Patents by Inventor Chia-Hsin Yen

Chia-Hsin Yen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Flexible circuit board
    Patent number: 11606860
    Abstract: A flexible circuit board includes a flexible substrate, a chip and a patterned circuit layer. A surface of the flexible substrate is separated into a working area and a nonworking area according to a cutting line. The chip is disposed on the working area. The patterned circuit layer is disposed on the surface and includes signal transmission wires and bypass wires, the bypass wires are not electrically connected to the chip. Each of the bypass wires includes a bypass transmission portion located on the working area and an anti-peeling portion located on the nonworking area. A blank area exists between the anti-peeling area and the bypass transmission portion, and the cutting line passes through the blank area. A distance between 100 um and 400 um exists from the anti-peeling portion to the cutting line.
    Type: Grant
    Filed: October 19, 2021
    Date of Patent: March 14, 2023
    Assignee: CHIPBOND TECHNOLOGY CORPORATION
    Inventors: Gwo-Shyan Sheu, Hsin-Hao Huang, Yu-Chen Ma, Chia-Hsin Yen
  • FLEXIBLE CIRCUIT BOARD
    Publication number: 20220225496
    Abstract: A flexible circuit board includes a flexible substrate, a chip and a patterned circuit layer. A surface of the flexible substrate is separated into a working area and a nonworking area according to a cutting line. The chip is disposed on the working area. The patterned circuit layer is disposed on the surface and includes signal transmission wires and bypass wires, the bypass wires are not electrically connected to the chip. Each of the bypass wires includes a bypass transmission portion located on the working area and an anti-peeling portion located on the nonworking area. A blank area exists between the anti-peeling area and the bypass transmission portion, and the cutting line passes through the blank area. A distance between 100 um and 400 um exists from the anti-peeling portion to the cutting line.
    Type: Application
    Filed: October 19, 2021
    Publication date: July 14, 2022
    Inventors: Gwo-Shyan Sheu, Hsin-Hao Huang, Yu-Chen Ma, Chia-Hsin Yen
  • Method of attaching heat sinks to a circuit tape
    Patent number: 11350518
    Abstract: In a method of heat sink attachment, a heat-sink tape includes a plurality of heat sinks and a flexible carrier, and a holder is provided to allow the heat sinks on the moving heat-sink tape to peel from the flexible carrier and attach to a heat-sink mounting area of a moving circuit tape automatically and successively.
    Type: Grant
    Filed: July 13, 2020
    Date of Patent: May 31, 2022
    Assignee: Chipbond Technology Corporation
    Inventors: Chia-Sung Lin, Huan-Kai Chou, Chia-Hsin Yen, Wen-Fu Chou
  • METHOD AND DEVICE OF HEAT SINK ATTACHMENT TO A CIRCUIT TAPE
    Publication number: 20210227679
    Abstract: In a method of heat sink attachment, a heat-sink tape includes a plurality of heat sinks and a flexible carrier, and a holder is provided to allow the heat sinks on the moving heat-sink tape to peel from the flexible carrier and attach to a heat-sink mounting area of a moving circuit tape automatically and successively.
    Type: Application
    Filed: July 13, 2020
    Publication date: July 22, 2021
    Inventors: Chia-Sung Lin, Huan-Kai Chou, Chia-Hsin Yen, Wen-Fu Chou