Abstract: A substrate includes a first doped region having a first type dopant, and a second doped region having a second type dopant and adjacent to the first doped region. A stack is formed that includes first layers and second layers alternating with each other. The first and second layers each have a first and second semiconductor material, respectively. The second semiconductor material is different than the first semiconductor material. A mask element is formed that has an opening in a channel region over the second doped region. A top portion of the stack not covered by the mask element is recessed. The stack is then processed to form a first and a second transistors. The first transistor has a first number of first layers. The second transistor has a second number of first layers. The first number is greater than the second number.

Abstract: A bicycle head is configured to be mounted on a bicycle frame. The bicycle head includes a vertical tube, a stem, a handlebar, a first brake lever, and a shift control box. One end of the stem is mounted on the vertical tube. The handlebar is fixed to another end of the stem. The first brake lever assembly is mounted on the handlebar. The first brake lever assembly includes a main body, a brake assembly, a shift switch, and a battery. The brake assembly and the battery are disposed on the main body, and the shift switch is disposed on the brake assembly. The shift control box is disposed on one of the vertical tube, the stem, and the handlebar and electrically connected to the battery and the shift switch.

Abstract: A bicycle head is configured to be mounted on a bicycle frame. The bicycle head includes a vertical tube, a stem, a handlebar, a first brake lever, and a shift control box. One end of the stem is mounted on the vertical tube. The handlebar is fixed to another end of the stem. The first brake lever assembly is mounted on the handlebar. The first brake lever assembly includes a main body, a brake assembly, a shift switch, and a battery. The brake assembly and the battery are disposed on the main body, and the shift switch is disposed on the brake assembly. The shift control box is disposed on one of the vertical tube, the stem, and the handlebar and electrically connected to the battery and the shift switch.

Abstract: A bicycle component comprises a main body and a controller. The main body comprises an attaching portion configured to attach to a bicycle. The controller is disposed in the main body, wherein the controller is configured to electrically connect to one of a first power source and a second power source, the first power source and the second power source are different in an electricity characteristic, and the controller comprises: a power detecting module configured to determine whether a power received by the controller is from the first power source or the second power source; and a wireless transmission module electrically connecting to the power detecting module, wherein the wireless transmission module performs a pairing procedure when the power detecting module determines that the power received by the controller is from the first power source.

Abstract: A semiconductor package is provided. The semiconductor package includes a carrier substrate having opposite first surface and second surface, and a chip stack disposed on the first surface of the carrier substrate. The chip stack includes a first semiconductor die, a second semiconductor die, and an interposer between the first semiconductor die and the second semiconductor die. The interposer transmits signals between the first semiconductor die and the second semiconductor die.

Abstract: A semiconductor package structure includes a base. A first die is mounted on the base. The first die includes a plurality of first pads arranged in a first tier, and a plurality of second pads arranged in a second tier. A second die is mounted on the base and includes a plurality of third pads with the first pad area, and a plurality of fourth pads with the second pad area, alternately arranged in a third tier. The second die also includes a first bonding wire having two terminals respectively coupled to one of the first pads and one of the fourth pads. The semiconductor package structure also includes a second bonding wire having two terminals respectively coupled to one of the third pads and one of the second pads.

Abstract: A wireless communication device including an integrated processing circuit, a first memory and a testing circuit is provided. The integrated processing circuit includes a processing unit capable of processing a wireless communication signal and a radio frequency (RF) unit capable of performing a conversion between a radio frequency (RF) signal and a baseband signal, wherein the wireless communication signal is one of the RF signal and the baseband signal. The first memory is coupled to the integrated processing circuit. The first memory is capable of storing data used by the processing unit. The testing circuit is coupled to the first memory, and is capable of testing the first memory for determining if the first memory is an effective memory. The RF unit is put in a first package, the first memory is put in a second package, and the first package and the second package are packaged in a single device.

Abstract: A semiconductor package is provided. The semiconductor package includes a carrier substrate having opposite first surface and second surface, and a chip stack disposed on the first surface of the carrier substrate. The chip stack includes a first semiconductor die, a second semiconductor die, and an interposer between the first semiconductor die and the second semiconductor die. The interposer transmits signals between the first semiconductor die and the second semiconductor die.

Abstract: A wireless communication device including an integrated processing circuit, a first memory and a testing circuit is provided. The integrated processing circuit includes a processing unit capable of processing a wireless communication signal and a radio frequency (RF) unit capable of performing a conversion between a radio frequency (RF) signal and a baseband signal, wherein the wireless communication signal is one of the RF signal and the baseband signal. The first memory is coupled to the integrated processing circuit. The first memory is capable of storing data used by the processing unit. The testing circuit is coupled to the first memory, and is capable of testing the first memory for determining if the first memory is an effective memory. The RF unit and the first memory are placed in a single module.

Abstract: A semiconductor package structure includes a base. A first die is mounted on the base. The first die includes a plurality of first pads arranged in a first tier, and a plurality of second pads arranged in a second tier. A second die is mounted on the base and includes a plurality of third pads with the first pad area, and a plurality of fourth pads with the second pad area, alternately arranged in a third tier. The second die also includes a first bonding wire having two terminals respectively coupled to one of the first pads and one of the fourth pads. The semiconductor package structure also includes a second bonding wire having two terminals respectively coupled to one of the third pads and one of the second pads.

