Abstract: An integrated standalone optical disc duplication and labeling system has an optical disc drive, a main controller and a command module. The optical disc drive is capable of containing an optical disc and performing either a duplication capability or a labeling capability. The main controller is connected to and operates the optical disc drive. The command module is connected to the main controller and is capable of transmitting either a duplication designating command or a labeling designating command to the main controller. The duplication designating command is used to designate the optical disc drive to perform the duplication capability. The labeling designating command is used to designate the optical disc drive to perform the labeling capability. A user acquires a single standalone system that is able to perform both duplication and labeling.

Abstract: A heat dissipation device includes a base, a first heat pipe, a first heat sink, a second heat pipe, a thermoelectric cooler and a second heat sink. The first heat pipe includes a first end and a second end. The first end of the first heat pipe is connected to the base. The second end of the first heat pipe is connected to a bottom of the first heat sink. The second heat pipe includes a first end and a second end. The first end of the second heat pipe is connected to the base. The second end of the second heat pipe is connected to a top end of the thermoelectric cooler. The second heat sink is mounted on a bottom of the thermoelectric cooler and located at a side of the first heat sink. The thermoelectric cooler spaces apart from the heat generating member. As such, the water generated by the thermoelectric cooler during a cooling process won't spread to the heat generating member and a short circuit of the heat generating member can be avoided.

Abstract: An autoloader system with modularization architecture and self-adaptive motion control ability for mass optical disks duplication includes four physical modules: a robot arm module with sensors and joints dedicates for delivering and picking up optical disks; an optical disk duplication tower has a number of optical drives in a stack, or a matrix for optical disk duplication; a motion control module has an embedded motion controller and a power source to synchronize the motion of robot arm and duplication; a platform module has a base frame to fix other modules and a user interface. Some disk stacks are situated on top of platform module. The use of a self-adaptive control algorithm, consisting of a Motion Strategy Database, Initial Process, Motion Planning Process, Motion Generation Process and Motion Monitor Process, to ascertain system configurations and components furthest satisfy the required flexibility for modifying/upgrading hardware or ever-changing user needs.

Abstract: Present invention provides a one-stop simplified mechanism of optical disc duplication and labeling, all done within the same integrated standalone system, saving the trouble of multi-step disc handling and the saving the cost of additional expenses related to the use of traditional labeling method such as ink, ribbons and other consumable items.

Abstract: A heat-dissipating device includes a MOSFET heat dissipator, a south bridge heat dissipator, a north bridge heat dissipator and a water block connector. A heat pipe is provided between each heat dissipator to connect these heat dissipators in series. Further, the north bridge heat dissipator has a heat-dissipating bottom plate and a heat-dissipating body attached to a half portion of the heat-dissipating bottom plate. Further, the water block connector comprises a hollow base and two connecting tubes that are provided on two locations of the base and in communication with each other. The base of the water block connector is attached to the other half portion of the heat-dissipating bottom plate of the north bridge heat dissipater. When the water cooling is used, the two connecting tubes of the water block connector can be connected in series with a water-cooling circulation system.

Abstract: An elastic fastener for fixing a heat sink on a circuit board includes a fixing element, a cylinder and an elastic element. The fixing element has a head and a fixing section. One side of the fixing section is formed into a protruding ring. The cylinder is made of electrically non-conductive materials and it has a hollow hole for allowing the fixing element to pass through. The cylinder extends inwardly to form a locking ring for engagingly connecting with the protruding ring. The elastic fastener further includes an elastic element. Both ends of the elastic element are elastically compressed between the head and the top surface of the cylinder. With the above arrangement, the electrically non-conductive property of the cylinder can prevent the circuit board and the heat sink from contacting to generate a short circuit and in turn cause a breakdown of the circuit board.

Abstract: A heat dissipation device includes a base, a first heat pipe, a first heat sink, a second heat pipe, a thermoelectric cooler and a second heat sink. The first heat pipe includes a first end and a second end. The first end of the first heat pipe is connected to the base. The second end of the first heat pipe is connected to a bottom of the first heat sink. The second heat pipe includes a first end and a second end. The first end of the second heat pipe is connected to the base. The second end of the second heat pipe is connected to a top end of the thermoelectric cooler. The second heat sink is mounted on a bottom of the thermoelectric cooler and located at a side of the first heat sink. The thermoelectric cooler spaces apart from the heat generating member. As such, the water generated by the thermoelectric cooler during a cooling process won't spread to the heat generating member and a short circuit of the heat generating member can be avoided.

