Patents by Inventor Chiachung Lee

Chiachung Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6394722
    Abstract: An insert according to the present invention has a very low transverse Coefficient of Thermal Expansion. This is the result of an isolation and compensation structure formed by a sleeve surrounding a post. The sleeve isolates the post from the thermal expansion effects of the panel. This eliminates the influence of thermal expansion/contraction of both the panel and the bonding material. Since the post itself will also expand and contract with temperature, the attachment point of the post to the sleeve is deliberately selected so as to compensate for the post's own dimensional changes.
    Type: Grant
    Filed: October 26, 1999
    Date of Patent: May 28, 2002
    Assignee: Swales Aerospace
    Inventors: Cengiz Kunt, Chiachung Lee