Patents by Inventor Chia Hsiang Lee

Chia Hsiang Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11961770
    Abstract: Some embodiments of the present disclosure relate to a processing tool. The tool includes a housing enclosing a processing chamber, and an input/output port configured to pass a wafer through the housing into and out of the processing chamber. A back-side macro-inspection system is arranged within the processing chamber and is configured to image a back side of the wafer. A front-side macro-inspection system is arranged within the processing chamber and is configured to image a front side of the wafer according to a first image resolution. A front-side micro-inspection system is arranged within the processing chamber and is configured to image the front side of the wafer according to a second image resolution which is higher than the first image resolution.
    Type: Grant
    Filed: November 4, 2021
    Date of Patent: April 16, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chia-Han Lin, Chien-Fa Lee, Hsu-Shui Liu, Jiun-Rong Pai, Sheng-Hsiang Chuang, Surendra Kumar Soni, Shou-Wen Kuo, Wu-An Weng, Gary Tsai, Chien-Ko Liao, Ya Hsun Hsueh, Becky Liao, Ethan Yu, Ming-Chi Tsai, Kuo-Yi Liu
  • Patent number: 11935981
    Abstract: A photo-detecting device includes a first semiconductor layer with a first dopant, a light-absorbing layer, a second semiconductor layer, and a semiconductor contact layer. The second semiconductor layer is located on the first semiconductor layer and has a first region and a second region, the light absorbing layer is located between the first semiconductor layer and the second semiconductor layer and has a third region and a fourth region, the semiconductor contact layer contacts the first region. The first region includes a second dopant and a third dopant, the second region includes second dopant, and the third region includes third dopant. The semiconductor contact layer has a first thickness greater than 50 ? and smaller than 1000 ?.
    Type: Grant
    Filed: June 30, 2021
    Date of Patent: March 19, 2024
    Assignee: EPISTAR CORPORATION
    Inventors: Chu-Jih Su, Chia-Hsiang Chou, Wei-Chih Peng, Wen-Luh Liao, Chao-Shun Huang, Hsuan-Le Lin, Shih-Chang Lee, Mei Chun Liu, Chen Ou
  • Patent number: 11497440
    Abstract: The present invention provides a human-computer interactive rehabilitation system, which can automatically calculate rehabilitation strength suitable for the patient, so that it is not necessary to manually evaluate and adjust the parameter settings in human-computer interactive rehabilitation system when different patients use it. At the same time, the human-machine interactive rehabilitation system and the hospital end can track the rehabilitation status and intervene through the data platform at any time. The platform establishes a cloud community feedback and encouragement mechanism, and immediately transmits the rehabilitation results to the designated barriers of the patients, provides patient encouragement feedback, and strengthens the community interaction and linkage in the medical relationship.
    Type: Grant
    Filed: October 17, 2019
    Date of Patent: November 15, 2022
    Assignee: FU JEN CATHOLIC UNIVERSITY
    Inventors: Chien-Wen Lin, Chia-Hsiang Lee, Yu-Jen Chen, Jui-Yun Hung
  • Publication number: 20200121247
    Abstract: The present invention provides a human-computer interactive rehabilitation system, which can automatically calculate rehabilitation strength suitable for the patient, so that it is not necessary to manually evaluate and adjust the parameter settings in human-computer interactive rehabilitation system when different patients use it. At the same time, the human-machine interactive rehabilitation system and the hospital end can track the rehabilitation status and intervene through the data platform at any time. The platform establishes a cloud community feedback and encouragement mechanism, and immediately transmits the rehabilitation results to the designated barriers of the patients, provides patient encouragement feedback, and strengthens the community interaction and linkage in the medical relationship.
    Type: Application
    Filed: October 17, 2019
    Publication date: April 23, 2020
    Inventors: Chien-Wen Lin, Chia-Hsiang Lee, Yu-Jen Chen, Jui-Yun Hung
  • Publication number: 20180020160
    Abstract: A 360-degree panoramic camera device for taking a 360-degree panoramic image in a once-through operation includes a first case, a second case connected with the first case, and a panoramic camera module located between the first case and the second case. The panoramic camera module includes a circuit board, a first camera module fixed on the circuit board and capturing a first image in a first direction through the first case, and a second camera module fixed on the circuit board and capturing a second image in a second direction through the second. case. The first direction is opposite the second direction. A first optical axis of the first camera module and a second optical axis of the second camera module are misaligned from a straight line and are parallel to each other.
    Type: Application
    Filed: October 14, 2016
    Publication date: January 18, 2018
    Inventors: CHEN-YI LIN, KUANG-LIANG CHANG, CHIA-HSIANG LEE, SHIH-HENG WEI
  • Publication number: 20040150615
    Abstract: The present invention discloses a wire/wireless adapter for wired computer peripherals comprising an equipment side and a host side, wherein the equipment side comprises at least a first microprocessor, a first adapter port, an ID identification module, a first RF modulation circuit, a first RF demodulation circuit, a battery and a first antenna; the host side comprises a second microprocessor, a second adapter port, a second RF modulation circuit, a second RF demodulation circuit and a second antenna, the wire/wireless adapter in the present invention effectively transmitting a signal of the wired computer peripheral originally connected by transmission cable to the host side via wireless communication.
    Type: Application
    Filed: January 31, 2003
    Publication date: August 5, 2004
    Inventor: Chia-Hsiang Lee
  • Publication number: 20040113886
    Abstract: A sensing structure for optic inputs is embodied in a computer mouse or a touch pad. The sensing structure includes a light source for emitting a light toward an operation surface on which the mouse moves or a finger moving on the touch pad. The light is reflected by the operation surface or the finger toward a lens and is focused by the lens onto a sensor chip to be detected thereby. The light source is located adjacent the lens whereby light from the light source can be directly projected onto the operation surface or the finger. The light does not need to travel through transparent body to be redirected thereby toward the operation surface. This alleviates attenuation of the light from the light source and detection sensitivity and correctness are enhanced.
    Type: Application
    Filed: December 11, 2002
    Publication date: June 17, 2004
    Inventor: Chia Hsiang Lee
  • Patent number: D698841
    Type: Grant
    Filed: December 27, 2012
    Date of Patent: February 4, 2014
    Assignee: D-Link Corporation
    Inventors: Chia-Hsiang Lee, Ho-Hsien Kao