Patents by Inventor Chia-Hao Chen
Chia-Hao Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240250210Abstract: A light-emitting device includes a substrate comprising an upper surface, a plurality of side surfaces, and a semiconductor stack located on the upper surface. The substrate includes a hexagonal crystal structure. The plurality of side surfaces includes a first side surface. The first side surface is tilted away from a m-plane of the hexagonal crystal structure, and an acute angle is formed between the first side surface and the m-plane. The first side surface includes a first modified stripe, and the first modified stripe includes a plurality of first modified regions. A pitch is between the adjacent first modified regions, and the pitch is not less than 5 ?m. The first side surface comprises a folded structure.Type: ApplicationFiled: January 18, 2024Publication date: July 25, 2024Inventors: Chia-Che LIAO, Chih-Hao CHEN, Wei-Che WU, Sheng-Hao WU, Siou-Huei YANG
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Patent number: 12041760Abstract: A transistor includes a gate structure that has a first gate dielectric layer and a second gate dielectric layer. The first gate dielectric layer is disposed over the substrate. The first gate dielectric layer contains a first type of dielectric material that has a first dielectric constant. The second gate dielectric layer is disposed over the first gate dielectric layer. The second gate dielectric layer contains a second type of dielectric material that has a second dielectric constant. The second dielectric constant is greater than the first dielectric constant. The first dielectric constant and the second dielectric constant are each greater than a dielectric constant of silicon oxide.Type: GrantFiled: August 9, 2022Date of Patent: July 16, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Chih-Yu Hsu, Jian-Hao Chen, Chia-Wei Chen, Shan-Mei Liao, Hui-Chi Chen, Yu-Chia Liang, Shih-Hao Lin, Kuei-Lun Lin, Kuo-Feng Yu, Feng-Cheng Yang, Yen-Ming Chen
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Patent number: 12040325Abstract: A device includes a first and a second stacks of channel layers each extending from a first height to a second height. A first dielectric feature on a first side of the first stack and between the first and the second stacks extends from a third height to a fourth height. A second dielectric feature on a second side of the first stack opposite to the first side extends from the third height to a fifth height. A gate electrode extends continuously across a top surface of the first and the second stacks and extends to a sixth height. The fifth height is above the sixth height, the sixth height is above the second height, the second height is above the fourth height, the fourth height is above the first height, and the first height is above the third height.Type: GrantFiled: August 31, 2021Date of Patent: July 16, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Chia-Hao Pao, Chih-Hsuan Chen, Chih-Chuan Yang, Shih-Hao Lin
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Patent number: 12040235Abstract: A dummy gate electrode and a dummy gate dielectric are removed to form a recess between adjacent gate spacers. A gate dielectric is deposited in the recess, and a barrier layer is deposited over the gate dielectric. A first work function layer is deposited over the barrier layer. A first anti-reaction layer is formed over the first work function layer, the first anti-reaction layer reducing oxidation of the first work function layer. A fill material is deposited over the first anti-reaction layer.Type: GrantFiled: July 21, 2022Date of Patent: July 16, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Chia-Ching Lee, Hsin-Han Tsai, Shih-Hang Chiu, Tsung-Ta Tang, Chung-Chiang Wu, Hung-Chin Chung, Hsien-Ming Lee, Da-Yuan Lee, Jian-Hao Chen, Chien-Hao Chen, Kuo-Feng Yu, Chia-Wei Chen, Chih-Yu Hsu
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Publication number: 20240194917Abstract: A hot box device and an operating method thereof are provided. The hot box device includes a first shell, a reformer, a burner, and a cathode inlet pipe. The first shell has a first cavity. The reformer is disposed in the first cavity. The burner is disposed in the reformer and has an opening. The cathode inlet pipe is disposed in the first cavity and extends through the first shell. The cathode inlet pipe is in fluid communication with the first cavity, and the opening of the burner is in fluid communication with the first cavity.Type: ApplicationFiled: January 10, 2023Publication date: June 13, 2024Applicant: Industrial Technology Research InstituteInventors: Shing-Cheng CHANG, Chia-Hsin LEE, Cheng-Hao YANG, Wen-Sheng CHANG, Chia-Hao CHEN
