Patents by Inventor Chia-Han HO

Chia-Han HO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • THREE DIMENSIONAL INTEGRATED CIRCUIT AND FABRICATION THEREOF
    Publication number: 20240395698
    Abstract: A method includes following steps. A dielectric layer is formed over a substrate. A transition metal-containing layer is deposited on the dielectric layer. The transition metal-containing layer is patterned into a plurality of transition metal-containing pieces. The transition metal-containing pieces are sulfurized or selenized to form a plurality of semiconductor seeds. Semiconductor films are grown from semiconductor seeds. Transistors are formed on the semiconductor films.
    Type: Application
    Filed: July 30, 2024
    Publication date: November 28, 2024
    Applicants: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., NATIONAL YANG MING CHIAO TUNG UNIVERSITY
    Inventors: Chenming HU, Shu-Jui CHANG, Chen-Han CHOU, Yen-Teng HO, Chia-Hsing WU, Kai-Yu PENG, Cheng-Hung SHEN
  • METAL ALLOY COMPOSITES
    Publication number: 20180171435
    Abstract: This invention relates to metal composites and to metal-alloy composites. Metal-alloy composites of this invention comprise a metal alloy and layered inorganic nanostructures or nanoparticles such as nanotubes, nanoscrolls, spherical or quasi-spherical nanoparticles, nano-platelets or combinations thereof. Methods of producing the metal composites and the metal-alloy composites are demonstrated. The layered inorganic nanostructure serves as a strengthening phase. The layered inorganic nanostructure provides reinforcement to the metal alloy.
    Type: Application
    Filed: June 1, 2016
    Publication date: June 21, 2018
    Applicant: YADA RESEARCH AND DEVELOPMENT CO. LTD.
    Inventors: Reshef TENNE, Song-Jeng HUANG, Chia-Han HO