Patents by Inventor Chia-Chu Lai
Chia-Chu Lai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10840965Abstract: A testing system includes: a bilinear polarized antenna for receiving and dividing a circularly polarized radio wave associating with a horizontal and a vertical polarization path of an object-to-be-tested into a first and a second high frequency signal; a phase retarder for delaying a phase of the first high frequency signal by 90 degrees to form a first high frequency signal with a phase delay of 90 degrees; a power splitter for receiving or synthesizing the first high frequency signal with the phase delay of 90 degrees and the second high frequency signal; and a high frequency signal transceiver for measuring power of the first high frequency signal with the phase delay of 90 degrees and the second high frequency signal and determining states of the horizontal and vertical polarization paths of the object-to-be-tested based on the power. Therefore, the testing system can speed up testing of the object-to-be-tested.Type: GrantFiled: April 8, 2020Date of Patent: November 17, 2020Assignee: Siliconware Precision Industries Co., Ltd.Inventors: Bo-Siang Fang, Kuan-Ta Chen, Ying-Wei Lu, Chia-Chu Lai, Cheng-Tsai Hsieh
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Publication number: 20200304165Abstract: A testing system includes: a bilinear polarized antenna for receiving and dividing a circularly polarized radio wave associating with a horizontal and a vertical polarization path of an object-to-be-tested into a first and a second high frequency signal; a phase retarder for delaying a phase of the first high frequency signal by 90 degrees to form a first high frequency signal with a phase delay of 90 degrees; a power splitter for receiving or synthesizing the first high frequency signal with the phase delay of 90 degrees and the second high frequency signal; and a high frequency signal transceiver for measuring power of the first high frequency signal with the phase delay of 90 degrees and the second high frequency signal and determining states of the horizontal and vertical polarization paths of the object-to-be-tested based on the power. Therefore, the testing system can speed up testing of the object-to-be-tested.Type: ApplicationFiled: April 8, 2020Publication date: September 24, 2020Inventors: Bo-Siang Fang, Kuan-Ta Chen, Ying-Wei Lu, Chia-Chu Lai, Cheng-Tsai Hsieh
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Patent number: 10659097Abstract: A testing system includes: a bilinear polarized antenna for receiving and dividing a circularly polarized radio wave associating with a horizontal and a vertical polarization path of an object-to-be-tested into a first and a second high frequency signal; a phase retarder for delaying a phase of the first high frequency signal by 90 degrees to form a first high frequency signal with a phase delay of 90 degrees; a power splitter for receiving or synthesizing the first high frequency signal with the phase delay of 90 degrees and the second high frequency signal; and a high frequency signal transceiver for measuring power of the first high frequency signal with the phase delay of 90 degrees and the second high frequency signal and determining states of the horizontal and vertical polarization paths of the object-to-be-tested based on the power. Therefore, the testing system can speed up testing of the object-to-be-tested.Type: GrantFiled: August 7, 2019Date of Patent: May 19, 2020Inventors: Bo-Siang Fang, Kuan-Ta Chen, Ying-Wei Lu, Chia-Chu Lai, Cheng-Tsai Hsieh
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Publication number: 20200052393Abstract: An electronic package is provided with a first substrate having a first antenna portion that is stacked on a second substrate having a second antenna portion via an antenna component. During a packaging process, a gap between the first substrate and the second substrate is held constantly by the antenna component. At the same time, the antenna component is regarded as a third antenna portion of the electronic package. The performance of the antennae is not adversely affected by the antenna component despite the fact that the antenna component is in close proximity to the first and second antenna portions.Type: ApplicationFiled: December 26, 2018Publication date: February 13, 2020Inventors: Bo-Siang Fang, Kuan-Ta Chen, Chia-Chu Lai
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Publication number: 20190319347Abstract: An electronic package includes: a carrier structure; a first electronic component disposed on the carrier structure; a first insulating layer formed on the carrier structure; a first antenna structure coupled to the first insulating layer and electrically connected to the first electronic component; and a second antenna structure embedded in the carrier structure. As such, the electronic package provides more antenna functions within a limited space so as to improve the signal quality and transmission rate of electronic products. An electronic device having the electronic package is also provided. The electronic device is applicable to an electronic product having an antenna function.Type: ApplicationFiled: July 24, 2018Publication date: October 17, 2019Inventors: Bo-Siang Fang, Kuan-Ta Chen, Chia-Chu Lai, Ying-Wei Lu