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Patent number: 11982301Abstract: A connecting assembly is applied to connect a first housing and a second housing. The connecting assembly includes a general connecting member, a connecting base, and a clamping member. The general connecting member connects to the first housing. The general connecting member includes an accommodating portion and at least one opening. The accommodating portion is located inside the general connecting member. The opening is disposed on a side wall of the general connecting member and communicates with the accommodating portion. The connecting base is disposed on the second housing. The connecting base includes a main body disposed in the accommodating portion. The clamping member includes a flat portion and at least one clamping portion. The clamping portion extends from one end of the flat portion toward the connecting base, and the clamping portion passes through the opening and presses against the main body of the connecting base.Type: GrantFiled: November 17, 2022Date of Patent: May 14, 2024Assignee: CHICONY ELECTRONICS CO., LTD.Inventor: Chia-Hao Chen
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Patent number: 11949008Abstract: A semiconductor structure is provided. The semiconductor structure includes a substrate having a front side and a back side opposite the front side. The semiconductor structure also includes a first contact metal layer disposed on the front side of the substrate. The semiconductor structure further includes a III-V compound semiconductor layer disposed between the substrate and the first contact metal layer. Moreover, the semiconductor structure includes a via hole penetrating through the substrate and the III-V compound semiconductor layer from the back side of the substrate. The bottom of the via hole is defined by the first contact metal layer, and the first contact metal layer includes molybdenum, tungsten, iridium, palladium, platinum, cobalt, ruthenium, osmium, rhodium, rhenium, or a combination thereof.Type: GrantFiled: December 30, 2020Date of Patent: April 2, 2024Assignee: WIN SEMICONDUCTORS CORP.Inventors: Chang-Hwang Hua, Chia-Hao Chen
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Patent number: 11943008Abstract: The present disclosure relates to a method for aligning a smartphone providing NFC wireless power for charging a battery of a device, the method comprising: emitting, with a first NFC antenna of the smartphone, an NFC field for wirelessly charging the battery of the device comprising a second NFC antenna; obtaining, with the smartphone, a measured value of a signal representative of the NFC field strength between the smartphone and the device; determining, by the smartphone, a range of values of a plurality of ranges of values the measured value belongs; and emitting, by the smartphone, at least one notification signal to a user with a frequency determined by the determined range of values.Type: GrantFiled: January 12, 2023Date of Patent: March 26, 2024Assignees: STMICROELECTRONICS LTD, STMICROELECTRONICS (ROUSSET) SASInventors: Chia Hao Chen, Nicolas Cordier
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Publication number: 20230383776Abstract: A connecting assembly is applied to connect a first housing and a second housing. The connecting assembly includes a general connecting member, a connecting base, and a clamping member. The general connecting member connects to the first housing. The general connecting member includes an accommodating portion and at least one opening. The accommodating portion is located inside the general connecting member. The opening is disposed on a side wall of the general connecting member and communicates with the accommodating portion. The connecting base is disposed on the second housing. The connecting base includes a main body disposed in the accommodating portion. The clamping member includes a flat portion and at least one clamping portion. The clamping portion extends from one end of the flat portion toward the connecting base, and the clamping portion passes through the opening and presses against the main body of the connecting base.Type: ApplicationFiled: November 17, 2022Publication date: November 30, 2023Inventor: CHIA-HAO CHEN
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Patent number: 11822735Abstract: An electronic device and a method of controlling multiple pieces of equipment are provided. The electronic device is coupled to an operating device, a first controlled device and a second controlled device. The electronic device includes an operating interface and a controlled interface. The operating interface is coupled to the operating device. The operating device includes a first operating area and a second operating area. The first operating area is configured to deliver a first operating signal. The second operating area is configured to deliver a second operating signal. The controlled interface is coupled to the first controlled device and the second controlled device. The first controlled device is controlled by the first operating signal. The second controlled device is controlled by the second operating signal.Type: GrantFiled: July 8, 2022Date of Patent: November 21, 2023Assignee: Aten International Co., Ltd.Inventors: Pei-Chun Lai, Kuo-Feng Kao, Chia-Hao Chen
