Patents by Inventor Chia-Hsiang Hsiang

Chia-Hsiang Hsiang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Supporting structure module and electronic device using the same
    Patent number: 8526171
    Abstract: This disclosure provides a supporting structure module and an electronic device using the same. The supporting structure module in the invention is used in the electronic device. The electronic device includes a first casing, a hinge, and a second casing rotatable relative to the first casing via the hinge. The supporting structure module includes a first supporting structure, and the first supporting structure includes a first bracket and a first hinge cover. The first bracket is fixed to and exposed from the first casing. The first hinge cover is connected with the first bracket by integral forming, and the first hinge cover is exposed from the first casing and covers a part of the hinge.
    Type: Grant
    Filed: June 15, 2011
    Date of Patent: September 3, 2013
    Assignee: Pegatron Corporation
    Inventors: Jiun-Lin Wu, Chia-Hsiang Hsiang, Ching-Hao Yu
  • SUPPORTING STRUCTURE MODULE AND ELECTRONIC DEVICE USING THE SAME
    Publication number: 20110310541
    Abstract: This disclosure provides a supporting structure module and an electronic device using the same. The supporting structure module in the invention is used in the electronic device. The electronic device includes a first casing, a hinge, and a second casing rotatable relative to the first casing via the hinge. The supporting structure module includes a first supporting structure, and the first supporting structure includes a first bracket and a first hinge cover. The first bracket is fixed to and exposed from the first casing. The first hinge cover is connected with the first bracket by integral forming, and the first hinge cover is exposed from the first casing and covers a part of the hinge.
    Type: Application
    Filed: June 15, 2011
    Publication date: December 22, 2011
    Inventors: Jiun-Lin Wu, Chia-Hsiang Hsiang, Ching-Hao Yu