Patents by Inventor Chia-Hao Chen

Chia-Hao Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240071953
    Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above- mentioned memory device is also provided.
    Type: Application
    Filed: November 6, 2023
    Publication date: February 29, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Kai-Ming Chiang, Chao-wei Li, Wei-Lun Tsai, Chia-Min Lin, Yi-Da Tsai, Sheng-Feng Weng, Yu-Hao Chen, Sheng-Hsiang Chiu, Chih-Wei Lin, Ching-Hua Hsieh
  • Publication number: 20240071954
    Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above-mentioned memory device is also provided.
    Type: Application
    Filed: November 9, 2023
    Publication date: February 29, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Kai-Ming Chiang, Chao-wei Li, Wei-Lun Tsai, Chia-Min Lin, Yi-Da Tsai, Sheng-Feng Weng, Yu-Hao Chen, Sheng-Hsiang Chiu, Chih-Wei Lin, Ching-Hua Hsieh
  • Patent number: 11913636
    Abstract: A light source module includes a circuit substrate, a plurality of light-emitting diodes, a cover layer and a plurality of first scattering particles. The plurality of light-emitting diodes is disposed on the circuit substrate. The cover layer covers the plurality of light-emitting diodes, and an upper surface of the cover layer has a plurality of recesses, wherein orthogonal projections of the plurality of recesses on the circuit substrate overlap the circuit substrate between the plurality of light-emitting diodes. The plurality of first scattering particles is located in the plurality of recesses.
    Type: Grant
    Filed: December 20, 2022
    Date of Patent: February 27, 2024
    Assignee: AUO Corporation
    Inventors: Hui-Chuan Chen, Chia-Hao Wu
  • Publication number: 20230383776
    Abstract: A connecting assembly is applied to connect a first housing and a second housing. The connecting assembly includes a general connecting member, a connecting base, and a clamping member. The general connecting member connects to the first housing. The general connecting member includes an accommodating portion and at least one opening. The accommodating portion is located inside the general connecting member. The opening is disposed on a side wall of the general connecting member and communicates with the accommodating portion. The connecting base is disposed on the second housing. The connecting base includes a main body disposed in the accommodating portion. The clamping member includes a flat portion and at least one clamping portion. The clamping portion extends from one end of the flat portion toward the connecting base, and the clamping portion passes through the opening and presses against the main body of the connecting base.
    Type: Application
    Filed: November 17, 2022
    Publication date: November 30, 2023
    Inventor: CHIA-HAO CHEN
  • Patent number: 11822735
    Abstract: An electronic device and a method of controlling multiple pieces of equipment are provided. The electronic device is coupled to an operating device, a first controlled device and a second controlled device. The electronic device includes an operating interface and a controlled interface. The operating interface is coupled to the operating device. The operating device includes a first operating area and a second operating area. The first operating area is configured to deliver a first operating signal. The second operating area is configured to deliver a second operating signal. The controlled interface is coupled to the first controlled device and the second controlled device. The first controlled device is controlled by the first operating signal. The second controlled device is controlled by the second operating signal.
    Type: Grant
    Filed: July 8, 2022
    Date of Patent: November 21, 2023
    Assignee: Aten International Co., Ltd.
    Inventors: Pei-Chun Lai, Kuo-Feng Kao, Chia-Hao Chen
  • Publication number: 20230170938
    Abstract: The present disclosure relates to a method for aligning a smartphone providing NFC wireless power for charging a battery of a device, the method comprising: emitting, with a first NFC antenna of the smartphone, an NFC field for wirelessly charging the battery of the device comprising a second NFC antenna; obtaining, with the smartphone, a measured value of a signal representative of the NFC field strength between the smartphone and the device; determining, by the smartphone, a range of values of a plurality of ranges of values the measured value belongs; and emitting, by the smartphone, at least one notification signal to a user with a frequency determined by the determined range of values.
    Type: Application
    Filed: January 12, 2023
    Publication date: June 1, 2023
    Applicants: STMICROELECTRONICS LTD, STMICROELECTRONICS (ROUSSET) SAS
    Inventors: Chia Hao CHEN, Nicolas CORDIER
  • Publication number: 20230106612
    Abstract: A method for manufacturing an electrical package is provided. The method include: providing a substrate having a first surface and a second surface opposite to the first surface, wherein the second surface has a first level difference; forming an adhesive layer on the second surface of the substrate, wherein the adhesive layer is configured to cover the second surface and provides a third surface spaced apart from the second surface of the substrate, wherein the third surface has a second level difference; disposing a tape on the third surface of the adhesive layer; and performing a removing operation on the first surface of the substrate; wherein the second level difference is smaller than the first level difference.
