Abstract: A plasma display device comprises a plasma display panel, at least one driver IC package, a rear plate, a front frame, a heat-dissipated plate and a metal rear cover. The driver IC package is electrically connected with the plasma display panel. The front frame has a main body and a first protrusion extending backwards, and the driver IC package is disposed behind the main body and on the first protrusion. The rear plate is disposed behind the plasma display panel and is brought into contact with the driver IC package by virtue of a second protrusion of the rear plate. The heat-dissipated plate is disposed on the first protrusion and is brought into contact with the driver IC package. The metal rear cover is assembled to the front frame, and the heat-dissipated plate is brought into contact with the metal rear cover. In addition, the heat generated by the driver IC packages can be conducted to the metal rear cover, thereby reducing the working temperature of the driver chip package.

Abstract: A back plate structure comprises a back plate body, at least a supporting beam and a plurality of heat dissipation members, wherein the supporting beam is fixed on a back of the back plate body and the heat dissipation members are disposed on the supporting beam. The supporting beam has a central protrusion portion and a peripheral portion. The heat dissipation members are disposed on an upper surface of the peripheral portion or on a sidewall of the central protrusion portion or into an inner portion of the central protrusion portion. Because the heat dissipation members are disposed on the supporting beam, the heat dissipation area of the present invention can be increased and therefore the heat dissipation efficiency of the plasma display apparatus can be effectively promoted. Therefore, the service life of the plasma display apparatus can be increased and also the display performance thereof can be enhanced.

Abstract: A plasma display device comprises a plasma display panel, at least one driver IC package, a rear plate, a front frame, a heat-dissipated plate and a metal rear cover. The driver IC package is electrically connected with the plasma display panel. The front frame has a main body and a first protrusion extending backwards, and the driver IC package is disposed behind the main body and on the first protrusion. The rear plate is disposed behind the plasma display panel and is brought into contact with the driver IC package by virtue of a second protrusion of the rear plate. The heat-dissipated plate is disposed on the first protrusion and is brought into contact with the driver IC package. The metal rear cover is assembled to the front frame, and the heat-dissipated plate is brought into contact with the metal rear cover. In addition, the heat generated by the driver IC packages can be conducted to the metal rear cover, thereby reducing the working temperature of the driver chip package.

Abstract: A back plate structure comprises a back plate body, at least a supporting beam and a plurality of heat dissipation members, wherein the supporting beam is fixed on a back of the back plate body and the heat dissipation members are disposed on the supporting beam. The supporting beam has a central protrusion portion and a peripheral portion. The heat dissipation members are disposed on an upper surface of the peripheral portion or on a sidewall of the central protrusion portion or into an inner portion of the central protrusion portion. Because the heat dissipation members are disposed on the supporting beam, the heat dissipation area of the present invention can be increased and therefore the heat dissipation efficiency of the plasma display apparatus can be effectively promoted. Therefore, the service life of the plasma display apparatus can be increased and also the display performance thereof can be enhanced.