Abstract: A wireless communication device including an integrated processing circuit, a first memory and a testing circuit is provided. The integrated processing circuit includes a processing unit capable of processing a wireless communication signal and a radio frequency (RF) unit capable of performing a conversion between a radio frequency (RF) signal and a baseband signal, wherein the wireless communication signal is one of the RF signal and the baseband signal. The first memory is coupled to the integrated processing circuit. The first memory is capable of storing data used by the processing unit. The testing circuit is coupled to the first memory, and is capable of testing the first memory for determining if the first memory is an effective memory. The RF unit is put in a first package, the first memory is put in a second package, and the first package and the second package are packaged in a single device.

Abstract: A semiconductor package structure includes a base. A first die is mounted on the base. The first die comprises a plurality of first pads with a first pad area arranged in a first tier. A plurality of second pads with a second pad area is arranged in a second tier. A second die is mounted on the base. The second die includes a plurality of third pads arranged in a third tier. A first bonding wire has two terminals respectively coupled to one of the first pads and one of the third pads. A second bonding wire has two terminals respectively coupled to one of the third pads and one of the second pads.

Abstract: A semiconductor memory package is provided. The package includes a semiconductor die having a first die portion and a second die portion. A post-passivation layer is on the semiconductor die. A first post-passivation interconnect (PPI) structure includes pluralities of first and second pads arranged in first and second tiers, respectively. The first and second pads are disposed on a first die portion of the semiconductor die. A second PPI structure includes pluralities of third and fourth pads arranged in third and fourth tiers, respectively. The third and fourth pads are disposed on a second die portion of the semiconductor die. One of the first pads and one of the fourth pads are coupled to each other by a first bonding wire. One of the second pads and one of the third pads are coupled to each other.

Abstract: A wireless communication device including an integrated processing circuit and a first memory is provided. The integrated processing circuit includes a processing unit capable of processing a wireless communication signal and a radio frequency (RF) unit capable of performing a conversion between a radio frequency (RF) signal and a baseband signal, wherein the wireless communication signal is one of the RF signal and the baseband signal. The first memory is coupled to the integrated processing circuit. The first memory is capable of storing data used by the processing unit, wherein the integrated processing circuit and the first memory are packaged in a single semiconductor package.

Abstract: A wireless communication device including an integrated processing circuit, a first memory and a testing circuit is provided. The integrated processing circuit includes a processing unit capable of processing a wireless communication signal and a radio frequency (RF) unit capable of performing a conversion between a radio frequency (RF) signal and a baseband signal, wherein the wireless communication signal is one of the RF signal and the baseband signal. The first memory is coupled to the integrated processing circuit. The first memory is capable of storing data used by the processing unit. The testing circuit is coupled to the first memory, and is capable of testing the first memory for determining if the first memory is an effective memory. The RF unit and the first memory are placed in a single module.

Abstract: A wireless communication device including an integrated processing circuit and a first memory is provided. The integrated processing circuit includes a processing unit capable of processing a wireless communication signal and a radio frequency (RF) unit capable of performing a conversion between a radio frequency (RF) signal and a baseband signal, wherein the wireless communication signal is one or more of the RF signal and the baseband signal. The first memory is coupled to the integrated processing circuit. The first memory is capable of storing data used by the processing unit, wherein the RF unit and the first memory are packaged in a single semiconductor device.

Abstract: A semiconductor package structure includes a base. A first die is mounted on the base. The first die comprises a plurality of first pads with a first pad area arranged in a first tier. A plurality of second pads with a second pad area is arranged in a second tier. A second die is mounted on the base. The second die includes a plurality of third pads arranged in a third tier. A first bonding wire has two terminals respectively coupled to one of the first pads and one of the third pads. A second bonding wire has two terminals respectively coupled to one of the third pads and one of the second pads.

Abstract: The invention provides a semiconductor package structure. The semiconductor package structure includes a base. A first die is mounted on the base. The first die comprises a plurality of first pads with a first pad area arranged in a first tier. A plurality of second pads with a second pad area is arranged in a second tier. A second die is mounted on the base. The second die comprises a plurality of third pads with the first pad area and a plurality of fourth pads with the second pad area alternately arranged in a third tier. A first bonding wire has two terminals respectively coupled to one of the first pads and one of the fourth pads. A second bonding wire has two terminals respectively coupled to one of the third pads and one of the second pads.

Abstract: A wireless communication device including an integrated processing circuit and a first memory is provided. The integrated processing circuit includes a processing unit capable of processing a wireless communication signal and a radio frequency (RF) unit capable of performing a conversion between a radio frequency (RF) signal and a baseband signal, wherein the wireless communication signal is one or more of the RF signal and the baseband signal. The first memory is coupled to the integrated processing circuit. The first memory is capable of storing data used by the processing unit, wherein the RF unit and the first memory are packaged in a single semiconductor device.

Abstract: An intuitive eco-driving assistance system is mounted on a vehicle and has an input module, a control module and an output module. The control module is electrically connected to the input module and the output module. The output module acquires images ahead of the vehicle and speed signals for the control module to recognize a speed limit, traffic lights and a speed and distance of any obstacle on the images. Furthermore, according to the driving limits of the road and actual vehicle speed, the output module prompts for an eco-driving instruction and the speed limit meeting the road condition visually or audibly. Accordingly, the issue of conventional vehicles being structurally complicated and costly for conserving energy, only passively prompting fuel consumption, and consuming more fuel can be solved without requiring any additional and complicated system.