Patents by Inventor Chia-Chun Lee

Chia-Chun Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240150652
    Abstract: The disclosure relates to a quantum dot structure. The quantum dot structure includes a quantum dot and a cloud-like shell covering a portion of the quantum dot and having an irregular outer surface. The quantum dot includes: a core; a first shell discontinuously around a core surface of the core; and a second shell between the core and the first shell and encapsulating the core surface of the core, wherein the second shell has an irregular outer surface.
    Type: Application
    Filed: October 31, 2023
    Publication date: May 9, 2024
    Inventors: Pei Cong YAN, Chia-Chun HSIEH, Huei Ping WANG, Hung-Chun TONG, Yu-Chun LEE
  • Publication number: 20240151814
    Abstract: The present disclosure provides a radar object recognition method, which includes steps as follows. The radar image generation is performed on radar data to generate a radar image; the radar image is inputted into an object recognition model, so that the object recognition model outputs a recognition result; the post-process is performed on the recognition result to eliminate recognition errors from the recognition result.
    Type: Application
    Filed: February 21, 2023
    Publication date: May 9, 2024
    Inventors: Ta-Sung LEE, Ming-Chun LEE, Tai-Yuan HUANG, Chia-Hsing YANG
  • Publication number: 20240136463
    Abstract: This disclosure discloses an optical sensing device. The device includes a carrier body; a first light-emitting device disposed on the carrier body; and a light-receiving device including a group III-V semiconductor material disposed on the carrier body, including a light-receiving surface having an area, wherein the light-receiving device is capable of receiving a first received wavelength having a largest external quantum efficiency so the ratio of the largest external quantum efficiency to the area is ?13.
    Type: Application
    Filed: December 20, 2023
    Publication date: April 25, 2024
    Applicant: EPISTAR CORPORATION
    Inventors: Yi-Chieh LIN, Shiuan-Leh LIN, Yung-Fu CHANG, Shih-Chang LEE, Chia-Liang HSU, Yi HSIAO, Wen-Luh LIAO, Hong-Chi SHIH, Mei-Chun LIU
  • Publication number: 20240128420
    Abstract: A display panel including a circuit board, a plurality of bonding pads, a plurality of light emitting devices, and a plurality of solder patterns is provided. The bonding pads are disposed on the circuit board, and each includes a first metal layer and a second metal layer. The second metal layer is located between the first metal layer and the circuit board. The first metal layer includes an opening overlapping the second metal layer. A material of the first metal layer is different from a material of the second metal layer. The light emitting devices are electrically bonded to the bonding pads. Each of the solder patterns electrically connects one of the light emitting devices and one of the bonding pads. The solder patterns each contact the second metal layer through the opening of the first metal layer of one of the bonding pads to form a eutectic bonding.
    Type: Application
    Filed: December 6, 2022
    Publication date: April 18, 2024
    Applicant: AUO Corporation
    Inventors: Chia-Hui Pai, Tai-Tso Lin, Wen-Hsien Tseng, Wei-Chieh Chen, Kuan-Yi Lee, Chih-Chun Yang
  • Patent number: 11961546
    Abstract: A reference circuit for generating a reference current includes a plurality of resistive elements including at least one magnetic tunnel junction (MTJ). A control circuit is coupled to a first terminal of the at least one MTJ and is configured to selectively flow current through the at least one MTJ in the forward and inverse direction to generate a reference current.
    Type: Grant
    Filed: August 2, 2021
    Date of Patent: April 16, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chia-Fu Lee, Hon-Jarn Lin, Po-Hao Lee, Ku-Feng Lin, Yi-Chun Shih, Yu-Der Chih
  • Publication number: 20240115616
    Abstract: The present disclosure provides a method for treating liver cirrhosis by using a composition including mesenchymal stem cells, extracellular vesicles produced by the mesenchymal stem cells, and growth factors. The composition of the present disclosure achieves the effect of treating liver cirrhosis through various efficacy experiments.
