Abstract: The disclosure provides an electronic device including a host control circuit, a display driving circuit, a touch driving circuit and a logic circuit. The host control circuit is configured to provide a first reset control signal. The display driving circuit is configured to reset according to the first reset control signal. The logic circuit is configured to generate a second reset control signal to the touch driving circuit according to the first reset control signal and an enable signal. During a sleep mode of the electronic device, the enable signal has a first logic level. In response to the enable signal at the first logic level, the logic circuit generates the second reset control signal at the first logic level. The touch driving circuit does not reset according to the second reset control signal at the first logic level.

Abstract: In some implementations, one or more semiconductor processing tools may form a metal cap on a metal gate. The one or more semiconductor processing tools may form one or more dielectric layers on the metal cap. The one or more semiconductor processing tools may form a recess to the metal cap within the one or more dielectric layers. The one or more semiconductor processing tools may perform a bottom-up deposition of metal material on the metal cap to form a metal plug within the recess and directly on the metal cap.

Abstract: A video decoding method includes: before residual decoding of a coding unit is completed, referring to available information to determine whether to decode information that an inverse transform (IT) circuit needs for applying inverse transform to transform blocks of the coding unit, and generating a determination result; and controlling coefficient transmission of the coding unit to the IT circuit according to the determination result.

Abstract: In some implementations, one or more semiconductor processing tools may form a metal cap on a metal gate. The one or more semiconductor processing tools may form one or more dielectric layers on the metal cap. The one or more semiconductor processing tools may form a recess to the metal cap within the one or more dielectric layers. The one or more semiconductor processing tools may perform a bottom-up deposition of metal material on the metal cap to form a metal plug within the recess and directly on the metal cap.

Abstract: A 3D printing device having a main body, a forming platform, an infrared thermometer, a heater, a thermocouple and a calibrator is provided. A forming chamber is defined in the main body. The forming platform is accommodated in the forming chamber, and a top surface thereof forms a bottom of the forming chamber. A reference surface is defined in the forming chamber, and the reference surface has an infrared radiance approximate to the powder. The infrared thermometer in the main body is disposed above and toward the reference surface. The heater is disposed in the main body to conductively heat the reference surface. The thermocouple is arranged adjacent to the reference surface. The calibrator is electrically connected to the infrared thermometer and the thermocouple to compare respective measured temperatures of the reference surface, and thereby determine if the infrared thermometer should be cleared.