Abstract: A method includes providing a substrate, a dummy fin, and a stack of semiconductor channel layers; forming an interfacial layer wrapping around each of the semiconductor channel layers; depositing a high-k dielectric layer, wherein a first portion of the high-k dielectric layer over the interfacial layer is spaced away from a second portion of the high-k dielectric layer on sidewalls of the dummy fin by a first distance; depositing a first dielectric layer over the dummy fin and over the semiconductor channel layers, wherein a merge-critical-dimension of the first dielectric layer is greater than the first distance thereby causing the first dielectric layer to be deposited in a space between the dummy fin and a topmost layer of the stack of semiconductor channel layers, thereby providing air gaps between adjacent layers of the stack of semiconductor channel layers and between the dummy fin and the stack of semiconductor channel layers.

Abstract: A memory device is provided. The memory device includes a memory cell array having a plurality of memory cells arranged in a matrix of a plurality of rows and a plurality of columns. Each of the plurality of columns include a first plurality of memory cells connected to a first bit line and a second bit line. A pre-charge circuit is connected to the memory cell array. The pre-charge circuit pre-charges each of the first bit line and the second bit line from a first end. A pre-charge assist circuit is connected to the memory cell array. The pre-charge assist circuit pre-charges each of the first bit line and the second bit line from a second end, the second end being opposite the first end.

Abstract: A method includes providing a substrate, a dummy fin, and a stack of semiconductor channel layers; forming an interfacial layer wrapping around each of the semiconductor channel layers; depositing a high-k dielectric layer, wherein a first portion of the high-k dielectric layer over the interfacial layer is spaced away from a second portion of the high-k dielectric layer on sidewalls of the dummy fin by a first distance; depositing a first dielectric layer over the dummy fin and over the semiconductor channel layers, wherein a merge-critical-dimension of the first dielectric layer is greater than the first distance thereby causing the first dielectric layer to be deposited in a space between the dummy fin and a topmost layer of the stack of semiconductor channel layers, thereby providing air gaps between adjacent layers of the stack of semiconductor channel layers and between the dummy fin and the stack of semiconductor channel layers.

Abstract: A memory device is provided. The memory device includes a memory cell array having a plurality of memory cells arranged in a matrix of a plurality of rows and a plurality of columns. Each of the plurality of columns include a first plurality of memory cells connected to a first bit line and a second bit line. A pre-charge circuit is connected to the memory cell array. The pre-charge circuit pre-charges each of the first bit line and the second bit line from a first end. A pre-charge assist circuit is connected to the memory cell array. The pre-charge assist circuit pre-charges each of the first bit line and the second bit line from a second end, the second end being opposite the first end.

Abstract: A semiconductor device according to the present disclosure includes a gate extension structure, a first source/drain feature and a second source/drain feature, a vertical stack of channel members extending between the first source/drain feature and the second source/drain feature along a direction, and a gate structure wrapping around each of the vertical stack of channel members. The gate extension structure is in direct contact with the first source/drain feature.

Abstract: A micro-electromechanical-system (MEMS) device may be formed to include an anti-stiction polysilicon layer on one or more moveable MEMS structures of a device wafer of the MEMS device to reduce, minimize, and/or eliminate stiction between the moveable MEMS structures and other components or structures of the MEMS device. The anti-stiction polysilicon layer may be formed such that a surface roughness of the anti-stiction polysilicon layer is greater than the surface roughness of a bonding polysilicon layer on the surfaces of the device wafer that are to be bonded to a circuitry wafer of the MEMS device. The higher surface roughness of the anti-stiction polysilicon layer may reduce the surface area of the bottom of the moveable MEMS structures, which may reduce the likelihood that the one or more moveable MEMS structures will become stuck to the other components or structures.

Abstract: Provided is an electronic device, including a housing, a fixing hole, a platform and a sensor. The fixing hole is located at the housing and configured to detachably fix an identification element. The platform extends outward from the lower edge of the fixing hole. The sensor is disposed on the platform and configured to communicate with the identification element.

Abstract: A casing of an electronic device including successive pattern structures is provided, including a first body, a second body, a first light emitting pattern, and a second light emitting pattern. The first body includes an outer surface and an inner surface, and the outer surface includes a first side edge. The second body includes an upper surface and a pivoting structure. The upper surface includes a covered area and an exposed area. The first body is pivotally connected to the second body through the pivoting structure, and the pivoting structure is located between the covered area and the exposed area. The first light emitting pattern is located on the outer surface and includes a first end extending to the first side edge. A second light emitting pattern, located on the exposed area, and including a second end. When the inner surface covers the covered area, the first end is aligned with the second end.

Abstract: A light-transmitting plastic casing and a manufacturing method thereof are provided. A manufacturing method of a light-transmitting plastic casing include the steps: providing a mixed material, the mixed material includes a resinous material, a flame retardant material, a transparent fiberglass material, and an elastomer material; performing a granulating step to the mixed material to form granules; performing a heating step to the granules; and performing a molding step to heated granules to form a light-transmitting plastic casing.

Abstract: An electronic device including a luminous strip is provided, including a housing, a first light guiding strip, a second light guiding strip, a light-transmissive structure, a first light-emitting element, a second light-emitting element and a third light-emitting element. The housing includes a first side wall and a second side wall, where a corner area exists between the first side wall and the second side wall. The first light guiding strip is disposed on the first side wall. The second light guiding strip is disposed on the second side wall. The light-transmissive structure is disposed in the corner area, and connected to the first light guiding strip and the second light guiding strip. The first light-emitting element is disposed at a first end of the first light guiding strip. The second light-emitting element is disposed at a second end of the second light guiding strip.

Abstract: A casing of an electronic device including successive pattern structures is provided, including a first body, a second body, a first light emitting pattern, and a second light emitting pattern. The first body includes an outer surface and an inner surface, and the outer surface includes a first side edge. The second body includes an upper surface and a pivoting structure. The upper surface includes a covered area and an exposed area. The first body is pivotally connected to the second body through the pivoting structure, and the pivoting structure is located between the covered area and the exposed area. The first light emitting pattern is located on the outer surface and includes a first end extending to the first side edge. A second light emitting pattern, located on the exposed area, and including a second end. When the inner surface covers the covered area, the first end is aligned with the second end.

Abstract: Provided is an electronic device, including a housing, a fixing hole, a platform and a sensor. The fixing hole is located at the housing and configured to detachably fix an identification element. The platform extends outward from the lower edge of the fixing hole. The sensor is disposed on the platform and configured to communicate with the identification element.

Abstract: An electronic device including a luminous strip is provided, including a housing, a first light guiding strip, a second light guiding strip, a light-transmissive structure, a first light-emitting element, a second light-emitting element and a third light-emitting element. The housing includes a first side wall and a second side wall, where a corner area exists between the first side wall and the second side wall. The first light guiding strip is disposed on the first side wall. The second light guiding strip is disposed on the second side wall. The light-transmissive structure is disposed in the corner area, and connected to the first light guiding strip and the second light guiding strip. The first light-emitting element is disposed at a first end of the first light guiding strip. The second light-emitting element is disposed at a second end of the second light guiding strip.