Patents by Inventor Chia Chuan Chen
Chia Chuan Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240162094Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a substrate, a conductive feature on the substrate, and an electrical connection structure on the conductive feature. The electrical connection includes a first grain made of a first metal material, and a first inhibition layer made of a second metal layer that is different than the first metal material. The first inhibition layer extends vertically along a first side of a grain boundary of the first grain and laterally along a bottom of the grain boundary of the first grain.Type: ApplicationFiled: January 5, 2024Publication date: May 16, 2024Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Shih-Chuan CHIU, Jia-Chuan YOU, Chia-Hao CHANG, Chun-Yuan CHEN, Tien-Lu LIN, Yu-Ming LIN, Chih-Hao WANG
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Publication number: 20240155185Abstract: A channel hiatus correction method for an HDMI device is provided. A recovery code from scrambled data of the stream is obtained. A liner feedback shift register (LFSR) value of channels of the HDMI port is obtained based on the recovery code and the scrambled data of the stream. The stream is de-scrambled according to the LFSR value of the channels of the HDMI port. Video data is displayed according to the de-scrambled stream.Type: ApplicationFiled: November 9, 2022Publication date: May 9, 2024Inventors: Chia-Hao CHANG, You-Tsai JENG, Kai-Wen YEH, Yi-Cheng CHEN, Te-Chuan WANG, Kai-Wen CHENG, Chin-Lung LIN, Tai-Lai TUNG, Ko-Yin LAI
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Patent number: 11962847Abstract: A channel hiatus correction method for an HDMI device is provided. A recovery code from scrambled data of the stream is obtained. A liner feedback shift register (LFSR) value of channels of the HDMI port is obtained based on the recovery code and the scrambled data of the stream. The stream is de-scrambled according to the LFSR value of the channels of the HDMI port. Video data is displayed according to the de-scrambled stream.Type: GrantFiled: November 9, 2022Date of Patent: April 16, 2024Assignee: MEDIATEK INC.Inventors: Chia-Hao Chang, You-Tsai Jeng, Kai-Wen Yeh, Yi-Cheng Chen, Te-Chuan Wang, Kai-Wen Cheng, Chin-Lung Lin, Tai-Lai Tung, Ko-Yin Lai
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Patent number: 11956897Abstract: A semiconductor package device includes a first dielectric layer, a first interconnection layer, a second interconnection layer, and a second dielectric layer. The first dielectric layer has a first surface, a second surface opposite to the first surface and a lateral surface extending between the first surface and the second surface. The first interconnection layer is within the first dielectric layer. The second interconnection layer is on the second surface of the first dielectric layer and extends from the second surface of the first dielectric layer into the first dielectric layer to electrically connect to the first interconnection layer. The second dielectric layer covers the second surface and the lateral surface of the first dielectric layer and the second interconnection layer.Type: GrantFiled: July 25, 2022Date of Patent: April 9, 2024Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Ming-Ze Lin, Chia Ching Chen, Yi Chuan Ding
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Patent number: 11955515Abstract: A semiconductor device with dual side source/drain (S/D) contact structures and a method of fabricating the same are disclosed. The method includes forming a fin structure on a substrate, forming a superlattice structure on the fin structure, forming first and second S/D regions within the superlattice structure, forming a gate structure between the first and second S/D regions, forming first and second contact structures on first surfaces of the first and second S/D regions, and forming a third contact structure, on a second surface of the first S/D region, with a work function metal (WFM) silicide layer and a dual metal liner. The second surface is opposite to the first surface of the first S/D region and the WFM silicide layer has a work function value closer to a conduction band energy than a valence band energy of a material of the first S/D region.Type: GrantFiled: July 28, 2022Date of Patent: April 9, 2024Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Shih-Chuan Chiu, Chia-Hao Chang, Cheng-Chi Chuang, Chih-Hao Wang, Huan-Chieh Su, Chun-Yuan Chen, Li-Zhen Yu, Yu-Ming Lin
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Publication number: 20240079439Abstract: A pixel of an image sensor includes: a semiconductor material substrate; a photosensitive region formed in the substrate, the photosensitive region generating photo-induced electrical charge in response to illumination with light; a storage node formed in the substrate proximate to the photosensitive region, the storage node selectively receiving and storing photo-induced electrical charge generated by the photosensitive region; and a shield formed over the storage node which inhibits light from reaching the storage node, the shield including an extension which protrudes into the substrate and surrounds an outer periphery of the storage node.Type: ApplicationFiled: January 4, 2023Publication date: March 7, 2024Inventors: Chung-Yi Lin, Yueh-Chuan Lee, Chia-Chan Chen
