conductive layer are used as a power transmission structure which serves as a current path to reduce DC resistance and improve an impedance issue associated with the supply of power.

Abstract: An electronic package is provided, in which an electronic component with a conductive layer on an outer surface thereof is embedded in an encapsulant, where at least one electrode pad is disposed on an active surface of the electronic component, and at least one wire electrically connected to the electrode pad is arranged inside the electronic component, so that the conductive layer is electrically connected to the wire, such that the electrode pad, the wire and the conductive layer are used as a power transmission structure which serves as a current path to reduce DC resistance and improve an impedance issue associated with the supply of power.

Abstract: An antenna module is provided with a plurality of antenna structures and a shielding structure arranged on a plate body, and the shielding structure is located between two adjacent antenna structures, where the shielding structure includes a concave portion formed on the plate body and a dielectric material formed between the concave portion and the antenna structure to generate different impedance characteristics, thereby improving the antenna isolation.