    Type: Application
    Filed: October 5, 2021
    Publication date: April 6, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Wen-Pin HUANG, Fu Tang CHU, Pei I CHANG, Chia Hao CHEN, Tsuan Ching KUO
  • Publication number: 20230095001
    Abstract: An electronic device and a method of controlling multiple pieces of equipment are provided. The electronic device is coupled to an operating device, a first controlled device and a second controlled device. The electronic device includes an operating interface and a controlled interface. The operating interface is coupled to the operating device. The operating device includes a first operating area and a second operating area. The first operating area is configured to deliver a first operating signal. The second operating area is configured to deliver a second operating signal. The controlled interface is coupled to the first controlled device and the second controlled device. The first controlled device is controlled by the first operating signal. The second controlled device is controlled by the second operating signal.
    Type: Application
    Filed: July 8, 2022
    Publication date: March 30, 2023
    Applicant: Aten International Co., Ltd.
    Inventors: Pei-Chun Lai, Kuo-Feng Kao, Chia-Hao Chen
  • Patent number: 11588519
    Abstract: The present disclosure relates to a method for aligning a smartphone providing NFC wireless power for charging a battery of a device, the method comprising: emitting, with a first NFC antenna of the smartphone, an NFC field for wirelessly charging the battery of the device comprising a second NFC antenna; obtaining, with the smartphone, a measured value of a signal representative of the NFC field strength between the smartphone and the device; determining, by the smartphone, a range of values of a plurality of ranges of values the measured value belongs; and emitting, by the smartphone, at least one notification signal to a user with a frequency determined by the determined range of values.
    Type: Grant
    Filed: September 14, 2021
    Date of Patent: February 21, 2023
    Assignees: STMICROELECTRONICS LTD, STMICROELECTRONICS (ROUSSET) SAS
    Inventors: Chia Hao Chen, Nicolas Cordier
  • Publication number: 20220369006
    Abstract: Provided is a device comprising a frequency demodulator and an amplitude demodulator. The device is configured to use, in a first mode, both the frequency demodulator and the amplitude demodulator in parallel and to activate a radio frequency identification (RFID) card mode or a Qi charger mode based on results provided by said demodulators.
    Type: Application
    Filed: May 3, 2022
    Publication date: November 17, 2022
    Applicants: STMICROELECTRONICS LTD, STMICROELECTRONICS (ROUSSET) SAS, STMicroelectronics Razvoj Polprevodnikov D.O.O.
    Inventors: Nicolas CORDIER, Chia Hao CHEN, Karel BLAHA
  • Patent number: 11463506
    Abstract: An online file transfer tasks scheduling method for processing multiple file path access requests in a network, the method including: sending at least one file path access request to a corresponding one of at least one file access service module, executing a processing procedure in each of the at least one file access service module to generate a task package according to each received file path access request, and using one or more task execution units to process one or more of the task packages; and using a task execution unit balance module to periodically evaluate a load ratio between a plurality of the file access service modules, and determining the number of the task execution units for each file access service module according to the load ratio.
    Type: Grant
    Filed: September 30, 2020
    Date of Patent: October 4, 2022
    Assignee: QNAP SYSTEMS, INC.
    Inventors: Xiao-Wei Huang, Chia-Hao Chen, Chi-Lung Lin
  • Publication number: 20220239335
    Abstract: A method is provided that is implemented by a first NFC device configured in reader mode. The method includes evaluating an information about the coupling between the first NFC device and a second NFC device configured in card mode, as a function of the position of an antenna of the first NFC device with respect to an antenna of the second NFC device. The method further includes indicating the information by a user interface of the first device.
    Type: Application
    Filed: January 13, 2022
    Publication date: July 28, 2022
    Applicants: STMicroelectronics Ltd, STMicroelectronics (Rousset) SAS
    Inventors: Nicolas CORDIER, Chia-Hao CHEN
  • Publication number: 20220208999
    Abstract: A semiconductor structure is provided. The semiconductor structure includes a substrate having a front side and a back side opposite the front side. The semiconductor structure also includes a first contact metal layer disposed on the front side of the substrate. The semiconductor structure further includes a III-V compound semiconductor layer disposed between the substrate and the first contact metal layer. Moreover, the semiconductor structure includes a via hole penetrating through the substrate and the III-V compound semiconductor layer from the back side of the substrate. The bottom of the via hole is defined by the first contact metal layer, and the first contact metal layer includes molybdenum, tungsten, iridium, palladium, platinum, cobalt, ruthenium, osmium, rhodium, rhenium, or a combination thereof.
    Type: Application
    Filed: December 30, 2020
    Publication date: June 30, 2022
    Inventors: Chang-Hwang HUA, Chia-Hao CHEN
  • Publication number: 20220094393
    Abstract: The present disclosure relates to a method for aligning a smartphone providing NFC wireless power for charging a battery of a device, the method comprising: emitting, with a first NFC antenna of the smartphone, an NFC field for wirelessly charging the battery of the device comprising a second NFC antenna; obtaining, with the smartphone, a measured value of a signal representative of the NFC field strength between the smartphone and the device; determining, by the smartphone, a range of values of a plurality of ranges of values the measured value belongs; and emitting, by the smartphone, at least one notification signal to a user with a frequency determined by the determined range of values.
