Patents by Inventor CHIA-HAO LIU

CHIA-HAO LIU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240186373
    Abstract: A semiconductor device includes a source/drain feature over a semiconductor substrate, channel layers over the semiconductor substrate and connected to the source/drain feature, a gate portion between vertically adjacent channel layers, and an inner spacer between the source/drain feature and the gate portion and between adjacent channel layers. The semiconductor device further includes an air gap between the inner spacer and the source/drain feature.
    Type: Application
    Filed: February 7, 2024
    Publication date: June 6, 2024
    Inventors: Po-Yu Lin, Wei-Yang Lee, Chia-Pin Lin, Tzu-Hua Chiu, Kuan-Hao Cheng, Wei-Han Fan, Li-Li Su, Wei-Min Liu
  • Patent number: 12002768
    Abstract: A semiconductor package and a manufacturing method for the semiconductor package are provided. The semiconductor package includes a molded semiconductor device, a first redistribution structure, and conductive vias. The molded semiconductor device comprises a sensor die with a first surface and a second surface opposite the first surface, wherein the sensor die has an input/output region and a sensing region at the first surface. The first redistribution structure is disposed on the first surface of the sensor die, wherein the first redistribution structure covers the input/output region and exposes the sensing region, and the first redistribution structure comprises a conductive layer having a redistribution pattern and a ring structure. The redistribution pattern is electrically connected with the sensor die. The ring structure surrounds the sensing region and is separated from the redistribution pattern, wherein the ring structure is closer to the sensing region than the redistribution pattern.
    Type: Grant
    Filed: August 27, 2021
    Date of Patent: June 4, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yu-Chih Huang, Chih-Hao Chang, Po-Chun Lin, Chun-Ti Lu, Zheng-Gang Tsai, Shih-Wei Chen, Chia-Hung Liu, Hao-Yi Tsai, Chung-Shi Liu
  • Publication number: 20240177319
    Abstract: Many unsupervised domain adaptation (UDA) methods have been proposed to bridge the domain gap by utilizing domain invariant information. Most approaches have chosen depth as such information and achieved remarkable successes. Despite their effectiveness, using depth as domain invariant information in UDA tasks may lead to multiple issues, such as excessively high extraction costs and difficulties in achieving a reliable prediction quality. As a result, we introduce Edge Learning based Domain Adaptation (ELDA), a framework which incorporates edge information into its training process to serve as a type of domain invariant information. Our experiments quantitatively and qualitatively demonstrate that the incorporation of edge information is indeed beneficial and effective, and enables ELDA to outperform the contemporary state-of-the-art methods on two commonly adopted benchmarks for semantic segmentation based UDA tasks.
    Type: Application
    Filed: November 24, 2023
    Publication date: May 30, 2024
    Applicant: MEDIATEK INC.
    Inventors: Ting-Hsuan Liao, Huang-Ru Liao, Shan-Ya Yang, Jie-En Yao, Li-Yuan Tsao, Hsu-Shen Liu, Bo-Wun Cheng, Chen-Hao Chao, Chia-Che Chang, Yi-Chen Lo, Chun-Yi Lee
  • Patent number: 11967570
    Abstract: A semiconductor package includes a base comprising a top surface and a bottom surface that is opposite to the top surface; a first semiconductor chip mounted on the top surface of the base in a flip-chip manner; a second semiconductor chip stacked on the first semiconductor chip and electrically coupled to the base by wire bonding; an in-package heat dissipating element comprising a dummy silicon die adhered onto the second semiconductor chip by using a high-thermal conductive die attach film; and a molding compound encapsulating the first semiconductor die, the second semiconductor die, and the in-package heat dissipating element.
    Type: Grant
    Filed: March 4, 2022
    Date of Patent: April 23, 2024
    Assignee: MediaTek Inc.
    Inventors: Chia-Hao Hsu, Tai-Yu Chen, Shiann-Tsong Tsai, Hsing-Chih Liu, Yao-Pang Hsu, Chi-Yuan Chen, Chung-Fa Lee
  • Publication number: 20240100880
    Abstract: A multi-piece wheel frame includes a rim and a disc. The rim includes a barrel, and an outer rim portion protruding outwardly from the barrel. The outer rim portion forms an inclined surface, and a ring edge surface connected to an outer edge of the inclined surface and cooperating with the inclined surface to form an obtuse angle. The disc is fixed to the rim, and includes a disc core, a plurality of spoke portions extending radially outwardly from the disc core, and a reinforced ring portion connected to the spoke portions and fixed to the outer rim portion. The reinforced ring portion abuts against at least one of the inclined surface and the ring edge surface.