    Type: Application
    Filed: October 4, 2023
    Publication date: April 11, 2024
    Inventors: Po-Cheng Lin, Pi-Chun Huang, Zih-Han Hong, Ming-Hsi Chuang, Yi-Chun Lin, Chia-Hsin Lee, Chun-Hung Chen, Chao-Liang Chang, Kai-Ling Zhang
  • Publication number: 20240120325
    Abstract: A stacked package structure and a manufacturing method thereof are provided. The stacked package structure includes an upper redistribution layer, a first chip, and an upper molding layer. The first chip is disposed on the upper redistribution layer and is electrically connected to the upper redistribution layer. The upper molding layer is disposed on the first chip and the upper redistribution layer, and is configured to package the first chip. The upper molding layer includes a recess, the recess is recessed relative to a surface of the upper molding layer away from the upper redistribution layer, and the recess is circumferentially formed around a periphery of the upper molding layer.
    Type: Application
    Filed: May 31, 2023
    Publication date: April 11, 2024
    Applicant: POWERTECH TECHNOLOGY INC.
    Inventors: Pei-chun TSAI, Hung-hsin HSU, Shang-yu CHANG CHIEN, Chia-ling LEE
  • Patent number: 11955154
    Abstract: A sense amplifier circuit includes a sense amplifier, a switch and a temperature compensation circuit. The temperature compensation circuit provides a control signal having a positive temperature coefficient, based on which the switch provides reference impedance for temperature compensation. The sense amplifier includes a first input end coupled to a target bit and a second input end coupled to the switch. The sense amplifier outputs a sense amplifier signal based on the reference impedance and the impedance of the target bit.
    Type: Grant
    Filed: May 16, 2022
    Date of Patent: April 9, 2024
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Cheng-Tung Huang, Jen-Yu Wang, Po-Chun Yang, Yi-Ting Wu, Yung-Ching Hsieh, Jian-Jhong Chen, Chia-Wei Lee
  • Patent number: 11935981
    Abstract: A photo-detecting device includes a first semiconductor layer with a first dopant, a light-absorbing layer, a second semiconductor layer, and a semiconductor contact layer. The second semiconductor layer is located on the first semiconductor layer and has a first region and a second region, the light absorbing layer is located between the first semiconductor layer and the second semiconductor layer and has a third region and a fourth region, the semiconductor contact layer contacts the first region. The first region includes a second dopant and a third dopant, the second region includes second dopant, and the third region includes third dopant. The semiconductor contact layer has a first thickness greater than 50 ? and smaller than 1000 ?.
    Type: Grant
    Filed: June 30, 2021
    Date of Patent: March 19, 2024
    Assignee: EPISTAR CORPORATION
    Inventors: Chu-Jih Su, Chia-Hsiang Chou, Wei-Chih Peng, Wen-Luh Liao, Chao-Shun Huang, Hsuan-Le Lin, Shih-Chang Lee, Mei Chun Liu, Chen Ou
  • Publication number: 20240084447
    Abstract: A sealing article includes a body and a coating layer disposed on at least one surface of the body. The body comprises a polymeric elastomer such as perfluoroelastomer or fluoroelastomer. The coating layer comprises at least one metal. The sealing article may be a seal, a gasket, an O-ring, a T-ring or any other suitable product. The sealing article is resistant to ultra-violet (UV) light and plasma, and may be used for sealing a semiconductor processing chamber.
    Type: Application
    Filed: November 17, 2023
    Publication date: March 14, 2024
    Inventors: Peng-Cheng Hong, Jun-Liang Pu, W.L. Hsu, Chung-Hao Kao, Chia-Chun Hung, Cheng-Yi Wu, Chin-Szu Lee
  • Publication number: 20240088224
    Abstract: A semiconductor structure includes a first gate structure, a second gate structure coupled to the first gate structure, a source region, a first drain region, and a second drain region. The source region is surrounded by the first gate structure and the second gate structure. The first drain region is separated from the source region by the first gate structure. The second drain region is separated from the source region by the second gat structure. A shape of the first drain region and a shape of the second drain region are different from each other from a plan view.
