Abstract: A semiconductor package is provided. The semiconductor package includes a heat dissipation substrate including a first conductive through-via embedded therein; a sensor die disposed on the heat dissipation substrate; an insulating encapsulant laterally encapsulating the sensor die; a second conductive through-via penetrating through the insulating encapsulant; and a first redistribution structure and a second redistribution structure disposed on opposite sides of the heat dissipation substrate. The second conductive through-via is in contact with the first conductive through-via. The sensor die is located between the second redistribution structure and the heat dissipation substrate. The second redistribution structure has a window allowing a sensing region of the sensor die receiving light. The first redistribution structure is electrically connected to the sensor die through the first conductive through-via, the second conductive through-via and the second redistribution structure.

Abstract: A package structure includes a thermal dissipation structure, a first encapsulant, a die, a through integrated fan-out via (TIV), a second encapsulant, and a redistribution layer (RDL) structure. The thermal dissipation structure includes a substrate and a first conductive pad disposed over the substrate. The first encapsulant laterally encapsulates the thermal dissipation structure. The die is disposed on the thermal dissipation structure. The TIV lands on the first conductive pad of the thermal dissipation structure and is laterally aside the die. The second encapsulant laterally encapsulates the die and the TIV. The RDL structure is disposed on the die and the second encapsulant.

Abstract: The present disclosure provides a fingerprint identification device including a substrate, a contact layer, a processing unit, and a plurality of sensor electrodes. The substrate includes a first sub-substrate, a second sub-substrate, and an adhesive layer. The adhesive layer is between the first sub-substrate and the second sub-substrate. A plurality of first sub-holes is defined in the first sub-substrate. A plurality of second sub-holes is defined in the second sub-substrate. A plurality of third sub-holes is defined in the adhesive layer. One of the first sub-holes communicates a corresponding one of the third sub-holes and a corresponding one of the second sub-holes to define a corresponding hole. An end of each of the sensor electrodes is coupled to the processing unit. The other end of each of the sensor electrodes passes through one of the holes, extends to the contact layer, and is covered by the contact layer.

Abstract: A fingerprint identification device includes a fingerprint identification controller and a fingerprint identification sensor. The fingerprint identification sensor includes a substrate having a top surface, a bottom surface opposite to the top surface, and a side surface coupled between the top surface and the bottom surface. Sensor electrodes are arranged on the top surface, electrical leads couple the sensor electrodes and the fingerprint identification controller. The coupling leads extend from the top surface along the side surface to the bottom surface.

Abstract: A fingerprint identification device includes a fingerprint identification controller and a fingerprint identification sensor. The fingerprint identification sensor includes a substrate having a top surface, a bottom surface opposite to the top surface, and a side surface coupled between the top surface and the bottom surface. Sensor electrodes are arranged on the top surface, electrical leads couple the sensor electrodes and the fingerprint identification controller. The coupling leads extend from the top surface along the side surface to the bottom surface.

Abstract: The present disclosure provides a fingerprint identification device including a substrate, a contact layer, a processing unit, and a plurality of sensor electrodes. The substrate includes a first sub-substrate, a second sub-substrate, and an adhesive layer. The adhesive layer is between the first sub-substrate and the second sub-substrate. A plurality of first sub-holes is defined in the first sub-substrate. A plurality of second sub-holes is defined in the second sub-substrate. A plurality of third sub-holes is defined in the adhesive layer. One of the first sub-holes communicates a corresponding one of the third sub-holes and a corresponding one of the second sub-holes to define a corresponding hole. An end of each of the sensor electrodes is coupled to the processing unit. The other end of each of the sensor electrodes passes through one of the holes, extends to the contact layer, and is covered by the contact layer.

Abstract: A touch-sensitive device using a printed metal mesh includes a touch sensing film and a display module. The touch sensing film includes a first metal mesh layer and a protection layer. The protection layer covers the first metal mesh layer and is located at a side of the touch sensing film adjacent to the display module.

Abstract: A touch module of a touch device defines a touch area and a trace area surrounding the touch area. The touch module includes a substrate, a number of first sensor electrodes, a number of second sensor electrodes, and a number of conductive traces. The number of first sensor electrodes and the number of second sensor electrodes are arranged in a first region on the substrate corresponding to the touch area. The number of conductive traces are arranged in a second region on the substrate corresponding to the trace area. At least one of the conductive traces includes at least two conductive layers.

Abstract: An array substrate adopted for a liquid crystal display (LCD) device and the liquid crystal display device are provided. The array substrate includes a substrate, a plurality of scan lines, a plurality of data lines, a plurality of switching devices, and an insulating layer, wherein the insulating layer is deposited above the scan lines and the data lines, and has a plurality of free ends. A pair of the free ends faces each other and defines a broken region, and each free end has a tilt down profile with a decreasing width facing the broken region. The profile can avoid the short circuiting between the two adjacent array pixels, which is caused by the residual reflective electrode during the process.

Abstract: An array substrate adapted for a liquid crystal display (LCD) device and the liquid crystal display device are provided. The LCD device includes an opposing substrate, an array substrate, and a liquid crystal layer. The array substrate is disposed opposite to the opposing substrate, and the liquid crystal layer is filled therebetween. The array substrate includes a substrate, a plurality of scan lines, a plurality of data lines, a plurality of switching devices, and an insulating layer. The scan lines are substantially perpendicular to the data lines to define a plurality of array pixels. The switching devices are connected to the corresponding scan lines and the data lines. The insulating layer is deposited above the scan lines and the data lines, and has a plurality of free ends. Two of the free ends define a broken region. Each of the free ends has a tilt down profile with a decreasing width facing the broken region.