Abstract: A thin film transistor includes an active layer located over a substrate, a first gate stack including a stack of a first gate dielectric and a first gate electrode and located on a first surface of the active layer, a pair of first contact electrodes contacting peripheral portions of the first surface of the active layer and laterally spaced from each other along a first horizontal direction by the first gate electrode, a second contact electrode contacting a second surface of the active layer that is vertically spaced from the first surface of the active layer, and a pair of second gate stacks including a respective stack of a second gate dielectric and a second gate electrode and located on a respective peripheral portion of a second surface of the active layer.

Abstract: A dual mode charge control method includes steps of: detecting an input voltage of the resonance tank, a resonance current of the resonance tank, an output current of the load, and an output voltage of the load; performing a single-band charge control when determining a light-load condition or a no-load condition of the load according to the output current; compensating the output voltage to generate an upper threshold voltage in the single-band charge control, and acquiring a resonance voltage by calculating the resonance current by a resettable integrator; comparing the resonance voltage and the upper threshold voltage to generate a first control signal; generating a second control signal complementary to the first control signal by a pulse-width modulation duplicator; providing the first control signal and the second control signal to respectively control a first power switch and a second power switch of the resonance circuit.

Abstract: A development system and a method of an offline software-in-the-loop simulation are disclosed. A common firmware architecture generates a chip control program. The common firmware architecture has an application layer and a hardware abstraction layer. The application layer has a configuration header file and a product program. A processing program required by a peripheral module is added to the hardware abstraction layer during compiling. The chip control program is provided to a controller chip or a circuit simulation software to be executed to control the product-related circuit through controlling the peripheral module.

Abstract: An acute kidney injury predicting system and a method thereof are proposed. A processor reads the data to be tested, the detection data, the machine learning algorithm and the risk probability comparison table from a main memory. The processor trains the detection data according to the machine learning algorithm to generate an acute kidney injury prediction model, and inputs the data to be tested into the acute kidney injury prediction model to generate an acute kidney injury characteristic risk probability and a data sequence table. The data sequence table lists the data to be tested in sequence according to a proportion of each of the data to be tested in the acute kidney injury characteristics. The processor selects one of the medical treatment data from the risk probability comparison table according to the acute kidney injury characteristic risk probability.

Abstract: In an embodiment, a package includes a first device and a second device attached to a first redistribution structure, wherein the second device includes a second redistribution structure, a first die disposed over the second redistribution structure, a first encapsulant extending along sidewalls of the first die, a first via extending through the first encapsulant, a third redistribution structure disposed over the first encapsulant and including a first metallization pattern connecting to the first via, a second die disposed over the third redistribution structure, and a second encapsulant extending along sidewalls of the second die, the first die and the second die being free of through substrate vias. The package also includes a third encapsulant disposed over the first redistribution structure and surrounding sidewalls of the first device and the second device, wherein top surfaces of the second encapsulant and the third encapsulant are level with each other.

Abstract: A method includes performing a plasma activation on a surface of a first package component, removing oxide regions from surfaces of metal pads of the first package component, and performing a pre-bonding to bond the first package component to a second package component.

Abstract: A system including a processor configured to perform generating a plurality of different layout blocks; selecting, among the plurality of layout blocks, layout blocks corresponding to a plurality of blocks in a floorplan of a circuit; combining the selected layout blocks in accordance with the floorplan into a layout of the circuit; and storing the layout of the circuit in a cell library or using the layout of the circuit to generate a layout for an integrated circuit (IC) containing the circuit. Each of the plurality of layout blocks satisfies predetermined design rules and includes at least one of a plurality of different first block options associated with a first layout feature, and at least one of a plurality of different second block options associated with a second layout feature different from the first layout feature.

