Patents by Inventor Chia-Chun Liu
Chia-Chun Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240136463Abstract: This disclosure discloses an optical sensing device. The device includes a carrier body; a first light-emitting device disposed on the carrier body; and a light-receiving device including a group III-V semiconductor material disposed on the carrier body, including a light-receiving surface having an area, wherein the light-receiving device is capable of receiving a first received wavelength having a largest external quantum efficiency so the ratio of the largest external quantum efficiency to the area is ?13.Type: ApplicationFiled: December 20, 2023Publication date: April 25, 2024Applicant: EPISTAR CORPORATIONInventors: Yi-Chieh LIN, Shiuan-Leh LIN, Yung-Fu CHANG, Shih-Chang LEE, Chia-Liang HSU, Yi HSIAO, Wen-Luh LIAO, Hong-Chi SHIH, Mei-Chun LIU
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Patent number: 11962240Abstract: Devices and methods are provided for controlling dead-time of a direct current to direct current (DC-DC) converter. A control circuit includes a first transistor having a source/drain terminal coupled to an output voltage of the DC-DC converter configured to provide current based on the output voltage. The control circuit also includes a digital up/down counter having an output terminal electrically coupled to an input terminal of a delay cell of the DC-DC converter. A current sensing circuit of the control circuit is electrically coupled to an input terminal of the digital up/down counter configured to receive the current and drive the digital up/down counter based on the current.Type: GrantFiled: April 7, 2021Date of Patent: April 16, 2024Assignee: Taiwan Semiconductor Manufacturing Company LimitedInventors: Chia-Chun Chang, Alan Roth, Eric Soenen, Tysh-Bin Liu
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Publication number: 20240114359Abstract: Apparatus and methods are provided for AI-ML model storage and transfer in the wireless network. In one novel aspect, the AI-ML model is stored at the AI server and transferred through the user plane (UP). In one embodiment, UE downloads the AI-ML model from the AI server through the UP connection. In one embodiment, the AI-ML model is updated at the RAN node, and the UE downloads the AI-ML model through the AI server. In another embodiment, the AI-ML model is updated at the UE, and the UE uploads the AI-ML model to the AI server through the UP connection. In another embodiment, the UE uploads the AI-ML model to the RAN through the AI server. In one embodiment, the UE mobility triggers the AI-ML model transfer. In one novel aspect, the AI dataset is shared and transferred among different entities through the UP connection or a new AI plane.Type: ApplicationFiled: September 14, 2023Publication date: April 4, 2024Inventors: Ta-Yuan Liu, Hao Bi, CHIA-CHUN HSU
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Patent number: 11941298Abstract: A host system initiates an abort of a command that has been placed into a submission queue (SQ) of the host system. The host system identifies at least one of a first outcome and a second outcome. When the first outcome indicates that the command is not completed and the second outcome indicates that the SQ entry has been fetched from the SQ, the host system sends an abort request to a storage device, and issues a cleanup request to direct the host controller to reclaim host hardware resources allocated to the command. The host system adds a completion queue (CQ) entry to a CQ and sets an overall command status (OCS) value of the CQ entry based on at least one of the first outcome and the second outcome.Type: GrantFiled: April 19, 2022Date of Patent: March 26, 2024Assignee: MediaTek Inc.Inventors: Chih-Chieh Chou, Chia-Chun Wang, Liang-Yen Wang, Chin Chin Cheng, Szu-Chi Liu
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Patent number: 11935981Abstract: A photo-detecting device includes a first semiconductor layer with a first dopant, a light-absorbing layer, a second semiconductor layer, and a semiconductor contact layer. The second semiconductor layer is located on the first semiconductor layer and has a first region and a second region, the light absorbing layer is located between the first semiconductor layer and the second semiconductor layer and has a third region and a fourth region, the semiconductor contact layer contacts the first region. The first region includes a second dopant and a third dopant, the second region includes second dopant, and the third region includes third dopant. The semiconductor contact layer has a first thickness greater than 50 ? and smaller than 1000 ?.Type: GrantFiled: June 30, 2021Date of Patent: March 19, 2024Assignee: EPISTAR CORPORATIONInventors: Chu-Jih Su, Chia-Hsiang Chou, Wei-Chih Peng, Wen-Luh Liao, Chao-Shun Huang, Hsuan-Le Lin, Shih-Chang Lee, Mei Chun Liu, Chen Ou
