Patents by Inventor Chia-Han Chuang

Chia-Han Chuang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250098219
    Abstract: A device includes: a substrate having a semiconductor fin; a stack of semiconductor channels on the substrate and positioned over the fin; a gate structure wrapping around the semiconductor channels; a source/drain abutting the semiconductor channels; an inner spacer positioned between the stack of semiconductor channels and the fin; an undoped semiconductor layer vertically adjacent the source/drain and laterally adjacent the fin; and an isolation structure that laterally surrounds the undoped semiconductor layer, the isolation structure being between the source/drain and the inner spacer.
    Type: Application
    Filed: February 15, 2024
    Publication date: March 20, 2025
    Inventors: Jung-Hung CHANG, Shih-Cheng CHEN, Tsung-Han CHUANG, Fu-Cheng CHANG, Wen-Ting LAN, Chia-Cheng TSAI, Kuo-Cheng CHIANG, Chih-Hao WANG, Wang-Chun Huang, Shi-Syuan Huang
  • Publication number: 20250098237
    Abstract: Semiconductor structures and methods of forming the same are provided. In an embodiment, an exemplary semiconductor structure includes a first transistor. The first transistor includes a first gate structure wrapping around a plurality of first nanostructures disposed over a substrate, a first source/drain feature electrically coupled to a topmost nanostructure of the plurality of first nanostructures and isolated from a bottommost nanostructure of the plurality of first nanostructures by a first dielectric layer, and a first semiconductor layer disposed between the substrate and the first source/drain feature, wherein the first source/drain feature is in direct contact with a top surface of the first semiconductor layer.
    Type: Application
    Filed: January 4, 2024
    Publication date: March 20, 2025
    Inventors: Jung-Hung Chang, Shih-Cheng Chen, Tsung-Han Chuang, Wen-Ting Lan, Chia-Cheng Tsai, Kuo-Cheng Chiang, Chih-Hao Wang
  • Patent number: 12005481
    Abstract: An embodiment system, configured to clean a semiconductor package assembly, may include a sprayer device including a plurality of nozzles configured to direct a pressurized cleaning fluid toward the semiconductor package assembly; a conveyor configured to move the semiconductor package assembly relative to the sprayer device along a first direction; and a dryer spatially displaced from the sprayer device and configured to direct a pressurized gas flow toward the semiconductor package assembly to remove cleaning fluid introduced by the sprayer device. Each of the plurality of nozzles may be displaced from one another along a second direction to thereby generate respective separate spray distribution patterns. Adjacent nozzles may be further displaced from one another along a third direction to thereby a reduce an overlap of adjacent spray distribution patterns relative to a configuration in which the adjacent nozzles are not displaced from one another along the third direction.
    Type: Grant
    Filed: April 19, 2022
    Date of Patent: June 11, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: Ying-Hao Wang, Chien-Lung Chen, Chia-Han Chuang, Jhe-Hong Wang, Chien-Chi Tzeng
  • Publication number: 20230405643
    Abstract: An embodiment system, configured to clean a semiconductor package assembly, may include a sprayer device including a plurality of nozzles configured to direct a pressurized cleaning fluid toward the semiconductor package assembly; a conveyor configured to move the semiconductor package assembly relative to the sprayer device along a first direction; and a dryer spatially displaced from the sprayer device and configured to direct a pressurized gas flow toward the semiconductor package assembly to remove cleaning fluid introduced by the sprayer device. Each of the plurality of nozzles may be displaced from one another along a second direction to thereby generate respective separate spray distribution patterns. Adjacent nozzles may be further displaced from one another along a third direction to thereby a reduce an overlap of adjacent spray distribution patterns relative to a configuration in which the adjacent nozzles are not displaced from one another along the third direction.
    Type: Application
    Filed: July 31, 2023
    Publication date: December 21, 2023
    Inventors: Ying-Hao Wang, Chien-Lung Chen, Chia-Han Chuang, Jhe-Hong Wang, Chien-Chi Tzeng
  • Publication number: 20230330710
    Abstract: An embodiment system, configured to clean a semiconductor package assembly, may include a sprayer device including a plurality of nozzles configured to direct a pressurized cleaning fluid toward the semiconductor package assembly; a conveyor configured to move the semiconductor package assembly relative to the sprayer device along a first direction; and a dryer spatially displaced from the sprayer device and configured to direct a pressurized gas flow toward the semiconductor package assembly to remove cleaning fluid introduced by the sprayer device. Each of the plurality of nozzles may be displaced from one another along a second direction to thereby generate respective separate spray distribution patterns. Adjacent nozzles may be further displaced from one another along a third direction to thereby a reduce an overlap of adjacent spray distribution patterns relative to a configuration in which the adjacent nozzles are not displaced from one another along the third direction.
    Type: Application
    Filed: April 19, 2022
    Publication date: October 19, 2023
    Inventors: Ying-Hao Wang, Chien-Lung Chen, Chia-Han Chuang, Jhe-Hong Wang, Chien-Chi Tzeng