Abstract: Various embodiments of the present disclosure are directed towards a shared frontside pad/bridge layout for a three-dimensional (3D) integrated circuit (IC), as well as the 3D IC and a method for forming the 3D IC. A second IC die underlies the first IC die, and a third IC die underlies the second IC die. A first-die backside pad, a second-die backside pad, and a third die backside pad are in a row extending in a dimension and overlie the first, second, and third IC dies. Further, the first-die, second-die, and third-die backside pads are electrically coupled respectively to individual semiconductor devices of the first, second, and third IC dies. The second and third IC dies include individual pad/bridge structures at top metal (TM) layers of corresponding interconnect structures. The pad/bridge structures share the shared frontside pad/bridge layout and provide lateral routing in the dimension for the aforementioned electrical coupling.

Abstract: An electronic device is provided. The electronic device includes a frame, a working panel, a case, and an adhesive material. The frame includes a side wall and a back plate. The working panel is disposed on the back plate. The case is disposed on the frame and adjacent to the working panel. The adhesive material is disposed on the case. The side wall has an outer surface facing away from the working panel. In a cross-section view of the electronic device, a portion of the adhesive material is in contact with the outer surface of the side wall of the frame, and a length of the adhesive material is greater than or equal to 50% of a length of the side wall of the frame along an extension direction.

Abstract: An E-paper display panel including an E-paper display layer, a first substrate, a pixel array layer, a common electrode layer, and a driving circuit is provided. The first substrate is disposed at a first side of the E-paper display layer. The pixel array substrate is disposed between the first substrate and the E-paper display layer and includes touch electrodes and driving pixels arranged in an array. Each driving pixel includes a first pixel electrode and a second pixel electrode. The touch electrodes, the first pixel electrode, and the second pixel electrode are overlapped with each other. The common electrode layer is disposed at a second side of the E-paper display layer. The first side is opposite to the second side. The driving circuit is in signal communication with the common electrode layer and the pixel array layer. The touch electrodes are individually in signal communication with the driving circuit.

Abstract: A modified small interfering RNA (siRNA) molecule comprising phosphorothioate (PS) intemucleotide linkages in the antisense strand for reducing off-target effects and methods and uses thereof. The siRNAs targeting Hypoxia Inducible Factor 1 Subunit Alpha (HIF1a) with high specificity and silencing efficiency.

Abstract: An electronic device is provided. The electronic device includes a frame, a backlight module, a working panel, and a spacer. The backlight module is disposed in the frame. The working panel is disposed on the frame. The spacer is disposed between the frame and the working panel. At least a portion of the working panel and at least a portion of the spacer are in direct contact with an adhesive.

Abstract: An electronic device including an active region and a peripheral region, and includes a substrate including a first edge; a first electrode layer disposed on the substrate; a first conductive glue disposed on the substrate and in the peripheral region; a second conductive glue disposed on the substrate and in the peripheral region; an insulating glue disposed in the peripheral region and overlapped with the first conductive glue and the second conductive glue; and a first metal element fixed on the first electrode layer through the first conductive glue and the insulating glue; wherein in a top view, the insulating glue extends along an extension direction parallel to the first edge, and along the extension direction, a sum of lengths of the first conductive glue and the second conductive glue is less than a length of the insulating glue.

Abstract: An electronic device including an active region and a peripheral region, and includes a substrate including a first edge and a second edge; a first electrode layer disposed on the substrate; a first conductive glue disposed on the substrate and in the peripheral region; a second conductive glue disposed on the substrate and in the peripheral region; an insulating glue overlapped with the first conductive glue and the second conductive glue; and a first metal element fixed on the first electrode layer through the first conductive glue and the insulating glue; wherein in a top view, the insulating glue is disposed in the peripheral region and extends along an extension direction parallel to the first edge, and along the extension direction, a first distance between the first conductive glue and the second edge is greater than a second distance between the second conductive glue and the second edge.

Abstract: An electronic device is provided. The electronic device includes a frame, a working panel, a case, and an adhesive material. The frame includes a side wall and a back plate. The working panel is disposed on the back plate. The case is disposed on the frame and adjacent to the working panel. The adhesive material is disposed on the case. The side wall has an outer surface facing away from the working panel. In a cross-section view of the electronic device, a portion of the adhesive material is in contact with the outer surface of the side wall of the frame, and a length of the adhesive material is greater than or equal to 50% of a length of the side wall of the frame along an extension direction.

Abstract: A method for manufacturing an elastic fiber and the elastic fiber are provided. The method includes: providing a thermoplastic polyester elastomer; drying the thermoplastic polyester elastomer; melting the thermoplastic polyester elastomer by an extruder to form a melt; extruding the melt by a spinneret plate to form a plurality of filamentous streams; feeding the filamentous streams into a spinning channel for cooling and curing to form a plurality of monofilaments; and bundling and oiling the monofilaments by an oil wheel, after extending and guiding the monofilaments by a first godet roller and a second godet roller, and winding the monofilaments by a winder to obtain a thermoplastic polyester elastic fiber.