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Publication number: 20230170938Abstract: The present disclosure relates to a method for aligning a smartphone providing NFC wireless power for charging a battery of a device, the method comprising: emitting, with a first NFC antenna of the smartphone, an NFC field for wirelessly charging the battery of the device comprising a second NFC antenna; obtaining, with the smartphone, a measured value of a signal representative of the NFC field strength between the smartphone and the device; determining, by the smartphone, a range of values of a plurality of ranges of values the measured value belongs; and emitting, by the smartphone, at least one notification signal to a user with a frequency determined by the determined range of values.Type: ApplicationFiled: January 12, 2023Publication date: June 1, 2023Applicants: STMICROELECTRONICS LTD, STMICROELECTRONICS (ROUSSET) SASInventors: Chia Hao CHEN, Nicolas CORDIER
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Publication number: 20230106612Abstract: A method for manufacturing an electrical package is provided. The method include: providing a substrate having a first surface and a second surface opposite to the first surface, wherein the second surface has a first level difference; forming an adhesive layer on the second surface of the substrate, wherein the adhesive layer is configured to cover the second surface and provides a third surface spaced apart from the second surface of the substrate, wherein the third surface has a second level difference; disposing a tape on the third surface of the adhesive layer; and performing a removing operation on the first surface of the substrate; wherein the second level difference is smaller than the first level difference.Type: ApplicationFiled: October 5, 2021Publication date: April 6, 2023Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Wen-Pin HUANG, Fu Tang CHU, Pei I CHANG, Chia Hao CHEN, Tsuan Ching KUO
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Publication number: 20230095001Abstract: An electronic device and a method of controlling multiple pieces of equipment are provided. The electronic device is coupled to an operating device, a first controlled device and a second controlled device. The electronic device includes an operating interface and a controlled interface. The operating interface is coupled to the operating device. The operating device includes a first operating area and a second operating area. The first operating area is configured to deliver a first operating signal. The second operating area is configured to deliver a second operating signal. The controlled interface is coupled to the first controlled device and the second controlled device. The first controlled device is controlled by the first operating signal. The second controlled device is controlled by the second operating signal.Type: ApplicationFiled: July 8, 2022Publication date: March 30, 2023Applicant: Aten International Co., Ltd.Inventors: Pei-Chun Lai, Kuo-Feng Kao, Chia-Hao Chen
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Patent number: 11588519Abstract: The present disclosure relates to a method for aligning a smartphone providing NFC wireless power for charging a battery of a device, the method comprising: emitting, with a first NFC antenna of the smartphone, an NFC field for wirelessly charging the battery of the device comprising a second NFC antenna; obtaining, with the smartphone, a measured value of a signal representative of the NFC field strength between the smartphone and the device; determining, by the smartphone, a range of values of a plurality of ranges of values the measured value belongs; and emitting, by the smartphone, at least one notification signal to a user with a frequency determined by the determined range of values.Type: GrantFiled: September 14, 2021Date of Patent: February 21, 2023Assignees: STMICROELECTRONICS LTD, STMICROELECTRONICS (ROUSSET) SASInventors: Chia Hao Chen, Nicolas Cordier
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Publication number: 20220369006Abstract: Provided is a device comprising a frequency demodulator and an amplitude demodulator. The device is configured to use, in a first mode, both the frequency demodulator and the amplitude demodulator in parallel and to activate a radio frequency identification (RFID) card mode or a Qi charger mode based on results provided by said demodulators.Type: ApplicationFiled: May 3, 2022Publication date: November 17, 2022Applicants: STMICROELECTRONICS LTD, STMICROELECTRONICS (ROUSSET) SAS, STMicroelectronics Razvoj Polprevodnikov D.O.O.Inventors: Nicolas CORDIER, Chia Hao CHEN, Karel BLAHA