    Type: Application
    Filed: November 14, 2023
    Publication date: March 14, 2024
    Inventors: HSING-I TSAI, FU-HUAN TSAI, CHIA-CHUNG CHEN, HSIAO-CHUN LEE, CHI-FENG HUANG, CHO-YING LU, VICTOR CHIANG LIANG
  • Publication number: 20240077593
    Abstract: An optical radar includes an optical-signal receiving unit and an optical-signal pickup unit. The optical-signal receiving unit is configured to receive a reflected light. The optical-signal pickup unit is coupled to the optical-signal receiving unit and includes a first optical-signal filtering circuit and a second optical-signal filtering unit. The first optical-signal filtering circuit is configured to filter out a first interference pulse of the reflected light, wherein the first interference pulse has a first interference voltage value higher than a reference voltage. The second optical-signal filtering circuit is coupled to the first optical-signal filtering circuit and configured to generate a clock signal comprising a clock pulse; and filter out a second interference pulse that does not match the clock pulse in time point from the reflected light.
    Type: Application
    Filed: November 30, 2022
    Publication date: March 7, 2024
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Chih-Chun CHEN, Yi-Chi LEE, Chia-Yu HU, Ji-Bin HORNG
  • Patent number: 11923036
    Abstract: A memory device, such as an MRAM memory, includes a memory array with a plurality of bit cells. The memory array is configured to store trimming information and store user data. A sense amplifier is configured to read the trimming information from the memory array, and a trimming register is configured to receive the trimming information from the sense amplifier. The sense amplifier is configured to receive the trimming information from the trimming register so as to operate in a trimmed mode for reading the user data from the memory array.
    Type: Grant
    Filed: February 13, 2023
    Date of Patent: March 5, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yi-Chun Shih, Chia-Fu Lee, Yu-Der Chih
  • Patent number: 11920238
    Abstract: A method of making a sealing article that includes a body and a coating layer disposed on at least one surface of the body. The body comprises a polymeric elastomer such as perfluoroelastomer or fluoroelastomer. The coating layer comprises at least one metal. The sealing article may be a seal, a gasket, an O-ring, a T-ring or any other suitable product. The sealing article is resistant to ultra-violet (UV) light and plasma, and may be used for sealing a semiconductor processing chamber.
    Type: Grant
    Filed: July 22, 2022
    Date of Patent: March 5, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Peng-Cheng Hong, Jun-Liang Pu, W. L. Hsu, Chung-Hao Kao, Chia-Chun Hung, Cheng-Yi Wu, Chin-Szu Lee
  • Patent number: 11811321
    Abstract: A spread spectrum switching power converter circuit includes: a power stage circuit which includes an inductor and a power switch and is configured to switch the power switch according to a switching signal having spread spectrum for power conversion; a variable frequency oscillator, which generates a spread spectrum clock signal according to a spread spectrum control signal; a spread spectrum control circuit, which generates the spread spectrum control signal according to a first clock signal and a second clock signal; and a pulse width modulation circuit, configured to generate the switching signal according to a feedback signal based on the spread spectrum clock signal. The spread spectrum control circuit generates the spread spectrum control signal by sampling and combining a periodic waveform and a random waveform. The random waveform is generated according to the first clock signal and the periodic waveform is generated according to the second clock signal.