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Publication number: 20170271251Abstract: A semiconductor substrate is disclosed. The semiconductor substrate includes a substrate body having at least an opening formed on a surface thereof, wherein the surface of the substrate body and a wall of the opening are made of an insulating material; and a circuit layer formed on the surface of the substrate body, wherein the circuit layer covers an end of the opening and is electrically insulated from the opening. The opening facilitates to increase the thickness of the insulating structure between the circuit layer and the substrate body of a silicon material to prevent signal degradation when high frequency signals are applied to the circuit layer.Type: ApplicationFiled: June 2, 2017Publication date: September 21, 2017Inventors: Bo-Shiang Fang, Ho-Chuan Lin, Chia-Chu Lai, Min-Han Chuang, Li-Fang Lin
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Patent number: 9698090Abstract: A semiconductor substrate is disclosed. The semiconductor substrate includes a substrate body having at least an opening formed on a surface thereof, wherein the surface of the substrate body and a wall of the opening are made of an insulating material; and a circuit layer formed on the surface of the substrate body, wherein the circuit layer covers an end of the opening and is electrically insulated from the opening. The opening facilitates to increase the thickness of the insulating structure between the circuit layer and the substrate body of a silicon material to prevent signal degradation when high frequency signals are applied to the circuit layer.Type: GrantFiled: January 30, 2013Date of Patent: July 4, 2017Assignee: Siliconware Precision Industries Co., Ltd.Inventors: Bo-Shiang Fang, Ho-Chuan Lin, Chia-Chu Lai, Min-Han Chuang, Li-Fang Lin
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Patent number: 9503043Abstract: A duplexer is provided, which includes a first, a second and a third signal ports; a first filter and a second filter. The first filter has first, second, and third resonant circuits that have first, second and third inductors, respectively. The first, second and third inductors are mutually inductive. The first and third resonant circuits are electrically connected to the first and second signal ports, respectively. The second filter has fourth, fifth and sixth resonant circuits that have fourth, fifth and sixth inductors, respectively. The fourth resonant circuit is connected in series with the first resonant circuit. The fifth inductor and the fourth inductor are mutually inductive. The sixth resonant circuit is electrically connected to the third signal port. The second filter further has a main capacitor connected in series with the fifth and sixth resonant circuits respectively and located therebetween.Type: GrantFiled: May 2, 2013Date of Patent: November 22, 2016Assignee: Siliconware Precision Industries Co., Ltd.Inventors: Min-Han Chuang, Chia-Chu Lai, Bo-Shiang Fang, Ho-Chuan Lin, Yen-Yu Chen
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Patent number: 9281557Abstract: A multi bandwidth balun is provided, including a main signal port, a main inductor electrically connected to the main signal port, a first inductor inducted mutually with the main inductor to constitute a first inductor of a first conversion circuit, a first capacitor module connected in parallel to the first conversion circuit, two first signal ports electrically connected to the first capacitor module, a first main capacitor electrically connected to the first signal port and the first capacitor module therebetween, a second inductor inducted mutually with the main inductor to constitute a second inductor of a second conversion circuit, a second capacitor module connected in parallel to the second conversion circuit, two second signal ports electrically connected to the second capacitor module, and a second main capacitor electrically connected to the second signal port and the second capacitor module therebetween.Type: GrantFiled: November 26, 2013Date of Patent: March 8, 2016Assignee: Siliconware Precision Industries Co., Ltd.Inventors: Chia-Chu Lai, Min-Han Chuang, Bo-Shiang Fang, Ho-Chuan Lin, Li-Fang Lin
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Patent number: 9196941Abstract: A cross-coupled bandpass filter includes first, second, third and fourth resonators such that magnetic couplings are generated between the first and second resonators, between the third and fourth resonators and between the first and fourth resonators, a capacitive coupling is generated between the second and third resonators, and the magnetic coupling between the first and fourth resonators has a polarity opposite to that of the capacitive coupling between the second and third resonators, thereby generating two transmission zeros in a transmission rejection band.Type: GrantFiled: March 30, 2012Date of Patent: November 24, 2015Assignee: Siliconware Precision Industries Co., Ltd.Inventors: Min-Han Chuang, Chia-Chu Lai, Bo-Shiang Fang, Ho-Chuan Lin, Sung-Chun Wu