Abstract: The present application discloses a method for measuring critical dimension. The method for measuring critical dimension includes providing a substrate; forming a resist layer over the substrate; monitoring a volatile byproduct evolved from the resist layer to obtain a first amount of the volatile byproduct; exposing the resist layer to a radiation source; heating the resist layer; monitoring the volatile byproduct evolved from the resist layer to obtain a second amount of the volatile byproduct; and deducting the critical dimension according to a difference between the first amount of the volatile byproduct and the second amount of the volatile byproduct.

Abstract: The present application discloses a method for measuring critical dimension. The method for measuring critical dimension includes providing a substrate; forming a resist layer over the substrate; monitoring a volatile byproduct evolved from the resist layer to obtain a first amount of the volatile byproduct; exposing the resist layer to a radiation source; heating the resist layer; monitoring the volatile byproduct evolved from the resist layer to obtain a second amount of the volatile byproduct; and deducting the critical dimension according to a difference between the first amount of the volatile byproduct and the second amount of the volatile byproduct.

Abstract: An ear cup structure including an ear cup shell, a cover, a discharge hole, a speaker, and a guide channel is provided. The ear cup shell has at least a first accommodating space and a second accommodating space spaced from each other, and the second accommodating space has a second opening. The cover covers the second opening of the second accommodating space. The discharge hole is formed between the ear cup shell and the cover. The speaker is disposed in the second accommodating space, thereby dividing the second accommodating space into a front chamber and a rear chamber. The guide channel is communicated with a peripheral side of the rear chamber and is disposed between the rear chamber and the discharge hole. An airflow produced by the speaker in the rear chamber flows through the guide channel and is discharged to an external environment from the discharge hole.

Abstract: A head phone structure includes an earmuff casing and a speaker. The earmuff casing includes a first casing and a second casing. A first accommodating space and a first chamber are formed between the first casing and the second casing, and the first chamber is formed outside the first accommodating space. The speaker is disposed in the first accommodating space of the earmuff casing and at least includes a frame and a vibration system. A second chamber is defined and formed by the frame and the vibration system. An airflow is generated in the second chamber when the vibration system vibrates. The second chamber communicates with the first chamber of the earmuff casing.

Abstract: A speaker includes a frame, a first tuning portion, a vibration system and a magnetic circuit system. The frame has a lateral wall, a bottom wall, an accommodation space defined by the lateral wall and the bottom wall and an opening end located at a top end of the accommodation space. The first tuning portion is formed on the lateral wall of the frame. The vibration system is disposed in the accommodation space of the frame and has a vibration film vibrating along an axial direction of the frame. A rear chamber is defined by the vibration film and the bottom wall of the frame. The magnetic circuit system is disposed in the accommodation space of the frame. When the vibration film vibrates, an airflow generated in the rear chamber flows along the first tuning portion on the lateral wall and exits, so as to form a first tuning path.

Abstract: An ear cup structure including an ear cup shell, a cover, a discharge hole, a speaker, and a guide channel is provided. The ear cup shell has at least a first accommodating space and a second accommodating space spaced from each other, and the second accommodating space has a second opening. The cover covers the second opening of the second accommodating space. The discharge hole is formed between the ear cup shell and the cover. The speaker is disposed in the second accommodating space, thereby dividing the second accommodating space into a front chamber and a rear chamber. The guide channel is communicated with a peripheral side of the rear chamber and is disposed between the rear chamber and the discharge hole. An airflow produced by the speaker in the rear chamber flows through the guide channel and is discharged to an external environment from the discharge hole.

Abstract: A speaker includes a frame, a first tuning portion, a vibration system and a magnetic circuit system. The frame has a lateral wall, a bottom wall, an accommodation space defined by the lateral wall and the bottom wall and an opening end located at a top end of the accommodation space. The first tuning portion is formed on the lateral wall of the frame. The vibration system is disposed in the accommodation space of the frame and has a vibration film vibrating along an axial direction of the frame. A rear chamber is defined by the vibration film and the bottom wall of the frame. The magnetic circuit system is disposed in the accommodation space of the frame. When the vibration film vibrates, an airflow generated in the rear chamber flows along the first tuning portion on the lateral wall and exits, so as to form a first tuning path.