Abstract: An electronic device includes a substrate, a plurality of flexible circuit boards, a plurality of ICs and an insulator. The flexible circuit boards are disposed on the substrate. In a top view of the electronic device, the flexible circuit boards are overlapped with an edge of the substrate. The ICs are disposed on the substrate. The insulator is disposed on the flexible circuit boards and contacted the ICs, wherein the insulator has a first side and a second side opposite to the first side and the first side is closer to the edge than the second side. Along a first direction perpendicular to an extension direction of the edge, a first minimum distance between the second side and one of the ICs is less than a second minimum distance between the second side and one of the flexible circuit boards.

Abstract: An electronic device including an active region and a peripheral region, and includes a substrate including a first edge and a second edge; a first electrode layer disposed on the substrate; a first conductive glue disposed on the substrate and in the peripheral region; a second conductive glue disposed on the substrate and in the peripheral region; an insulating glue overlapped with the first conductive glue and the second conductive glue; and a first metal element fixed on the first electrode layer through the first conductive glue and the insulating glue; wherein in a top view, the insulating glue is disposed in the peripheral region and extends along an extension direction parallel to the first edge, and along the extension direction, a first distance between the first conductive glue and the second edge is greater than a second distance between the second conductive glue and the second edge.

Abstract: A display device includes a first substrate, a second substrate, a plurality of drive ICs and at least one flexible circuit board. The first substrate has a first region and a second region near to the first region. The second substrate is disposed on the first region and has a lateral side. The plurality of drive ICs are disposed on the second region and arranged along the lateral side. The at least one flexible circuit board is disposed on the second region and disposed correspondingly to the lateral side. Wherein in a top view of the display device, each of the plurality of drive ICs does not overlap with the at least one flexible circuit board in a direction perpendicular to an extending direction of the lateral side.

Abstract: Provided are interfering RNAs (e.g., siRNAs) targeting SARS-CoV (e.g., the POL, Spike, Helicase, or Envelop gene thereof) and therapeutic uses thereof for inhibiting SARS-CoV infection and/or treating diseases associated with the infection (e.g., COVID-19).

Abstract: An electronic device includes a first substrate; a second substrate arranged opposite to the first substrate; a first electrode layer disposed on the first substrate; a display medium layer disposed between the first electrode layer and the second substrate; and a first metal element, wherein the first metal element is fixed on the first electrode layer through a conductive glue and an insulating glue; wherein in a normal direction of the first substrate, the conductive glue and the insulating glue are overlapped.

Abstract: An electronic device is provided. The electronic device includes a frame, a backlight module, a working panel, and a spacer. The backlight module is disposed in the frame. The working panel is disposed on the frame. The spacer is disposed between the frame and the working panel. At least a portion of the working panel and at least a portion of the spacer are in direct contact with an adhesive.

Abstract: An electronic device is provided. The electronic device includes a frame, a working panel, a case, and a tape. The frame includes a side wall and a back plate. The side wall has an outer surface. The back plate has a back plate surface. The extension direction of the back plate is different from the extension direction of the side wall. The working panel is disposed on the back plate. The working panel has a working panel surface, and the back plate surface faces away the working panel. The case is disposed on the back plate and having a case surface. The case surface is higher than the side wall. The tape is in contact with at least a portion of the outer surface and at least a portion of the working panel surface.

Abstract: An electronic device is provided, including a frame, a working panel, and a spacer. The frame includes a side wall. The working panel is disposed on the frame. The spacer is disposed between the frame and the working panel. At least a portion of the working panel and at least a portion of the spacer are in direct contact with an adhesive.

Abstract: An electronic device includes a first substrate; a second substrate arranged opposite to the first substrate; a first electrode layer disposed on the first substrate; a display medium layer disposed between the first electrode layer and the second substrate; and a first metal element, wherein the first metal element is fixed on the first electrode layer through a conductive glue and an insulating glue; wherein in a normal direction of the first substrate, the conductive glue and the insulating glue are overlapped.

Abstract: The disclosure provides an electronic device, including a base, a flexible substrate, and a plurality of wires. The base has an active area and a peripheral area. The flexible substrate is disposed on the peripheral area and the base. The plurality of wires are disposed on the base and the flexible substrate. The plurality of wires extend from the active area to the peripheral area, and the peripheral area partially overlaps the frame portion. The plurality of wires extend along the frame portion to the extension portion. And the flexible substrate is provided between the plurality of wires and the base. The electronic device in the disclosure is conducive to providing smaller wire pitch, reducing the difficulty in connecting the electronic device and the leads of an external circuit board.

Abstract: An electronic device is provided, including a frame, a backlight module, a working panel, and a tape. The frame includes a side wall and a back plate. The side wall includes an outer surface. The extension direction of the back plate is different from the extension direction of the side wall. The backlight module is disposed on the back plate. The working panel and the back plate are disposed on the opposite sides of the backlight module. The tape is in contact with at least a portion of the outer surface and the working panel.