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Patent number: 9148113Abstract: A balanced-to-unbalanced converter (balun) is provided, including: a converting circuit having a first processing circuit including a first inductor and a first capacitor connected in series, a second processing circuit including a second capacitor and a second inductor connected in series, the second capacitor being electrically connected to the first inductor, and two balanced output ends connected to the first processing circuit and the second processing circuit, respectively; and a preprocessing circuit connected to the converting circuit and including an unbalanced input end for converting real impedance at the unbalanced input end into complex impedance at the balanced output ends. Accordingly, the balun satisfies the need of the wireless communication chips by providing differential signals with complex impedance.Type: GrantFiled: October 4, 2012Date of Patent: September 29, 2015Assignee: Siliconware Precision Industries Co., Ltd.Inventors: Ming-Fan Tsai, Hsin-Hung Lee, Chia-Chu Lai, Yen-Yu Chen, Ho-Chuan Lin
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Publication number: 20150188510Abstract: A circuit structure is provided, which includes: a first circuit portion having at least a capacitor; a first dielectric portion combined with the first circuit portion; a second circuit portion electrically connected to the first circuit portion and having at least an inductor; and a second dielectric portion combined with the second circuit portion, wherein the first dielectric portion has a greater dielectric constant than the second dielectric portion, thereby increasing the capacitance value and density and causing the inductor to have a high enough Q value.Type: ApplicationFiled: March 14, 2014Publication date: July 2, 2015Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTDInventors: Ho-Chuan Lin, Chia-Chu Lai, Min-Han Chuang, Li-Fang Lin, Ming-Fan Tsai
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Patent number: 9054670Abstract: A cross-coupled bandpass filter includes first, second and third resonators such that a positive mutual inductance is generated between the first and third resonators and mutual inductance generated between the first and second resonators and mutual inductance generated between the second and third resonators have the same polarity, thereby generating a transmission zero in a high frequency rejection band.Type: GrantFiled: August 17, 2012Date of Patent: June 9, 2015Assignee: Siliconware Precision Industries Co., Ltd.Inventors: Min-Han Chuang, Chia-Chu Lai, Bo-Shiang Fang, Ho-Chuan Lin, Li-Fang Lin
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Publication number: 20140320374Abstract: A multi bandwidth balun is provided, including a main signal port, a main inductor electrically connected to the main signal port, a first inductor inducted mutually with the main inductor to constitute a first inductor of a first conversion circuit, a first capacitor module connected in parallel to the first conversion circuit, two first signal ports electrically connected to the first capacitor module, a first main capacitor electrically connected to the first signal port and the first capacitor module therebetween, a second inductor inducted mutually with the main inductor to constitute a second inductor of a second conversion circuit, a second capacitor module connected in parallel to the second conversion circuit, two second signal ports electrically connected to the second capacitor module, and a second main capacitor electrically connected to the second signal port and the second capacitor module therebetween.Type: ApplicationFiled: November 26, 2013Publication date: October 30, 2014Applicant: Siliconware Precision Industries Co., LtdInventors: Chia-Chu Lai, Min-Han Chuang, Bo-Shiang Fang, Ho-Chuan Lin, Li-Fang Lin
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Publication number: 20140204806Abstract: A duplexer is provided, which includes a first, a second and a third signal ports; a first filter and a second filter. The first filter has first, second, and third resonant circuits that have first, second and third inductors, respectively. The first, second and third inductors are mutually inductive. The first and third resonant circuits are electrically connected to the first and second signal ports, respectively. The second filter has fourth, fifth and sixth resonant circuits that have fourth, fifth and sixth inductors, respectively. The fourth resonant circuit is connected in series with the first resonant circuit. The fifth inductor and the fourth inductor are mutually inductive. The sixth resonant circuit is electrically connected to the third signal port. The second filter further has a main capacitor connected in series with the fifth and sixth resonant circuits respectively and located therebetween.Type: ApplicationFiled: May 2, 2013Publication date: July 24, 2014Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.Inventors: Min-Han Chuang, Chia-Chu Lai, Bo-Shiang Fang, Ho-Chuan Lin, Yen-Yu Chen