Abstract: A head phone structure includes an earmuff casing and a speaker. The earmuff casing includes a first casing and a second casing. A first accommodating space and a first chamber are formed between the first casing and the second casing, and the first chamber is formed outside the first accommodating space. The speaker is disposed in the first accommodating space of the earmuff casing and at least includes a frame and a vibration system. A second chamber is defined and formed by the frame and the vibration system. An airflow is generated in the second chamber when the vibration system vibrates. The second chamber communicates with the first chamber of the earmuff casing.

Abstract: An earphone has a housing with a signal process unit to output sound. The housing has a chamber and a speaker mounted inside the chamber. The chamber is defined as a front volume and a rear volume by the speaker, and the rear volume having a port. Wherein the speaker in the volume outputting a chamber frequency response curve is at least a portion higher than the earphone's ideal frequency response curve at the bandwidth ranging from 20 Hz to 1000 Hz, where creates a gain difference between the chamber frequency response curve and the ideal frequency response curve to be decreased the (superfluous) positive value by a signal process unit at the bandwidth ranging from 20 Hz to 1000 Hz. Therefore, the total acoustic energy is maintained, the earphone acoustic quality is preserved, and the earphone volume may output even higher power to be deduced by the signal process unit for lowering down the circuit power consumption.

Abstract: An earphone including a housing, a first speaker and an audio outlet is provided. The housing includes an insertion end and a main body. The insertion end is into the entrance of a user's ear when worn by the user, and the main body extends from the insertion end and defines an auricle contact surface and an external connecting surface opposite to the auricle contact surface. The auricle contact surface faces the user's auricle and the external connecting surface communicates to the external environment when the earphone is worn. The first speaker is contained within the main body to divide into a front chamber and a first rear chamber. A part of the first rear chamber is adjacent to the auricle contact surface. A sound output surface of the first speaker faces the external connecting surface. The audio outlet is formed in the insertion end to let out the sound.

Abstract: An earphone has a housing with a signal process unit to output sound. The housing has a chamber and a speaker mounted inside the chamber. The chamber is defined as a front volume and a rear volume by the speaker, and the rear volume having a port. Wherein the speaker in the volume outputting a chamber frequency response curve is at least a portion higher than the earphone's ideal frequency response curve at the bandwidth ranging from 20 Hz to 1000 Hz, where creates a gain difference between the chamber frequency response curve and the ideal frequency response curve to be decreased the (superfluous) positive value by a signal process unit at the bandwidth ranging from 20 Hz to 1000 Hz. Therefore, the total acoustic energy is maintained, the earphone acoustic quality is preserved, and the earphone volume may output even higher power to be deduced by the signal process unit for lowering down the circuit power consumption.

Abstract: A microphone device including a first sound receiving module, a second sound receiving module and a sound collecting trough is provided. The first sound receiving module receives a sound signal to output a first electronic signal. The second sound receiving module receives the sound signal to output a second electronic signal. The first sound receiving module is coupled to the second sound receiving module, and the phase of the first electronic signal and the phase of the second electronic signal are inverse to each other. A distance between the first sound receiving module and the sound collecting trough is smaller than a distance between the second sound receiving module and the sound collecting trough, and another sound signal is transferred to the first sound receiving module through the sound collecting trough.

Abstract: An earphone including a housing, a first speaker and an audio outlet is provided. The housing includes an insertion end and a main body. The insertion end is into the entrance of a user's ear when worn by the user, and the main body extends from the insertion end and defines an auricle contact surface and an external connecting surface opposite to the auricle contact surface. The auricle contact surface faces the user's auricle and the external connecting surface communicates to the external environment when the earphone is worn. The first speaker is contained within the main body to divide into a front chamber and a first rear chamber. A part of the first rear chamber is adjacent to the auricle contact surface. A sound output surface of the first speaker faces the external connecting surface. The audio outlet is formed in the insertion end to let out the sound.