Patents by Inventor Chia-Feng HSIAO

Chia-Feng HSIAO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wafer backside defect detection method and wafer backside defect detection apparatus
    Patent number: 11821847
    Abstract: A wafer backside defect detection method and a wafer backside defect detection apparatus are provided. The wafer backside defect detection method includes the following steps. A peripheral edge area of a wafer backside image that at least one notch is located is cropped off. Adjacent white pixels on the wafer backside image are connected to obtain a plurality of abnormal regions. If a total area of top N of the abnormal regions is more than 10% of an area of the wafer, it is deemed that the wafer has a roughness defect. N is a natural number. If the total area of the top N of the abnormal regions is less than 1% of the area of the wafer and a largest abnormal region of the abnormal regions is longer than a predetermined length, it is deemed that the wafer has a scratch defect.
    Type: Grant
    Filed: July 20, 2021
    Date of Patent: November 21, 2023
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Cheng-Hsien Chen, Chia-Feng Hsiao, Chung-Hsuan Wu, Chen-Hui Huang, Nai-Ying Lo, En-Wei Tsui, Yung-Yu Yang, Chen-Hsuan Hung
  • Automatic detection method and automatic detection system for detecting crack on wafer edges
    Patent number: 11644427
    Abstract: An automatic detection method and an automatic detection system for detecting any crack on wafer edges are provided. The automatic detection method includes the following steps. Several wafer images of several wafers are obtained. The wafer images are integrated to create a templet image. Each of the wafer images is compared with the templet image to obtain a differential image. Each of the differential images is binarized. Each of the differential images which are binarized is de-noised. Whether each of the differential images has an edge crack is detected according to pattern of each of the differential images which are de-noised.
    Type: Grant
    Filed: November 23, 2020
    Date of Patent: May 9, 2023
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Chia-Feng Hsiao, Chung-Hsuan Wu, Shuo-Yu Chen, Nai-Ying Lo, Yi-Hui Tseng, Chen-Hui Huang, Yung-Yu Yang, Tzu-Ping Kao
  • WAFER BACKSIDE DEFECT DETECTION METHOD AND WAFER BACKSIDE DEFECT DETECTION APPARATUS
    Publication number: 20230024259
    Abstract: A wafer backside defect detection method and a wafer backside defect detection apparatus are provided. The wafer backside defect detection method includes the following steps. A peripheral edge area of a wafer backside image that at least one notch is located is cropped off. Adjacent white pixels on the wafer backside image are connected to obtain a plurality of abnormal regions. If a total area of top N of the abnormal regions is more than 10% of an area of the wafer, it is deemed that the wafer has a roughness defect. N is a natural number. If the total area of the top N of the abnormal regions is less than 1% of the area of the wafer and a largest abnormal region of the abnormal regions is longer than a predetermined length, it is deemed that the wafer has a scratch defect.
    Type: Application
    Filed: July 20, 2021
    Publication date: January 26, 2023
    Inventors: Cheng-Hsien CHEN, Chia-Feng HSIAO, Chung-Hsuan WU, Chen-Hui HUANG, Nai-Ying LO, En-Wei TSUI, Yung-Yu YANG, Chen-Hsuan HUNG
  • AUTOMATIC DETECTION METHOD AND AUTOMATIC DETECTION SYSTEM FOR DETECTING CRACK ON WAFER EDGES
    Publication number: 20220128485
    Abstract: An automatic detection method and an automatic detection system for detecting any crack on wafer edges are provided. The automatic detection method includes the following steps. Several wafer images of several wafers are obtained. The wafer images are integrated to create a templet image. Each of the wafer images is compared with the templet image to obtain a differential image. Each of the differential images is binarized. Each of the differential images which are binarized is de-noised. Whether each of the differential images has an edge crack is detected according to pattern of each of the differential images which are de-noised.
    Type: Application
    Filed: November 23, 2020
    Publication date: April 28, 2022
    Inventors: Chia-Feng HSIAO, Chung-Hsuan WU, Shuo-Yu CHEN, Nai-Ying LO, Yi-Hui TSENG, Chen-Hui HUANG, Yung-Yu YANG, Tzu-Ping KAO