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Publication number: 20240088307Abstract: A semiconductor package is provided. The semiconductor package includes a heat dissipation substrate including a first conductive through-via embedded therein; a sensor die disposed on the heat dissipation substrate; an insulating encapsulant laterally encapsulating the sensor die; a second conductive through-via penetrating through the insulating encapsulant; and a first redistribution structure and a second redistribution structure disposed on opposite sides of the heat dissipation substrate. The second conductive through-via is in contact with the first conductive through-via. The sensor die is located between the second redistribution structure and the heat dissipation substrate. The second redistribution structure has a window allowing a sensing region of the sensor die receiving light. The first redistribution structure is electrically connected to the sensor die through the first conductive through-via, the second conductive through-via and the second redistribution structure.Type: ApplicationFiled: November 20, 2023Publication date: March 14, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chih-Hsuan Tai, Hao-Yi Tsai, Yu-Chih Huang, Chih-Hao Chang, Chia-Hung Liu, Ban-Li Wu, Ying-Cheng Tseng, Po-Chun Lin
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Patent number: 11929318Abstract: A package structure includes a thermal dissipation structure, a first encapsulant, a die, a through integrated fan-out via (TIV), a second encapsulant, and a redistribution layer (RDL) structure. The thermal dissipation structure includes a substrate and a first conductive pad disposed over the substrate. The first encapsulant laterally encapsulates the thermal dissipation structure. The die is disposed on the thermal dissipation structure. The TIV lands on the first conductive pad of the thermal dissipation structure and is laterally aside the die. The second encapsulant laterally encapsulates the die and the TIV. The RDL structure is disposed on the die and the second encapsulant.Type: GrantFiled: May 10, 2021Date of Patent: March 12, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chih-Hsuan Tai, Hao-Yi Tsai, Tsung-Hsien Chiang, Yu-Chih Huang, Chia-Hung Liu, Ban-Li Wu, Ying-Cheng Tseng, Po-Chun Lin
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Patent number: 11923237Abstract: A manufacturing method of a semiconductor device includes at least the following steps. A sacrificial substrate is provided. An epitaxial layer is formed on the sacrificial substrate. An etch stop layer is formed on the epitaxial layer. Carbon atoms are implanted into the etch stop layer. A capping layer and a device layer are formed on the etch stop layer. A handle substrate is bonded to the device layer. The sacrificial substrate, the epitaxial layer, and the etch stop layer having the carbon atoms are removed from the handle substrate.Type: GrantFiled: August 30, 2021Date of Patent: March 5, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chi-Ming Chen, Kuei-Ming Chen, Po-Chun Liu, Chung-Yi Yu, Chia-Shiung Tsai
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Publication number: 20240072459Abstract: An electrical connection structure including a first substrate, a first conductive pad, a second substrate, a second conductive pad, at least two through holes and a conductive material. The first conductive pad is disposed on the first substrate and includes a first top surface. The second conductive pad is disposed on the second substrate and includes a second top surface. The at least two through holes pass through the first substrate and expose portions of the second top surface. A portion of the conductive material is disposed within the at least two through holes, and the conductive material electrically connects the first conductive pad and the second conductive pad.Type: ApplicationFiled: July 27, 2023Publication date: February 29, 2024Applicant: InnoLux CorporationInventors: Chia-Chun LIU, Hao-Jung HUANG
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Patent number: 11916077Abstract: The present disclosure describes an apparatus with a local interconnect structure. The apparatus can include a first transistor, a second transistor, a first interconnect structure, a second interconnect structure, and a third interconnect structure. The local interconnect structure can be coupled to gate terminals of the first and second transistors and routed at a same interconnect level as reference metal lines coupled to ground and a power supply voltage. The first interconnect structure can be coupled to a source/drain terminal of the first transistor and routed above the local interconnect structure. The second interconnect structure can be coupled to a source/drain terminal of the second transistor and routed above the local interconnect structure. The third interconnect structure can be routed above the local interconnect structure and at a same interconnect level as the first and second interconnect structures.Type: GrantFiled: May 24, 2021Date of Patent: February 27, 2024Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Chih-Liang Chen, Cheng-Chi Chuang, Chih-Ming Lai, Chia-Tien Wu, Charles Chew-Yuen Young, Hui-Ting Yang, Jiann-Tyng Tzeng, Ru-Gun Liu, Wei-Cheng Lin, Lei-Chun Chou, Wei-An Lai
