Abstract: A sensor network includes a first sensor, a second sensor and a controller. The first sensor is used to acquire a first type of data. The second sensor is arranged in proximity to the first sensor, and used to acquire a second type of data. The controller is coupled to the first sensor and the second sensor, and used to compute a correlation between the first type of data and the second type of data, and when the correlation exceeds a correlation threshold, control the first sensor to operate according to the second type of data.

Abstract: Methods and systems for media file management are provided. When a plurality of media files in the electronic device are viewed, media data is real-time generated for the media files. In the generation of the media data, the media files are analyzed to obtain a theme for the media files. Then, a script file is identified according to the theme, and media data is produced for the media files according to the script file. In some embodiments, a frame buffer used for storing the media data is refreshed after each frame of the media data is rendered.

Abstract: Methods and systems for media file management are provided. When a plurality of media files in the electronic device are viewed, media data is real-time generated for the media files. In the generation of the media data, the media files are analyzed to obtain a theme for the media files. Then, a script file is identified according to the theme, and media data is produced for the media files according to the script file. In some embodiments, a frame buffer used for storing the media data is refreshed after each frame of the media data is rendered.

Abstract: An ink cartridge is provided with a body, a channel module attached to the body, a plurality of first engaging parts, and a plurality of second engaging parts. The first engaging parts are arranged on one of the body and the channel module, while the second engaging parts corresponding to the first engaging parts are arranged on the other of the body and the channel module. The relative position of the body and the channel module on a two-dimension plane is substantially fixed by the engagement of the first engaging parts and the second engaging parts.

Abstract: A semiconductor package with an electromagnetic shield is disclosed. The semiconductor package includes two substrates (102, 202; 103, 203) and an electromagnetic shield (101, 201). Each substrate has at least one die (108, 208; 112, 212) provided thereon. The electromagnetic shield is disposed between the two substrates for shielding electromagnetic interference between adjacent dies of the two substrates. One of the two substrates defines a cavity (109, 209) for partially accommodating the electromagnetic shield. Accordingly, the overall vertical height and the volume of the semiconductor package are not increased, and the heat dissipation efficiency of the semiconductor package is enhanced.

Abstract: A semiconductor package includes a lead frame, at least one chip, and an encapsulation. The lead frame has a plurality of leads, and each of the leads includes at least one first conductive part, at least one second conductive part, and at least one third conductive part. The first conductive part is not electrically connected to the second conductive part, and the second conductive part is electrically connected to the third conductive part. The chip is electrically connected to the first conductive part. The encapsulation encapsulates the chip and at least a portion of the lead frame, and forms a first surface and a second surface opposite to the first surface. The first conductive part and the third conductive part are exposed from the first surface, and the second conductive part is exposed from the second surface.

Abstract: A semiconductor package with electromagnetic shielding capabilities is disclosed. The semiconductor package includes a substrate (101), a plurality of semiconductor dies (102), a plurality of shielding metal elements (103), a plurality of grounding metal elements (104) and a plurality of conductive metal elements (110). The semiconductor dies are disposed on an upper surface (105) of the substrate along a horizontal direction. The shielding metal elements are provided on the upper surface of the substrate, and are arranged between and around the semiconductor dies so that each semiconductor die is surrounded by the shielding metal elements and thus electromagnetic interference in the horizontal direction can be effectively shielded from each semiconductor die.

Abstract: A semiconductor package includes a lead frame, at least one chip, and an encapsulation. The lead frame has a plurality of leads, and each of the leads includes at least one first conductive part, at least one second conductive part, and at least one third conductive part. The first conductive part is not electrically connected to the second conductive part, and the second conductive part is electrically connected to the third conductive part. The chip is electrically connected to the first conductive part. The encapsulation encapsulates the chip and at least a portion of the lead frame, and forms a first surface and a second surface opposite to the first surface. The first conductive part and the third conductive part are exposed from the first surface, and the second conductive part is exposed from the second surface.

Abstract: A semiconductor package includes a carrier, at least one chip, an encapsulation, and a patterned conductive film. The carrier has a first surface and a second surface opposite to the first surface. The chip is disposed on the first surface of the carrier and electrically connected to the carrier. The encapsulation encapsulates the chip and at least a portion of the first surface of the carrier. The patterned conductive film is disposed on the encapsulation to electrically connect to the carrier. A manufacturing method of the semiconductor package is also disclosed.

Abstract: A semiconductor package with electromagnetic shielding capabilities is disclosed. The semiconductor package includes a substrate (101), a plurality of semiconductor dies (102), a plurality of shielding metal elements (103), a plurality of grounding metal elements (104) and a plurality of conductive metal elements (110). The semiconductor dies are disposed on an upper surface (105) of the substrate along a horizontal direction. The shielding metal elements are provided on the upper surface of the substrate, and are arranged between and around the semiconductor dies so that each semiconductor die is surrounded by the shielding metal elements and thus electromagnetic interference in the horizontal direction can be effectively shielded from each semiconductor die.

Abstract: A semiconductor package with an electromagnetic shield is disclosed. The semiconductor package includes two substrates (102, 202; 103, 203) and an electromagnetic shield (101, 201). Each substrate has at least one die (108, 208; 112, 212) provided thereon. The electromagnetic shield is disposed between the two substrates for shielding electromagnetic interference between adjacent dies of the two substrates. One of the two substrates defines a cavity (109, 209) for partially accommodating the electromagnetic shield. Accordingly, the overall vertical height and the volume of the semiconductor package are not increased, and the heat dissipation efficiency of the semiconductor package is enhanced.

Abstract: An ink cartridge is provided with a body, a channel module attached to the body, a plurality of first engaging parts, and a plurality of second engaging parts. The first engaging parts are arranged on one of the body and the channel module, while the second engaging parts corresponding to the first engaging parts are arranged on the other of the body and the channel module. The relative position of the body and the channel module on a two-dimension plane is substantially fixed by the engagement of the first engaging parts and the second engaging parts.

Abstract: A heat sink assembly for an integrated circuit comprises a base plate defining a central opening and an integrated circuit receiving slot, a fin plate defining a downwardly extending protrusion, a fan fixedly mounted on a top of the fin, and screws for connecting the fin plate and the base plate together whereby the downwardly extending protrusion of the fin plate is extended through the opening of the base plate.