    Type: Application
    Filed: November 16, 2022
    Publication date: March 28, 2024
    Inventors: Te-Fu HSIAO, Che-Hao KUO, Chung-Hsin CHANG, Chia-Hsin WANG, Erh-Wei LIU
  • Patent number: 11923409
    Abstract: A semiconductor device includes a source/drain feature over a semiconductor substrate, channel layers over the semiconductor substrate and connected to the source/drain feature, a gate portion between vertically adjacent channel layers, and an inner spacer between the source/drain feature and the gate portion and between adjacent channel layers. The semiconductor device further includes an air gap between the inner spacer and the source/drain feature.
    Type: Grant
    Filed: August 5, 2021
    Date of Patent: March 5, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Po-Yu Lin, Wei-Yang Lee, Chia-Pin Lin, Tzu-Hua Chiu, Kuan-Hao Cheng, Wei-Han Fan, Li-Li Su, Wei-Min Liu
  • Patent number: 11701087
    Abstract: The present disclosure provides a positioning method for head and neck assessment comprising positioning a probe to the head and neck structures of a subject according to reference planes defined by light beams.
    Type: Grant
    Filed: July 23, 2020
    Date of Patent: July 18, 2023
    Assignee: AMCAD BIOMED CORPORATION
    Inventors: Argon Chen, Hao-Chien Wang, Chiung-Nien Chen, Pei-Lin Lee, Chin-Chung Shu, Edward Chia-Hao Liu, Shu-Ning Yu
  • Publication number: 20220302718
    Abstract: The present invention is proposed to improve a conventional two-pin charging device (dumb charger), which stops charging when the battery is fully charged and can avoid the inrush current at any charging stage. A novel intelligent securely charging system is proposed, which includes a control module for controlling the operation of the system, a power conversion module for converting the input AC power ACin into the electricity required by the system, a switch module for passing or interrupting electrical power transformation, and a pre-charging module with impedance higher than the switch module used for limiting the inrush current, and a voltage detection module which detects the battery voltage Vb, the charging voltage Va. Further, the pre-charging module maintains in the on-state at any charging stage, and the switching module is configured to be in the on-state or off-state according to the application of the charging stage.
    Type: Application
    Filed: March 15, 2022
    Publication date: September 22, 2022
    Inventors: YAN-KENG TAN, MU-HSUN CHEN, CHEN-CHAN LIN, CHIA-HAO LIU, MING-JYUN LI
  • Publication number: 20210046667
    Abstract: A liquid collection device is adapted for collecting liquid flowing along a flow path. The liquid collection device includes a collection unit including a top wall member, a bottom wall member, and a surrounding wall member. The top wall member has a liquid inlet extending along the flow path through the top wall member. The bottom wall member is disposed downstream of the top wall member. The surrounding wall member extends from a perimeter of the bottom wall member toward the top wall member. The top wall member covers the surrounding wall member, and cooperates with the bottom wall member and the surrounding wall member to define a liquid-holding space therein, the liquid inlet being spatially communicated to the liquid-holding space.
    Type: Application
    Filed: September 30, 2019
    Publication date: February 18, 2021
    Inventors: Yo-Hsin SU, Chia-Hao Liu, Hung-Hsiang Lin
  • Publication number: 20200352544
    Abstract: The present disclosure provides a positioning method for head and neck assessment comprising positioning a probe to the head and neck structures of a subject according to reference planes defined by light beams.
    Type: Application
    Filed: July 23, 2020
    Publication date: November 12, 2020
    Applicant: AmCad Biomed Corporation
    Inventors: Argon CHEN, Hao-Chien WANG, Chiung-Nien CHEN, Pei-Lin LEE, Chin-Chung SHU, Edward Chia-Hao LIU, Shu-Ning YU
  • Patent number: 10176572
    Abstract: A method adapted to diagnose airway obstruction in a subject is disclosed. The method comprises the following steps: providing plural cross-sectional ultrasound images of a region of the respiratory tract during the subject's normal breathing, wherein each ultrasound image has plural pixels and each pixel has a color scale value; selecting a region of interest in each ultrasound image; calculating a respective first statistic value. The pixels in each of the region of interest are identified to define a respective airspace region by the color scale values larger than or equal to the respective first statistic value. A respective width of the respiratory tract is calculated and based on the distribution of the pixels in the respective airspace region. The status about an airway obstruction in the subject is classified according to the second statistic value obtained by the calculation of the widths of the respiratory tract.
