Abstract: A semiconductor device package includes a semiconductor die, a first conductive element, a second conductive element, a metal layer, and a first redistribution layer (RDL). The semiconductor die includes a first surface and a second surface opposite to the first surface. The first conductive element is disposed on the second surface of the semiconductor die. The second conductive element is disposed next to the semiconductor die. The metal layer is disposed on the second conductive element and electrically connected to the second conductive element. The first RDL is disposed on the metal layer and electrically connected to the metal layer.

Abstract: A thinned pump includes a casing, a rotor assembly and a stator assembly. The casing includes a base and a cover. The cover covers the base so as to form a fluid chamber together, the cover has an inlet channel and an outlet channel, and the inlet channel and the outlet channel are in fluid communication with the fluid chamber. The rotor assembly includes an impeller and a magnetic component. The impeller is rotatably disposed in the casing, and the magnetic component is embedded into the impeller. The stator assembly includes a plurality of magnetically conductive pillars and a plurality of coils. The magnetically conductive pillars are mounted at one side of the base located opposite to the fluid chamber, and the coils are respectively disposed on the magnetically conductive pillars.

Abstract: A light-emitting fan includes a fan frame, a light-permeable impeller mounted on the fan frame, a first and a second light source assembly. The light-permeable impeller includes a hub and blades. The hub includes a top plate and an annular side plate. The annular side plate is connected to the top plate, the top plate and the annular side plate together form an accommodation space. The annular side plate has an annular side surface facing away from the accommodation space and an inclined incident surface facing away from the annular side surface and non-parallel to the annular side surface. The blades are connected to the annular side surface. The first light source assembly is located in the accommodation space and configured to emit light to the top plate. The second light source assembly is located in the accommodation space and configured to emit light to the inclined incident surface.

Abstract: This disclosure relates to a thin pump including a case, a rotor, and a stator. The case has a bottom surface, a lower chamber, an upper chamber, and an accommodation space. The upper chamber is located further away from the bottom surface than the lower chamber. The upper chamber has two opposite ends respectively in fluid communication with the lower chamber and the accommodation space. The rotor includes an impeller and a magnet. The impeller is rotatably disposed in the lower chamber of the case. The magnet is disposed on the impeller. The stator is disposed in the case. The stator corresponds to the magnet of the rotor so as to drive the rotor to rotate with respect to the case.

Abstract: A thin pump includes a casing, a rotor, and a stator. The casing has a bottom surface, an outer surface, a lower chamber, an upper chamber, an inlet channel, and an outlet channel. The outer surface is connected to the bottom surface. The upper chamber and the lower chamber connected to each other are surrounded by the outer surface. The upper chamber is located further away from the bottom surface than the lower chamber. The inlet channel and the outlet channel are located on the outer surface. The inlet channel and the outlet channel are respectively connected to the upper chamber and the lower chamber. The rotor includes an impeller rotatably disposed in the lower chamber and a magnetic component disposed on the impeller. The stator disposed in the casing corresponds to the magnetic component so as to drive the rotor to rotate with respect to the casing.

Abstract: A fan device comprises a processor, a fan motor and a light emitting element. The processor comprises an input terminal, a first and a second output terminals. An initial mode of the processor is in one of a rotation speed control mode and a light emission control mode. The input terminal is configured to receive an input instruction, and the input instruction comprises a first characteristic. The fan motor is electrically connected to the first output terminal, and the light emitting element is electrically connected to the second output terminal. When a value of the first characteristic is within a characteristic value range, the processor is switched from the initial mode to the other of the rotation speed control mode and the light emission control mode. When the value of the first characteristic is not within the characteristic value range, the initial mode of the processor is maintained.

Abstract: A liquid supply device adapted to a liquid cooling system includes a casing, a cover, a plunger, a driving unit and a sensing unit. The casing has a liquid outlet. The cover is connected to the casing. A chamber is formed between the casing and the cover and contains a cooling liquid. The chamber communicates with the liquid outlet. The plunger is movably disposed in the chamber. The driving unit is disposed in the chamber and used for driving the plunger to move. The sensing unit is selectively disposed on one of the casing and the plunger. The sensing unit senses a liquid level of the cooling liquid and outputs a sensing signal with a predetermined status as the liquid level is equal to or lower than a predetermined height.

Abstract: A thin pump includes a casing, a rotor, and a stator. The casing has a bottom surface, an outer surface, a lower chamber, an upper chamber, an inlet channel, and an outlet channel. The outer surface is connected to the bottom surface. The upper chamber and the lower chamber connected to each other are surrounded by the outer surface. The upper chamber is located further away from the bottom surface than the lower chamber. The inlet channel and the outlet channel are located on the outer surface. The inlet channel and the outlet channel are respectively connected to the upper chamber and the lower chamber. The rotor includes an impeller rotatably disposed in the lower chamber and a magnetic component disposed on the impeller. The stator disposed in the casing corresponds to the magnetic component so as to drive the rotor to rotate with respect to the casing.

Abstract: A semiconductor device package includes a semiconductor die, a first conductive element, a second conductive element, a metal layer, and a first redistribution layer (RDL). The semiconductor die includes a first surface and a second surface opposite to the first surface. The first conductive element is disposed on the second surface of the semiconductor die. The second conductive element is disposed next to the semiconductor die. The metal layer is disposed on the second conductive element and electrically connected to the second conductive element. The first RDL is disposed on the metal layer and electrically connected to the metal layer.