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Publication number: 20230134317Abstract: Disclosed are an electrical connection structure and an electronic device including the same. The electrical connection structure includes a first substrate, a first conductive pad, a second substrate, a second conductive pad, a through hole, and a conductive material is provided. The first conductive pad is disposed on the first substrate. The first conductive pad includes a first upper surface. The second conductive pad is disposed on the second substrate. The second conductive pad includes a second upper surface. The through hole penetrates the first substrate and exposes a part of the second upper surface. The conductive material is partially disposed in the through hole. The conductive material includes a narrowest portion and a first contact portion in contact with the second upper surface. A length of the first contact portion is greater than a length of the narrowest portion in a cross-sectional view.Type: ApplicationFiled: October 3, 2022Publication date: May 4, 2023Applicant: Innolux CorporationInventors: Hao-Jung Huang, Chia-Chun Liu
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Publication number: 20220328459Abstract: An electronic device and a manufacturing method thereof are provided. The electronic device includes a substrate, multiple light emitting elements, and a light absorbing layer. The light emitting elements are disposed on the substrate. One of the light emitting elements has at least one lateral surface. The light absorbing layer is disposed on the substrate and is located between two adjacent light emitting elements, and the light absorbing layer contacts the at least one lateral surface.Type: ApplicationFiled: March 14, 2022Publication date: October 13, 2022Applicant: Innolux CorporationInventors: Chang-Ching Wu, Chia-Chun Liu, Yun-Sheng Chen, Hao-Jung Huang, Ker-Yih Kao
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Publication number: 20220093551Abstract: An electronic device including a first conductive element, a second conductive element, a substrate, and a conductor is provided. The first conductive element has a first region. The substrate has a through hole. The first through hole is disposed between the first conductive element and the second conductive element. The conductor electrically connects the first conductive element to the second conductive element through the through hole. The through hole is partially surrounded by the first region.Type: ApplicationFiled: August 24, 2021Publication date: March 24, 2022Applicant: Innolux CorporationInventors: Hao Jung Huang, Chia Chun Liu
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Patent number: 10613654Abstract: The present invention discloses an input method for a computer system. The computer system includes an operating system, a screen and a touch control module. The touch control module includes a nontransparent touch pad. The method includes the following steps: generating, by the touch control module, a plurality of first coordinates corresponding to movement of a stylus; sending, by the touch control module, the plurality of first coordinates to the operating system according to a stylus packet format utilized by the operating system; converting, by the operating system, the plurality of first coordinates to a plurality of second coordinates corresponding to the screen; and displaying a track on the screen according to the plurality of second coordinates.Type: GrantFiled: July 2, 2018Date of Patent: April 7, 2020Assignee: ELAN MICROELECTRONICS CORPORATIONInventors: Wei-Liang Chin, Chia-Chun Liu
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Publication number: 20190094998Abstract: The present invention discloses an input method for a computer system. The computer system includes an operating system, a screen and a touch control module. The touch control module includes a nontransparent touch pad. The method includes the following steps: generating, by the touch control module, a plurality of first coordinates corresponding to movement of a stylus; sending, by the touch control module, the plurality of first coordinates to the operating system according to a stylus packet format utilized by the operating system; converting, by the operating system, the plurality of first coordinates to a plurality of second coordinates corresponding to the screen; and displaying a track on the screen according to the plurality of second coordinates.Type: ApplicationFiled: July 2, 2018Publication date: March 28, 2019Inventors: Wei-Liang Chin, Chia-Chun Liu