    Type: Grant
    Filed: December 30, 2016
    Date of Patent: January 8, 2019
    Assignee: AMCAD BIOMED CORPORATION
    Inventors: Argon Chen, Yi-li Lee, Chun-Hsiang Yang, Edward Chia-Hao Liu
  • Publication number: 20180133085
    Abstract: The present invention provides a positioning apparatus for head and neck assessment comprising a base, a head fixation assembly including a main body, a guide and an ear aligning member, a first connector pivotally connected to a lateral end of the main body, a first light transmitter, and a holder assembly including an adjustable first stand secured to the base and a holder for holding a medical device for the assessment or intervention, pivotally connected to the first stand.
    Type: Application
    Filed: November 14, 2016
    Publication date: May 17, 2018
    Applicant: AmCad Biomed Corporation
    Inventors: Argon CHEN, Hao-Chien WANG, Chiung-Nien CHEN, Pei-Lin LEE, Chin-Chung SHU, Edward Chia-Hao LIU, Shu-Ning YU
  • Publication number: 20170365052
    Abstract: A method adapted to diagnose airway obstruction in a subject is disclosed. The method comprises the following steps: providing plural cross-sectional ultrasound images of a region of the respiratory tract during the subject's normal breathing, wherein each ultrasound image has plural pixels and each pixel has a color scale value; selecting a region of interest in each ultrasound image; calculating a respective first statistic value. The pixels in each of the region of interest are identified to define a respective airspace region by the color scale values larger than or equal to the respective first statistic value. A respective width of the respiratory tract is calculated and based on the distribution of the pixels in the respective airspace region. The status about an airway obstruction in the subject is classified according to the second statistic value obtained by the calculation of the widths of the respiratory tract.
    Type: Application
    Filed: December 30, 2016
    Publication date: December 21, 2017
    Applicant: AmCad BioMed Corporation
    Inventors: Argon CHEN, Yi-li LEE, Chun-Hsiang YANG, Edward Chia-Hao LIU
  • Publication number: 20170041101
    Abstract: A re-transmission method is provided. The method includes: generating, at a transmitting party, a packet; adding, at the transmitting party, parity check bits to the packet to form a new packet; transmitting, at the transmitting party, the new packet to a receiving party; determining, at the transmitting party, whether an ARQ feedback is received, wherein the ARQ feedback indicates which half part of the packet is found erroneous at the receiving party if the packet is found erroneous at the receiving party; determining, at the transmitting party, which half part of the packet is found erroneous based on the ARQ feedback if the ARQ feedback is received; and re-transmitting, at the transmitting party, the half part of the packet which is found erroneous at the receiving party.
    Type: Application
    Filed: August 6, 2015
    Publication date: February 9, 2017
    Inventors: DA-CHENG WU, Chia-Hao Liu
  • Patent number: 9031060
    Abstract: A voice over internet protocol (VOIP) system and method are provided. The VOIP method includes steps of generating a phone number for a first terminal device, and a domain name corresponding to that phone number, transmitting the domain name and an internet protocol (IP) address to a dynamic domain name service (DDNS) server for registration, applying the same procedure to second and third terminal devices, generating a name of a group for the first, second, and third terminal devices, generating a domain name corresponding to the name of the group, and transmitting the domain name and the IP address for registration, and acquiring the domain name for the required name of the group, thus allowing calls to be made and available within the group.
    Type: Grant
    Filed: March 7, 2013
    Date of Patent: May 12, 2015
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Chia-Hao Liu, Da-Cheng Wu
  • Publication number: 20140140339
    Abstract: A voice over internet protocol (VOIP) system and method are provided. The VOIP method includes steps of generating a phone number for a first terminal device, and a domain name corresponding to that phone number, transmitting the domain name and an IP address to a DDNS server for registration, applying the same procedure to second and third terminal devices, generating a name of a group for the first, second, and third terminal devices, generating a domain name corresponding to the name of the group, and transmitting the domain name and the IP address for registration, and acquiring the domain name for the required name of the group, thus allowing calls to be made and available within the group.
    Type: Application
    Filed: March 7, 2013
    Publication date: May 22, 2014
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: CHIA-HAO LIU, DA-CHENG WU
  • Publication number: 20120233245
    Abstract: A method registers client devices with a primary device using a backup server. The backup server detects whether the primary server is available, and when the primary server is available, the backup server evaluates the registration capacity of the primary server. The backup server further creates a queue of the client devices registered with the backup server according to the backup registration time of the client devices, and notifies the client devices individually or in groups that the primary server is again available.
    Type: Application
    Filed: June 29, 2011
    Publication date: September 13, 2012
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: CHIA-HAO LIU