Abstract: A semiconductor structure includes a first gate structure, a second gate structure coupled to the first gate structure, a source region, a first drain region, and a second drain region. The source region is surrounded by the first gate structure and the second gate structure. The first drain region is separated from the source region by the first gate structure. The second drain region is separated from the source region by the second gat structure. A shape of the first drain region and a shape of the second drain region are different from each other from a plan view.

Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above-mentioned memory device is also provided.

Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above- mentioned memory device is also provided.

Abstract: Disclosed are compositions and methods for performing a proteomic analysis. Particularly disclosed are compositions and methods for preparing a sample for quantitative single-cell proteomics.

Abstract: Improved methods of performing proteomic analysis are described wherein single cell samples are placed into nanowells disposed on chips that also contain a booster sample of known peptides. Once the samples are placed, these singles cells are lysed and peptides are extracted. These peptides are then labeled using TMT labels and combined with labeled boosting peptides to form a mixed sample. The mixed sample is then separated using an LC separation system and the separated sample is then passed through a mass spectrometer to acquire data of the peptide characterization data from the separated sample. Various modifications and alterations to the MS acquisition process that enhance the effectiveness of the process are also described.

Abstract: Provided is a method for identifying proteins capable of increasing the number of identified proteins contained in a target sample derived from blood. A protein contained in the target sample derived from blood is fragmented, and a protein contained in an having less bias in a quantity ratio of proteins than the target sample is fragmented, and the fragmented proteins are mixed (Steps S101 to S103). In this manner, the mixed sample in which the bias in a quantity ratio of proteins is less than that of the target sample is generated. By performing MS/MS measurement using the generated mixed sample (Step S107), an MS/MS spectrum of a peak derived from a protein contained in a small amount in the target sample can be prevented from being missed. Accordingly, the number of identified proteins contained in the target sample derived from blood can be increased.

Abstract: The present invention provides a method of inducing hair follicle neogenesis in the skin of a subject in need by transplanting the mixture of the skin extract or the composition with epidermal cells or fibroblasts into the subject. The skin extract of the present invention is obtained by mincing and mixing a skin tissue with phosphate buffer solution, thawing the skin tissue after freeze. The composition of the present invention includes at least lumican, galectin-1 and apolipoprotein A-I.

Abstract: The present invention provides a method of inducing hair follicle neogenesis in the skin of a subject in need by transplanting the mixture of the skin extract or the composition with epidermal cells or fibroblasts into the subject. The skin extract of the present invention is obtained by mincing and mixing a skin tissue with phosphate buffer solution, thawing the skin tissue after freeze. And the composition of the present invention includes at least lumican, galectin-1 and apolipoprotein A-I.