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Publication number: 20140184261Abstract: A testing method is provided, including providing a testing apparatus including a carrier member and a testing element, the carrier member comprising a first surface, a second surface opposing the first surface, and an elastic conductive area defined on the first surface; disposing an object-to-be-tested on the elastic conductive area; electrically connecting the testing element to the object-to-be-tested and the carrier member, to form an electric loop among the carrier member, the object-to-be-tested and the testing element. Through the design of the elastic conductive area, the object-to-be-tested can be secured with a small pressure applied thereto, and is prevented from being cracked.Type: ApplicationFiled: October 17, 2013Publication date: July 3, 2014Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.Inventors: Chia-Chu Lai, Ming-Fan Tsai, Ho-Chuan Lin, Min-Han Chuang, Bo-Shiang Fang
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Publication number: 20140124950Abstract: A semiconductor substrate is disclosed. The semiconductor substrate includes a substrate body having at least an opening formed on a surface thereof, wherein the surface of the substrate body and a wall of the opening are made of an insulating material; and a circuit layer formed on the surface of the substrate body, wherein the circuit layer covers an end of the opening and is electrically insulated from the opening. The opening facilitates to increase the thickness of the insulating structure between the circuit layer and the substrate body of a silicon material to prevent signal degradation when high frequency signals are applied to the circuit layer.Type: ApplicationFiled: January 30, 2013Publication date: May 8, 2014Applicant: Siliconware Precision Industries Co., Ltd.Inventors: Bo-Shiang Fang, Ho-Chuan Lin, Chia-Chu Lai, Min-Han Chuang, Li-Fang Lin
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Publication number: 20140015621Abstract: A balanced-to-unbalanced converter (balun) is provided, including: a converting circuit having a first processing circuit including a first inductor and a first capacitor connected in series, a second processing circuit including a second capacitor and a second inductor connected in series, the second capacitor being electrically connected to the first inductor, and two balanced output ends connected to the first processing circuit and the second processing circuit, respectively; and a preprocessing circuit connected to the converting circuit and including an unbalanced input end for converting real impedance at the unbalanced input end into complex impedance at the balanced output ends. Accordingly, the balun satisfies the need of the wireless communication chips by providing differential signals with complex impedance.Type: ApplicationFiled: October 4, 2012Publication date: January 16, 2014Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.Inventors: Ming-Fan Tsai, Hsin-Hung Lee, Chia-Chu Lai, Yen-Yu Chen, Ho-Chuan Lin
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Publication number: 20130154765Abstract: A cross-coupled bandpass filter includes first, second, third and fourth resonators such that magnetic couplings are generated between the first and second resonators, between the third and fourth resonators and between the first and fourth resonators, a capacitive coupling is generated between the second and third resonators, and the magnetic coupling between the first and fourth resonators has a polarity opposite to that of the capacitive coupling between the second and third resonators, thereby generating two transmission zeros in a transmission rejection band.Type: ApplicationFiled: March 30, 2012Publication date: June 20, 2013Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.Inventors: Min-Han Chuang, Chia-Chu Lai, Bo-Shiang Fang, Ho-Chuan Lin, Sung-Chun Wu
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Publication number: 20130141187Abstract: A cross-coupled bandpass filter includes first, second and third resonators such that a positive mutual inductance is generated between the first and third resonators and mutual inductance generated between the first and second resonators and mutual inductance generated between the second and third resonators have the same polarity, thereby generating a transmission zero in a high frequency rejection band.Type: ApplicationFiled: August 17, 2012Publication date: June 6, 2013Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.Inventors: Min-Han Chuang, Chia-Chu Lai, Bo-Shiang Fang, Ho-Chuan Lin, Li-Fang Lin