Abstract: The water-cooling heat dissipation alarm system according to the present invention comprises a water-cooling heat dissipation system and an alarm device, in which the water-cooling heat dissipation system is mutually connected to a water block, a heat exchanger, a water tank and a circulation pump through the pipe, wherein the circulation pump outputs a frequency signal being in proportional to the rotation speed thereof. The alarm device is placed in the circulation pump, which receives the frequency signal outputted from the circulation pump and determines action conditions in the water flow and the circulation pump, then performs alarm operation based the determination in order to provide precise system abnormality alarm.

Abstract: A cooling device for interface card for cooling a heating component on an interface card includes a heat sink and a water cooling head, wherein the heat sink has a heat conducting seat and a plurality of cooling fins. A cooling flow path is formed between any two adjacent cooling fins. In addition, the water block is attached onto the plural cooling fins of the heat sink. Thereby, the operational heat, generated from the heating element, is firstly absorbed by the heat-conducting seat and is then distributed uniformly cross to the plural fins. In addition to the heat dissipation proceeded between the fins and the ambient air, the operational heat is further conducted to the water block, undergoing a heat exchange with the coolant flowing in the water block, and thus a desired cooling effectiveness is achieved.

Abstract: A heat dissipating apparatus for a water cooling system includes a heat conducting base, a heat dissipating structure and a water block. The heat dissipating structure includes a heat pipe and a plurality of fins, the heat pipe has a first end and a second end, and the first end is connected to the heat conducting base for conducting heat and the second end is connected in series with each fin. The water block includes a hollow base and two connectors installed at two positions of the base and interconnected with the base, and the base is attached on a heated end of a heat pipe for conducting heat, and the two connectors are extended from the lateral directions.

Abstract: A water-cooling heat dissipator mounted on an electronic heat-generating element includes a water-cooling head member and at least one heat pipe. The water-cooling head member includes a first cover and a second cover connected to the first cover. Both ends of the first cover and the second cover are formed with a receiving portion corresponding to each other, respectively. The receiving portions are adapted to be connected to the conduit connectors. A channel portion is formed between the first cover and the second cover for receiving one end of the heat pipe. With the above arrangement, the present invention can perform the heat dissipations of different heat-generating elements simultaneously to make the heat-generating elements operate under acceptable working temperatures. Further, the present invention can be widely used in the heat dissipation of compact electronic products.

Abstract: A heat-dissipating device includes a MOSFET heat dissipator, a south bridge heat dissipator, a north bridge heat dissipator and a water block connector. A heat pipe is provided between each heat dissipator to connect these heat dissipators in series. Further, the north bridge heat dissipator has a heat-dissipating bottom plate and a heat-dissipating body attached to a half portion of the heat-dissipating bottom plate. Further, the water block connector comprises a hollow base and two connecting tubes that are provided on two locations of the base and in communication with each other. The base of the water block connector is attached to the other half portion of the heat-dissipating bottom plate of the north bridge heat dissipater. When the water cooling is used, the two connecting tubes of the water block connector can be connected in series with a water-cooling circulation system.

Abstract: A cooling structure for interface card for cooling the heating component on an interface card includes a heat sink, a metallic hood, and a water block, wherein the heat sink has a heat conducting seat and a plurality of cooling fins, while the heat conducting seat is attached to the heating component of the interface card. Furthermore, the metallic hood arranged on the heat sink is connected thereto. Finally, the water block is arranged on the metallic hood; thereby, the operational heat, generated from the heating element, is absorbed by the heat-conducting seat and is then conducted to the fins of the heat sink, so that the operational heat is distributed to the metallic hood by heat conducting process, making the operational heat that is generated by the heating component carried away through the heat exchanging function of the water block, and thus a desired cooling effectiveness is achieved.

Abstract: A pipe connector includes a pipe-connecting piece hollowed in its interior, a pipe-covering piece covered on the pipe-connecting piece, and a sealing piece detachably provided on the outside of one end of the pipe-covering piece. The pipe-connecting piece has a first connecting port for communicating with its interior. At least one through hole is provided on the pipe-connecting piece for communicating with its interior. Further, two leakage-proof washers are provided at an interval with the through hole disposed therebetween. The pipe-covering piece has an annular sheath and a second connecting port provided on the outer wall of the annular sheath. The annular sheath is covered on the pipe-connecting piece to allow its inner wall to tightly contact with the two leakage-proof washers, so that the second connecting port is in communication with the interior of the pipe-connecting piece.