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Patent number: 11924964Abstract: Devices and methods are described for reducing etching due to Galvanic Effect within a printed circuit board (PCB) that may be used in an electronic device. Specifically, a contact trace is coupled to a contact finger that has a substantially larger surface area than the contact trace. The contact finger is configured to couple the electronic device to a host device. The contact trace is electrically isolated from the rest of the PCB circuitry during a fabrication process by a separation distance between an exposed portion of the contact trace and an impedance trace. The contact finger and the exposed portion of the contact trace are plated with a common material to reduce galvanic etching of the contact trace during fabrication. The contact trace is then connected to the impedance trace using a solder joint.Type: GrantFiled: April 7, 2022Date of Patent: March 5, 2024Assignee: Western Digital Technologies, Inc.Inventors: Lin Hui Chen, Songtao Lu, Chien Te Chen, Yu Ying Tan, Huang Pao Yi, Ching Chuan Hsieh, T. Sharanya Kaminda, Chia-Hsuan Huang
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Patent number: 11913636Abstract: A light source module includes a circuit substrate, a plurality of light-emitting diodes, a cover layer and a plurality of first scattering particles. The plurality of light-emitting diodes is disposed on the circuit substrate. The cover layer covers the plurality of light-emitting diodes, and an upper surface of the cover layer has a plurality of recesses, wherein orthogonal projections of the plurality of recesses on the circuit substrate overlap the circuit substrate between the plurality of light-emitting diodes. The plurality of first scattering particles is located in the plurality of recesses.Type: GrantFiled: December 20, 2022Date of Patent: February 27, 2024Assignee: AUO CorporationInventors: Hui-Chuan Chen, Chia-Hao Wu
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Publication number: 20180283706Abstract: An air conditioning system includes a main pipe, a first area pipe, a second area pipe, and a controller. The main pipe includes a storage tank, a water supply pipe, and a water return pipe connected in series. The main pipe is further connected with a variable-frequency pump in series. The first area pipe is further connected with a first electric valve and a first calorimeter in series. The first calorimeter detects and transmits first dynamic thermal information. The second area pipe is further connected with a second electric valve and a second calorimeter in series. The second calorimeter detects and transmits second dynamic thermal information. The controller receives the first dynamic thermal information and the second dynamic thermal information and correspondingly controls the variable-frequency pump to dynamically operate, or correspondingly controls the first electric valve and the second electric valve to dynamically adjust the flow rate.Type: ApplicationFiled: January 11, 2018Publication date: October 4, 2018Applicant: DYNAMIC TECHNOLOGY LIMITED COMPANYInventors: CHIA-CHUAN CHEN, WEI-JHE HONG
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Patent number: 9735018Abstract: Techniques for achieving extremely thin package structures are disclosed. In some embodiments, a device comprises an integrated circuit connected to a leadframe or substrate via connections and EMC (Epoxy Molding Compound) surrounding the integrated circuit except at a backside of the integrated circuit and connecting areas via which the integrated circuit is connected to the leadframe or substrate.Type: GrantFiled: August 24, 2015Date of Patent: August 15, 2017Assignee: Silego Technology, Inc.Inventors: Chia Chuan Chen, Lung-Pao Chin, I-Kuo Lin
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Publication number: 20150364331Abstract: Techniques for achieving extremely thin package structures are disclosed. In some embodiments, a device comprises an integrated circuit connected to a leadframe or substrate via connections and EMC (Epoxy Molding Compound) surrounding the integrated circuit except at a backside of the integrated circuit and connecting areas via which the integrated circuit is connected to the leadframe or substrate.Type: ApplicationFiled: August 24, 2015Publication date: December 17, 2015Inventors: Chia Chuan Chen, Lung-Pao Chin, I-Kuo Lin
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Patent number: 9147629Abstract: Techniques for achieving extremely thin package structures are disclosed. In some embodiments, a device comprises an integrated circuit connected to a leadframe or substrate via connections and EMC (Epoxy Molding Compound) surrounding the integrated circuit except at a backside of the integrated circuit and connecting areas via which the integrated circuit is connected to the leadframe or substrate.Type: GrantFiled: September 20, 2013Date of Patent: September 29, 2015Assignee: Silego Technology, Inc.Inventors: Chia Chuan Chen, Lung-Pao Chin, I-Kuo Lin
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Publication number: 20140084429Abstract: Techniques for achieving extremely thin package structures are disclosed. In some embodiments, a device comprises an integrated circuit connected to a leadframe or substrate via connections and EMC (Epoxy Molding Compound) surrounding the integrated circuit except at a backside of the integrated circuit and connecting areas via which the integrated circuit is connected to the leadframe or substrate.Type: ApplicationFiled: September 20, 2013Publication date: March 27, 2014Inventors: Chia Chuan Chen, Lung-Pao Chin, I-Kuo Lin