    Type: Grant
    Filed: May 4, 2022
    Date of Patent: November 7, 2023
    Assignee: RICHTEK TECHNOLOGY CORPORATION
    Inventors: Chen-Lin Hsu, Chia-Chun Lee
  • Publication number: 20220360173
    Abstract: A spread spectrum switching power converter circuit includes: a power stage circuit which includes an inductor and a power switch and is configured to switch the power switch according to a switching signal having spread spectrum for power conversion; a variable frequency oscillator, which generates a spread spectrum clock signal according to a spread spectrum control signal; a spread spectrum control circuit, which generates the spread spectrum control signal according to a first clock signal and a second clock signal; and a pulse width modulation circuit, configured to generate the switching signal according to a feedback signal based on the spread spectrum clock signal. The spread spectrum control circuit generates the spread spectrum control signal by sampling and combining a periodic waveform and a random waveform. The random waveform is generated according to the first clock signal and the periodic waveform is generated according to the second clock signal.
    Type: Application
    Filed: May 4, 2022
    Publication date: November 10, 2022
    Inventors: Chen-Lin Hsu, Chia-Chun Lee
  • Publication number: 20200342833
    Abstract: A head mounted display system and a scene scanning method thereof are provided. In the method, one or more first scene images and a second scene image in a real environment are obtained. A preliminary virtual environment corresponding to the real environment from the first scene images is generated. The preliminary virtual environment is displayed with a perspective at a visual position. The virtual position is corresponding to a real position in the real environment where the second scene image is captured. The perspective to present the virtual environment is modified in response to a change of a pose of the user's head. Accordingly, a convenient way to scan the real environment is provided, and a complete virtual environment may be obtained.
    Type: Application
    Filed: October 9, 2019
    Publication date: October 29, 2020
    Applicant: XRSPACE CO., LTD.
    Inventors: Chung-Chih Tsai, Yu-Wen Lin, Chia-Chun Lee, Shi-Yuan Chiang
  • Publication number: 20200327867
    Abstract: The present disclosure discloses a head mounted display system including a tracking unit, a display unit and a processing unit coupled to the tracking unit and the display unit. The tracking unit is for tracking at least one of a position, an orientation and a pose of the head mounted display system and further generating a tracking result. The display unit is for displaying a virtual scene and a map of the real environment based on the tracking result in a picture-in-picture mode. The present disclosure allows a user to see the virtual scene and the map of the real environment in the picture-in-picture mode synchronously and help the user to understand a current position or a current state of the user in the real environment, which effectively ensures the user's safety and prevents injuries caused by collision when the user experiences the virtual environment.
    Type: Application
    Filed: April 15, 2019
    Publication date: October 15, 2020
    Inventors: Tzu-Chiang Wang, Chia-Chun Lee, Si-Ying Li, Wei-Shuo Chen
  • Patent number: 9603867
    Abstract: A pharmaceutical composition for improving wound healing is provided. The pharmaceutical composition includes (a) hyaluronic acid or its derivation, (b) an effective amount of an active ingredient; and optionally (c) pharmaceutically acceptable carriers and/or excipients. In one embodiment, the active ingredient includes vitamin. In another embodiment, the active ingredient includes acexamic acid. In still another embodiment, the pharmaceutical composition can further comprise sorbic acid.
    Type: Grant
    Filed: March 3, 2015
    Date of Patent: March 28, 2017
    Assignee: YUNG SHIN PHARM. IND. CO., LTD.
    Inventors: Chiung-Ju Tsai, Yen-Ling Yi, Man-Hsin Wang, Shih-Lung Chang, Chia-Chun Lee
  • Publication number: 20160256482
    Abstract: A pharmaceutical composition for improving wound healing is provided. The pharmaceutical composition includes (a) hyaluronic acid or its derivation, (b) an effective amount of an active ingredient; and optionally (c) pharmaceutically acceptable carriers and/or excipients. In one embodiment, the active ingredient includes vitamin. In another embodiment, the active ingredient includes acexamic acid. In still another embodiment, the pharmaceutical composition can further comprise sorbic acid.
    Type: Application
    Filed: March 3, 2015
    Publication date: September 8, 2016
    Inventors: Chiung-Ju Tsai, Yen-Ling Yi, Man-Hsin Wang, Shih-Lung Chang, Chia-Chun Lee