Abstract: A water block includes a first casing, a solder paste, and a second casing. The first casing has a solder reserve area formed on an outer edge thereof. The solder paste is coated on the solder reserve area. The second casing is jointed with the first casing via the solder past to form a channel space. The present invention uses tin solder as a soldering material, so that the soldering temperature is between 200° C. and 400° C. Hence, the present invention avoids oxygenation and weakened bond strength due to high temperatures. Therefore, when the solder paste melts, the flux separates from the tin solder and bubbles of the tin solder are removed from the solder reserve area at a soldering temperature of between 200˜400° C. Moreover, the bond strength of the joint surface between two casings is increased, so cooling liquids won't easily leak out from the strong joint surface.

Abstract: A cooling device for interface card for cooling a heating component on an interface card includes a heat sink and a water cooling head, wherein the heat sink has a heat conducting seat and a plurality of cooling fins. A cooling flow path is formed between any two adjacent cooling fins. In addition, the water block is attached onto the plural cooling fins of the heat sink. Thereby, the operational heat, generated from the heating element, is firstly absorbed by the heat-conducting seat and is then distributed uniformly cross to the plural fins. In addition to the heat dissipation proceeded between the fins and the ambient air, the operational heat is further conducted to the water block, undergoing a heat exchange with the coolant flowing in the water block, and thus a desired cooling effectiveness is achieved.

Abstract: A cooling structure for interface card for cooling the heating component on an interface card includes a heat sink, a metallic hood, and a water block, wherein the heat sink has a heat conducting seat and a plurality of cooling fins, while the heat conducting seat is attached to the heating component of the interface card. Furthermore, the metallic hood arranged on the heat sink is connected thereto. Finally, the water block is arranged on the metallic hood; thereby, the operational heat, generated from the heating element, is absorbed by the heat-conducting seat and is then conducted to the fins of the heat sink, so that the operational heat is distributed to the metallic hood by heat conducting process, making the operational heat that is generated by the heating component carried away through the heat exchanging function of the water block, and thus a desired cooling effectiveness is achieved.

Abstract: An autoloader system with modularization architecture and self-adaptive motion control ability for mass optical disks duplication includes four physical modules: a robot arm module with sensors and joints dedicates for delivering and picking up optical disks; an optical disk duplication tower has a number of optical drives in a stack, or a matrix for optical disk duplication; a motion control module has an embedded motion controller and a power source to synchronize the motion of robot arm and duplication; a platform module has a base frame to fix other modules and a user interface. Some disk stacks are situated on top of platform module. The use of a self-adaptive control algorithm, consisting of a Motion Strategy Database, Initial Process, Motion Planning Process, Motion Generation Process and Motion Monitor Process, to ascertain system configurations and components furthest satisfy the required flexibility for modifying/upgrading hardware or ever-changing user needs.

Abstract: A pipe fitting includes a first pipework with a hollow interior, a casing pipe sheathed onto the first pipework, a stopping portion disposed at an end of the first pipework, a first junction disposed at another end of the first pipework and interconnected to the interior, at least one penetrating hole disposed on the first pipework and interconnected with the interior, and two first washers with an interval apart such that the penetrating hole is situated between the two first washers. The casing pipe has a circular sheath and a cold water junction disposed on an external wall of the circular sheath, and the circular sheath has a circular sheath hole sheathed onto the first pipework, such that the internal wall of the circular sheath is in a close contact with the two first washers and the cold water junction is interconnected with the interior of the first pipework.

Abstract: A water-cooling heat dissipator mounted on an electronic heat-generating element includes a water-cooling head member and at least one heat pipe. The water-cooling head member includes a first cover and a second cover connected to the first cover. Both ends of the first cover and the second cover are formed with a receiving portion corresponding to each other, respectively. The receiving portions are adapted to be connected to the conduit connectors. A channel portion is formed between the first cover and the second cover for receiving one end of the heat pipe. With the above arrangement, the present invention can perform the heat dissipations of different heat-generating elements simultaneously to make the heat-generating elements operate under acceptable working temperatures. Further, the present invention can be widely used in the heat dissipation of compact electronic products.