Abstract: A fan device comprises a processor, a fan motor and a light emitting element. The processor comprises an input terminal, a first and a second output terminals. An initial mode of the processor is in one of a rotation speed control mode and a light emission control mode. The input terminal is configured to receive an input instruction, and the input instruction comprises a first characteristic. The fan motor is electrically connected to the first output terminal, and the light emitting element is electrically connected to the second output terminal. When a value of the first characteristic is within a characteristic value range, the processor is switched from the initial mode to the other of the rotation speed control mode and the light emission control mode. When the value of the first characteristic is not within the characteristic value range, the initial mode of the processor is maintained.

Abstract: The present disclosure relates to a semiconductor device package. The semiconductor device package includes a substrate, a support structure, an electronic component and an adhesive. The support structure is disposed on the substrate. The electronic component is disposed on the support structure. The adhesive is disposed between the substrate and the electronic component and covers the support structure. A hardness of the support structure is less than a hardness of the electronic component.

Abstract: A semiconductor device package includes a semiconductor die, a first conductive element, a second conductive element, a metal layer, and a first redistribution layer (RDL). The semiconductor die includes a first surface and a second surface opposite to the first surface. The first conductive element is disposed on the second surface of the semiconductor die. The second conductive element is disposed next to the semiconductor die. The metal layer is disposed on the second conductive element and electrically connected to the second conductive element. The first RDL is disposed on the metal layer and electrically connected to the metal layer.

Abstract: A fan includes a motor, a plurality of fan blades coupled to the motor and rotatable by the motor, a light source positioned to be independent from rotation of the plurality of fan blades, and a processor controlling the first light source to turn on/off with a frequency determined at least based on a relation with respect to a rotational speed of the plurality of fan blades. Thereby, a visually static view or a slowly rotating view of the fan blades is displayed while the fan blades are operating.

Abstract: The present disclosure relates to a semiconductor device package. The semiconductor device package includes a substrate, a support structure, an electronic component and an adhesive. The support structure is disposed on the substrate. The electronic component is disposed on the support structure. The adhesive is disposed between the substrate and the electronic component and covers the support structure. A hardness of the support structure is less than a hardness of the electronic component.

Abstract: The disclosure provides a connector assembly which includes a first connector module, a second connector module and a connection assistance module. The first connector module includes a first carrier and two first connectors which are fixed to the first carrier. The second connector module includes a second carrier and two second connectors which are fixed to the second carrier. The second connectors are respectively and detachably connected to the first connectors. The connection assistance module includes a rotatable component and an assembled component respectively disposed on the first carrier and the second carrier. The rotatable component has an inclined surface, and the assembled component has an engaging portion. When the rotatable component is rotated, the engaging portion is guided by the inclined surface so that the first carrier is moved toward or away from the second carrier, allowing the first connectors to be detachably connected to the second connectors.

Abstract: A semiconductor device package includes a semiconductor die, a first conductive element, a second conductive element, a metal layer, and a first redistribution layer (RDL). The semiconductor die includes a first surface and a second surface opposite to the first surface. The first conductive element is disposed on the second surface of the semiconductor die. The second conductive element is disposed next to the semiconductor die. The metal layer is disposed on the second conductive element and electrically connected to the second conductive element. The first RDL is disposed on the metal layer and electrically connected to the metal layer.

Abstract: The present disclosure relates to a semiconductor device package. The semiconductor device package includes a substrate, a support structure, an electronic component and an adhesive. The support structure is disposed on the substrate. The electronic component is disposed on the support structure. The adhesive is disposed between the substrate and the electronic component and covers the support structure. A hardness of the support structure is less than a hardness of the electronic component.

Abstract: The disclosure provides a connector assembly which includes a first connector module, a second connector module and a connection assistance module. The first connector module includes a first carrier and two first connectors which are fixed to the first carrier. The second connector module includes a second carrier and two second connectors which are fixed to the second carrier. The second connectors are respectively and detachably connected to the first connectors. The connection assistance module includes a rotatable component and an assembled component respectively disposed on the first carrier and the second carrier. The rotatable component has an inclined surface, and the assembled component has an engaging portion. When the rotatable component is rotated, the engaging portion is guided by the inclined surface so that the first carrier is moved toward or away from the second carrier, allowing the first connectors to be detachably connected to the second connectors.

Abstract: A fan includes a motor, a plurality of fan blades coupled to the motor and rotatable by the motor, a light source positioned to be independent from rotation of the plurality of fan blades, and a processor controlling the first light source to turn on/off with a frequency determined at least based on a relation with respect to a rotational speed of the plurality of fan blades. Thereby, a visually static view or a slowly rotating view of the fan blades is displayed while the fan blades are operating.

Abstract: A fan includes a motor, a plurality of fan blades coupled to the motor and rotatable by the motor, a light source positioned to be independent from rotation of the plurality of fan blades, and a processor controlling the first light source to turn on/off with a frequency determined at least based on a relation with respect to a rotational speed of the plurality of fan blades. Thereby, a visually static view or a slowly rotating view of the fan blades is displayed while the fan blades are operating.