Patents by Inventor Chia-Hsiang Yuan

Chia-Hsiang Yuan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of forming package structure with dummy pads for bonding
    Patent number: 9673178
    Abstract: Provided is a package structure including a substrate, N dies, N first pads, N vertical wires, and a second pad. The N dies are stacked alternatively on the substrate, so as to form a multi-die stack structure. The N dies include, from bottom to top, first to Nth dies, wherein N is an integer greater than 1. The first die is a bottom die, and the Nth die is a top die. The first pads are disposed on an active surface of the dies respectively. The vertical wires are disposed on the first pads respectively. The second pad is disposed on the top die.
    Type: Grant
    Filed: December 16, 2015
    Date of Patent: June 6, 2017
    Assignee: Powertech Technology Inc.
    Inventors: Chia-Hsiang Yuan, Chia-Wei Chang, Kuo-Ting Lin, Yong-Cheng Chuang
  • PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
    Publication number: 20170110439
    Abstract: Provided is a package structure including a substrate, N dies, N first pads, N vertical wires, and a second pad. The N dies are stacked alternatively on the substrate, so as to form a multi-die stack structure. The N dies include, from bottom to top, first to Nth dies, wherein N is an integer greater than 1. The first die is a bottom die, and the Nth die is a top die. The first pads are disposed on an active surface of the dies respectively. The vertical wires are disposed on the first pads respectively. The second pad is disposed on the top die.
    Type: Application
    Filed: December 16, 2015
    Publication date: April 20, 2017
    Inventors: Chia-Hsiang Yuan, Chia-Wei Chang, Kuo-Ting Lin, Yong-Cheng Chuang