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Patent number: 11463506Abstract: An online file transfer tasks scheduling method for processing multiple file path access requests in a network, the method including: sending at least one file path access request to a corresponding one of at least one file access service module, executing a processing procedure in each of the at least one file access service module to generate a task package according to each received file path access request, and using one or more task execution units to process one or more of the task packages; and using a task execution unit balance module to periodically evaluate a load ratio between a plurality of the file access service modules, and determining the number of the task execution units for each file access service module according to the load ratio.Type: GrantFiled: September 30, 2020Date of Patent: October 4, 2022Assignee: QNAP SYSTEMS, INC.Inventors: Xiao-Wei Huang, Chia-Hao Chen, Chi-Lung Lin
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Publication number: 20220239335Abstract: A method is provided that is implemented by a first NFC device configured in reader mode. The method includes evaluating an information about the coupling between the first NFC device and a second NFC device configured in card mode, as a function of the position of an antenna of the first NFC device with respect to an antenna of the second NFC device. The method further includes indicating the information by a user interface of the first device.Type: ApplicationFiled: January 13, 2022Publication date: July 28, 2022Applicants: STMicroelectronics Ltd, STMicroelectronics (Rousset) SASInventors: Nicolas CORDIER, Chia-Hao CHEN
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Publication number: 20220208999Abstract: A semiconductor structure is provided. The semiconductor structure includes a substrate having a front side and a back side opposite the front side. The semiconductor structure also includes a first contact metal layer disposed on the front side of the substrate. The semiconductor structure further includes a III-V compound semiconductor layer disposed between the substrate and the first contact metal layer. Moreover, the semiconductor structure includes a via hole penetrating through the substrate and the III-V compound semiconductor layer from the back side of the substrate. The bottom of the via hole is defined by the first contact metal layer, and the first contact metal layer includes molybdenum, tungsten, iridium, palladium, platinum, cobalt, ruthenium, osmium, rhodium, rhenium, or a combination thereof.Type: ApplicationFiled: December 30, 2020Publication date: June 30, 2022Inventors: Chang-Hwang HUA, Chia-Hao CHEN
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Publication number: 20220094393Abstract: The present disclosure relates to a method for aligning a smartphone providing NFC wireless power for charging a battery of a device, the method comprising: emitting, with a first NFC antenna of the smartphone, an NFC field for wirelessly charging the battery of the device comprising a second NFC antenna; obtaining, with the smartphone, a measured value of a signal representative of the NFC field strength between the smartphone and the device; determining, by the smartphone, a range of values of a plurality of ranges of values the measured value belongs; and emitting, by the smartphone, at least one notification signal to a user with a frequency determined by the determined range of values.Type: ApplicationFiled: September 14, 2021Publication date: March 24, 2022Applicants: STMICROELECTRONICS LTD, STMICROELECTRONICS (ROUSSET) SASInventors: Chia Hao CHEN, Nicolas CORDIER
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Publication number: 20210409480Abstract: An online file transfer tasks scheduling method for processing multiple file path access requests in a network, the method including: sending at least one file path access request to a corresponding one of at least one file access service module, executing a processing procedure in each of the at least one file access service module to generate a task package according to each received file path access request, and using one or more task execution units to process one or more of the task packages; and using a task execution unit balance module to periodically evaluate a load ratio between a plurality of the file access service modules, and determining the number of the task execution units for each file access service module according to the load ratio.Type: ApplicationFiled: September 30, 2020Publication date: December 30, 2021Inventors: Xiao-Wei HUANG, Chia-Hao CHEN, Chi-Lung LIN