Abstract: A light-emitting diode (LED) element including an LED chip having a light emitting surface and at least one pad. A phosphor layer is formed on the light emitting surface and exposes the at least one pad. The phosphor layer includes a plurality of phosphor particles and a matrix. At least some of the phosphor particles have a first portion embedded in the matrix and a second portion protruding from an outer surface of the matrix. A method of forming a gel layer on an LED element includes using capillary action to draw the glue material into a space adjacent the upper surface of the chip.

Abstract: A light emitting diode package structure is disclosed. The LED package structure includes a carrier, an LED chip, a first molding compound and a second molding compound. The LED chip is disposed on the carrier. The first molding compound overlays the LED chip, wherein the first molding compound is mixed up with a fluorescent material. The second molding compound overlays the first molding compound.

Abstract: A manufacturing method of a light emitting diode package structure is disclosed. First, a carrier and an LED chip are provided, wherein the LED chip is disposed on the carrier. Next, a first molding compound is provided on the LED chip, wherein the first molding compound is mixed up with a fluorescent material. Then, a first baking process to make the first molding compound in semi-cured state is performed. After that, a second molding compound is provided on the first molding compound.