Patents by Inventor Chia-Hsien Lu

Chia-Hsien Lu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11934027
    Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.
    Type: Grant
    Filed: June 21, 2022
    Date of Patent: March 19, 2024
    Assignee: TDK TAIWAN CORP.
    Inventors: Chao-Chang Hu, Chih-Wei Weng, Chia-Che Wu, Chien-Yu Kao, Hsiao-Hsin Hu, He-Ling Chang, Chao-Hsi Wang, Chen-Hsien Fan, Che-Wei Chang, Mao-Gen Jian, Sung-Mao Tsai, Wei-Jhe Shen, Yung-Ping Yang, Sin-Hong Lin, Tzu-Yu Chang, Sin-Jhong Song, Shang-Yu Hsu, Meng-Ting Lin, Shih-Wei Hung, Yu-Huai Liao, Mao-Kuo Hsu, Hsueh-Ju Lu, Ching-Chieh Huang, Chih-Wen Chiang, Yu-Chiao Lo, Ying-Jen Wang, Shu-Shan Chen, Che-Hsiang Chiu
  • Patent number: 11832393
    Abstract: An information handling system printed circuit board includes solder pads that accept footprint compatible integrated circuits, such as charger integrated circuits that provide power with different choke circuit supporting components. Solder pads for supporting components include first and second conductive areas sized to accept a first supporting component, each of the first and second conductive areas including an intervening non-conductive area that manages positioning of a smaller second supporting component at solder reflow.
    Type: Grant
    Filed: June 21, 2022
    Date of Patent: November 28, 2023
    Assignee: Dell Products L.P.
    Inventors: Yu-Lin Tsai, Chia-Hsien Lu, Chun-Min He, RungLung Lin, Chin-Chung Wu
  • Publication number: 20220322591
    Abstract: An information handling system printed circuit board includes solder pads that accept footprint compatible integrated circuits, such as charger integrated circuits that provide power with different choke circuit supporting components. Solder pads for supporting components include first and second conductive areas sized to accept a first supporting component, each of the first and second conductive areas including an intervening non-conductive area that manages positioning of a smaller second supporting component at solder reflow.
    Type: Application
    Filed: June 21, 2022
    Publication date: October 6, 2022
    Applicant: Dell Products L.P.
    Inventors: Yu-Lin Tsai, Chia-Hsien Lu, Chun-Min He, RungLung Lin, Chin-Chung Wu
  • Patent number: 11432447
    Abstract: An information handling system printed circuit board includes solder pads that accept footprint compatible integrated circuits, such as charger integrated circuits that provide power with different choke circuit supporting components. Solder pads for supporting components include first and second conductive areas sized to accept a first supporting component, each of the first and second conductive areas including an intervening non-conductive area that manages positioning of a smaller second supporting component at solder reflow.
    Type: Grant
    Filed: June 5, 2019
    Date of Patent: August 30, 2022
    Assignee: Dell Products L.P.
    Inventors: Yu-Lin Tsai, Chia-Hsien Lu, Chun-Min He, RungLung Lin, Chin-Chung Wu
  • Publication number: 20200390012
    Abstract: An information handling system printed circuit board includes solder pads that accept footprint compatible integrated circuits, such as charger integrated circuits that provide power with different choke circuit supporting components. Solder pads for supporting components include first and second conductive areas sized to accept a first supporting component, each of the first and second conductive areas including an intervening non-conductive area that manages positioning of a smaller second supporting component at solder reflow.
    Type: Application
    Filed: June 5, 2019
    Publication date: December 10, 2020
    Applicant: Dell Products L.P.
    Inventors: Yu-Lin Tsai, Chia-Hsien Lu, Chun-Min He, RungLung Lin, Chin-Chung Wu
  • Patent number: 9779725
    Abstract: A voice wakeup detecting device for an electronic product includes a front end detecting circuit, a speech recognition processor and a main processor. The front end detecting circuit judges whether a voice signal contains a sub-keyword according to sub-keyword model parameters. If the front end detecting circuit confirms that the voice signal contains the sub-keyword, then it generates a first interrupt signal. In response to the first interrupt signal, the speech recognition processor is enabled to judge whether the voice signal contains a keyword according to keyword model parameters. If the speech recognition processor confirms that the voice signal contains the keyword, then it generates a second interrupt signal. In response to the second interrupt signal, the main processor is enabled. Consequently, the electronic produce is waked up from a sleep state to a normal working state.
    Type: Grant
    Filed: October 1, 2015
    Date of Patent: October 3, 2017
    Assignee: MEDIATEK INC.
    Inventors: Liang-Che Sun, Chia-Hsien Lu, Yiou-Wen Cheng, Hsin-Ping Cheng
  • Publication number: 20160306758
    Abstract: A processing system has a keyword recognition sub-system and a direct memory access (DMA) controller. The keyword recognition sub-system has a processor and a local memory device. The processor performs at least keyword recognition. The local memory device is accessible to the processor and is arranged to buffer at least data needed by the keyword recognition. The DMA controller interfaces between the local memory device of the keyword recognition sub-system and an external memory device, and is arranged to perform DMA data transaction between the local memory device and the external memory device.
    Type: Application
    Filed: November 5, 2015
    Publication date: October 20, 2016
    Inventors: Chia-Hsien LU, Chih-Ping LIN
  • Publication number: 20160171975
    Abstract: A voice wakeup detecting device for an electronic product includes a front end detecting circuit, a speech recognition processor and a main processor. The front end detecting circuit judges whether a voice signal contains a sub-keyword according to sub-keyword model parameters. If the front end detecting circuit confirms that the voice signal contains the sub-keyword, then it generates a first interrupt signal. In response to the first interrupt signal, the speech recognition processor is enabled to judge whether the voice signal contains a keyword according to keyword model parameters. If the speech recognition processor confirms that the voice signal contains the keyword, then it generates a second interrupt signal. In response to the second interrupt signal, the main processor is enabled. Consequently, the electronic produce is waked up from a sleep state to a normal working state.
    Type: Application
    Filed: October 1, 2015
    Publication date: June 16, 2016
    Inventors: Liang-Che Sun, Chia-Hsien Lu, Yiou-Wen Cheng, Hsin-Ping Cheng
  • Publication number: 20110154436
    Abstract: A provider management method conforming to an Android platform is provided. An authentication procedure is performed between a consumer and a provider, wherein the authentication procedure is performed via a binding unit, and the binding unit is an interface enabling inter-process communication conforming to the Android platform.
    Type: Application
    Filed: October 7, 2010
    Publication date: June 23, 2011
    Applicant: MEDIATEK INC.
    Inventors: Jian-Ming Jian, Hung-Ta Lee, Chia-Hsien Lu