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Patent number: 9947893Abstract: An organic light-emitting diode display is provided. The organic light-emitting diode display includes a first substrate, a second substrate, a frit, a metal layer, and an insulating layer. The second substrate is arranged to be separated from the first substrate. The frit is located between the first and second substrates. The metal layer is disposed on the first substrate, and the frit is located on the metal layer. The metal layer includes at least one opening. The frit is located in the opening. The frit has a number of voids arranged to correspond to the opening.Type: GrantFiled: July 1, 2016Date of Patent: April 17, 2018Assignee: INNOLUX CORPORATIONInventors: Kuang-Pin Chao, Chia-Chun Liu, Chao-Hsiang Wang, Yi- Ching Chen
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Patent number: 9605739Abstract: A power transmission system comprises a transmission device, and a power supply device which powers the transmission device, wherein the transmission device comprises a cavity having a body, covers, an inlet and an outlet; at least a pair of rotors and a gear set that are assembled in the cavity; and a transmission shaft pivotally connected with the pair of rotors and the gear set; the power supply device comprises a power equipment available for transmitting a working fluid; shaft adapters connected with the inlet and the outlet of the cavity; and a connecting pipe connected between the power equipment and the shaft adapter; the working fluid is transmitted by the connecting pipe from the power equipment to the inlet of the cavity to provide the pair of rotors with normal force for radial motion in a reverse rotation direction and make pressure in the cavity increased.Type: GrantFiled: April 11, 2014Date of Patent: March 28, 2017Assignee: GPOUER CO., LTD.Inventors: Tsang-Lin Hsu, Jung-Feng Yeh, Jau-Huai Lu, Tien-Tung Chung, Jian-Hung Lin, Chia-Chun Liu
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Publication number: 20170084865Abstract: An organic light-emitting diode display is provided. The organic light-emitting diode display includes a first substrate, a second substrate, a frit, a metal layer, and an insulating layer. The second substrate is arranged to be separated from the first substrate. The frit is located between the first and second substrates. The metal layer is disposed on the first substrate, and the frit is located on the metal layer. The metal layer includes at least one opening. The frit is located in the opening. The frit has a number of voids arranged to correspond to the opening.Type: ApplicationFiled: July 1, 2016Publication date: March 23, 2017Inventors: Kuang-Pin CHAO, Chia-Chun LIU, Chao-Hsiang WANG, Yi- Ching CHEN
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Publication number: 20160346908Abstract: A modular screw driver includes handle, a lining and a shaft. The handle includes a non-circular bore. The lining includes a profile in compliance with the bore. The shaft includes an operative tip at an end and an insert at another end. The insert is inserted and trapped in the lining.Type: ApplicationFiled: May 29, 2015Publication date: December 1, 2016Inventor: Chia-Chun Liu
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Publication number: 20150292609Abstract: A power transmission system comprises a transmission device, and a power supply device which powers the transmission device, wherein the transmission device comprises a cavity having a body, covers, an inlet and an outlet; at least a pair of rotors and a gear set that are assembled in the cavity; and a transmission shaft pivotally connected with the pair of rotors and the gear set; the power supply device comprises a power equipment available for transmitting a working fluid; shaft adapters connected with the inlet and the outlet of the cavity; and a connecting pipe connected between the power equipment and the shaft adapter; the working fluid is transmitted by the connecting pipe from the power equipment to the inlet of the cavity to provide the pair of rotors with normal force for radial motion in a reverse rotation direction and make pressure in the cavity increased.Type: ApplicationFiled: April 11, 2014Publication date: October 15, 2015Applicant: GPOUER CO., LTD.Inventors: TSANG-LIN HSU, JUNG-FENG YEH, JAU-HUAI LU, TIEN-TUNG CHUNG, JIAN-HUNG LIN, CHIA-CHUN LIU