Abstract: Provided are a package structure and a method of forming the same. The method includes: forming an interconnect structure on a substrate; performing a laser grooving process to form a first opening in the interconnect structure and form a debris layer on a sidewall of the first opening in a same step; forming a protective layer to fill in the first opening and cover the debris layer and the interconnect structure; patterning the protective layer to form a second opening, wherein the second opening is spaced from the debris layer by the protective layer; performing a planarization process on the protective layer to expose a topmost contact pad of the interconnect structure; and performing a mechanical dicing process through the second opening to form a third opening in the substrate and cut the substrate into a plurality of semiconductor dies.

Abstract: A semiconductor structure is provided. The semiconductor structure includes a substrate, a channel layer, a barrier layer, a compound semiconductor layer, a gate electrode, and a stack of dielectric layers. The channel layer is disposed on the substrate. The barrier layer is disposed on the channel layer. The compound semiconductor layer is disposed on the barrier layer. The gate electrode is disposed on the compound semiconductor layer. The stack of dielectric layers is disposed on the gate electrode. The stack of dielectric layers includes layers having different etching rates.

Abstract: A communication apparatus and a test method thereof are provided. The communication apparatus includes a wireless communication module, a wireless driver and an application unit. The test method of the communication apparatus includes the following steps: after the communication apparatus performs a booting operation, setting an operation mode as a default mode by the wireless driver to activate a first wireless interface and a second wireless interface of the wireless communication module, and controlling the wireless communication module by the wireless driver to not transmit a wireless signal. The test method further includes re-setting the operation mode according to a test item, by the application unit when the application unit receives an execution command, so that the wireless driver controls the wireless communication module to transmit the wireless signal corresponding to the operation mode.

Abstract: A communication apparatus and a test method thereof are provided. The communication apparatus includes a wireless communication module, a wireless driver and an application unit. The test method of the communication apparatus includes the following steps: after the communication apparatus performs a booting operation, setting an operation mode as a default mode by the wireless driver to activate a first wireless interface and a second wireless interface of the wireless communication module, and controlling the wireless communication module by the wireless driver to not transmit a wireless signal. The test method further includes re-setting the operation mode according to a test item, by the application unit when the application unit receives an execution command, so that the wireless driver controls the wireless communication module to transmit the wireless signal corresponding to the operation mode.

Abstract: The invention relates to a frame structure for light emitting diodes comprises plastic stand having a containing room with a conical opening and at least two metal frames being not connected, relatively arranged in the containing room of the plastic stand and one of the metal frames having a concave chip bearing stand for bearing light emitting diodes wherein the conical opening of the plastic stand is greater than the concave chip bearing stand and the concave chip bearing stand has a bottom edge revealed at a bottom of the plastic stand; the area of the concave chip bearing stand is greater than 40% of the area of the conical opening of the plastic stand to increase the cooling area of the metal frames for the light-emitting diodes with the different wattage sharing the same specification frame structure to reduce the cost of metal frames molding.

Abstract: The invention relates to a frame structure for light emitting diodes comprises plastic stand having a containing room with a conical opening and at least two metal frames being not connected, relatively arranged in the containing room of the plastic stand and one of the metal frames having a concave chip bearing stand for bearing light emitting diodes wherein the conical opening of the plastic stand is greater than the concave chip bearing stand and the concave chip bearing stand has a bottom edge revealed at a bottom of the plastic stand; the area of the concave chip bearing stand is greater than 40% of the area of the conical opening of the plastic stand to increase the cooling area of the metal frames for the light-emitting diodes with the different wattage sharing the same specification frame structure to reduce the cost of metal frames molding.

Abstract: An SMT encapsulation body of a light-emitting diode with a wide-angle illumination light shape, comprising: a) a substrate; b) an LED die mounted on the substrate by use of SMT; and c) an encapsulation body positioned around the LED die in the shape of a double dome at the top thereof with the center at a lower position such that the illumination light shape of the light-emitting diode becomes to be a wide-angle and elongated body. The encapsulation body may be formed either in the shape of a batwing or in the shape of a double batwing symmetrically positioned in a cross way. In this way, the light-emitting diode achieves a wide-angle illumination light shape fulfilling the requirements of a certain purpose without the use of the double optical effect of the lens. Meanwhile, the drawbacks of the conventional structure are resolved. Moreover, an increased efficiency in using the light source is ensured.

Abstract: An LED-packaging arrangement, comprising: a first connection block with an enclosure groove at the bottom thereof; a second connection block with an enclosure groove at the bottom thereof; a light-emitting chip positioned at the top of the first connection block and via connection wires electrically coupled to the first and second connection blocks; a positioning/packaging body, and a transparent packaging body. Alternatively, a third connection block is provided with an enclosure groove at the bottom thereof. In this case, the electrical connection originally to the first connection block via the connection wire is changed to the third connection block. The first and second connection blocks are enclosed by the lower part of the positioning/packaging body in position such that the bottom surfaces of the first and second connection blocks are exposed. The upper part of the positioning/packaging body encloses the light-emitting chip so as to create a reflection cap.

Abstract: An LED-packaging arrangement, comprising: a first connection block with an enclosure groove at the bottom thereof; a second connection block with an enclosure groove at the bottom thereof; a light-emitting chip positioned at the top of the first connection block and via connection wires electrically coupled to the first and second connection blocks; a positioning/packaging body, and a transparent packaging body. Alternatively, a third connection block is provided with an enclosure groove at the bottom thereof. In this case, the electrical connection originally to the first connection block via the connection wire is changed to the third connection block. The first and second connection blocks are enclosed by the lower part of the positioning/packaging body in position such that the bottom surfaces of the first and second connection blocks are exposed. The upper part of the positioning/packaging body encloses the light-emitting chip so as to create a reflection cap.