    Type: Application
    Filed: September 14, 2021
    Publication date: March 24, 2022
    Applicants: STMICROELECTRONICS LTD, STMICROELECTRONICS (ROUSSET) SAS
    Inventors: Chia Hao CHEN, Nicolas CORDIER
  • Publication number: 20210409480
    Abstract: An online file transfer tasks scheduling method for processing multiple file path access requests in a network, the method including: sending at least one file path access request to a corresponding one of at least one file access service module, executing a processing procedure in each of the at least one file access service module to generate a task package according to each received file path access request, and using one or more task execution units to process one or more of the task packages; and using a task execution unit balance module to periodically evaluate a load ratio between a plurality of the file access service modules, and determining the number of the task execution units for each file access service module according to the load ratio.
    Type: Application
    Filed: September 30, 2020
    Publication date: December 30, 2021
    Inventors: Xiao-Wei HUANG, Chia-Hao CHEN, Chi-Lung LIN
  • Publication number: 20200379635
    Abstract: The present disclosure generally relates to enlarging user interface elements. An example method includes displaying a first version of first content; while displaying the first version of first content, displaying a focus indicator at a first location that does not correspond to the first version of first content; receiving first input; in response to receiving the first input, moving the focus indicator to a second location; in accordance with the second location corresponding to the first version and a set of second version display criteria being met, concurrently displaying at least a portion of the first version of first content and a second version of first content, wherein the second version differs from the first version in a visual characteristic other than size; and in accordance with the second location not corresponding to the first version of first content, forgoing display of the second version of first content.
    Type: Application
    Filed: March 18, 2020
    Publication date: December 3, 2020
    Inventors: Gregory F. HUGHES, Chia-Hao CHEN
  • Publication number: 20150377644
    Abstract: A method, a system, and a computer-readable medium for planning a path are provided. The method comprises the following steps. A plurality of pictures with geographic information are received from a cloud server. A selection signal selecting at least two of the pictures is received and the geographic information of the selected pictures is obtained. The path is planned according to the geographic information and then displayed on a map.
    Type: Application
    Filed: June 25, 2014
    Publication date: December 31, 2015
    Applicant: HTC Corporation
    Inventors: Chia-Hao CHEN, Ying-Chieh LIN
  • Publication number: 20150099358
    Abstract: A method for forming a through wafer via hole in a semiconductor device, wherein the semiconductor device comprises a wafer having a SiC substrate with a front side and a backside, a GaN-based layer formed on the front side of the SiC substrate, and a mask structure formed on the backside of the SiC substrate defining an etching area. The etching area is first descummed A through substrate via hole is formed by etching the etching area through the SiC substrate. The mask structure is removed and the inner surface of the through substrate via hole is cleaned. The inner surface of the through substrate via hole is then descummed A through wafer via hole is formed by etching through the GaN layer in the through substrate via hole. And lastly the inner surface of the through wafer via hole is cleaned.
    Type: Application
    Filed: October 7, 2013
    Publication date: April 9, 2015
    Applicant: WIN Semiconductors Corp.
    Inventors: Chia-Hao CHEN, Yu-Wei CHANG, Yi-Feng WEI, I-Te CHO, Walter Tony WOHLMUTH
  • Publication number: 20140283991
    Abstract: A wafer edge protector is used in an inductively coupled plasma reactive ion etching instrument for the manufacturing of GaN semiconductor devices and circuits. The wafer edge protector comprises a ring clamp, which has a first inner diameter and a second inner diameter, and the ring clamp covers the edges of a wafer and a wafer carrier to clamp the wafer and the wafer carrier and to prevent damage on the edges of the wafer and the wafer carrier during the etching process.
    Type: Application
    Filed: March 20, 2013
    Publication date: September 25, 2014
    Applicant: WIN Semiconductors Corp.
    Inventors: Chia-Hao CHEN, Yi-Feng WEI, Yao-Chung HSIEH, I Te CHO, Walter Tony WOHLMUTH
  • Patent number: 7628510
    Abstract: A switchable illumination system adapted to provide illumination to a device is disclosed. The switchable illumination system comprises a first light source, a second light source, a reflection module and a control module, wherein the two light sources are disposed on opposite sides of the reflection module, respectively. The reflection module is adapted to reflect the light emitted from either the first light source or the second light source to maintain normal operation of the switchable illumination system under the monitoring of the control unit.
    Type: Grant
    Filed: March 31, 2008
    Date of Patent: December 8, 2009
    Assignee: Delta Electronics, Inc.
    Inventors: Chia-Hao Chen, Bob Wang