Abstract: A magnetic component includes a core, a first winding, a second winding and at least one magnetic filler. The core includes an inner leg. The first winding is disposed in the core and wound around the inner leg. The second winding is disposed in the core and surrounds the first winding. At least one filling region and at least one non-filling region are formed between the first winding and the second winding. The at least one magnetic filler is filled in at least a part of the at least one filling region.

Abstract: A plurality of radiation-sensing doped regions are formed in a substrate. A trench is formed in the substrate between the radiation-sensing doped regions. A SiOCN layer is filled in the trench by reacting Bis(tertiary-butylamino)silane (BTBAS) and a gas mixture comprising N2O, N2 and O2 through a plasma enhanced atomic layer deposition (PEALD) method, to form an isolation structure between the radiation-sensing doped regions.

Abstract: A plurality of radiation-sensing doped regions are formed in a substrate. A trench is formed in the substrate between the radiation-sensing doped regions. A SiOCN layer is filled in the trench by reacting Bis(tertiary-butylamino)silane (BTBAS) and a gas mixture comprising N2O, N2 and O2 through a plasma enhanced atomic layer deposition (PEALD) method, to form an isolation structure between the radiation-sensing doped regions.

Abstract: Semiconductor image sensor devices and manufacturing method of the same are disclosed. The semiconductor image sensor device includes a substrate, a first pixel and a second pixel, and an isolation structure. The first pixel and second pixel are disposed in the substrate, wherein the first and second pixels are neighboring pixels. The isolation structure is disposed in the substrate and between the first and second pixels, wherein the isolation structure includes a dielectric layer, and the dielectric layer includes silicon oxycarbonitride (SiOCN).

Abstract: A method and an apparatus for forming a cleaning a chemical vapor deposition (CVD) chamber are provided. The method includes providing a chemical vapor deposition (CVD) chamber. The method further includes introducing a remote plasma source into the CVD chamber. The method also includes performing a plasma cleaning process to the CVD chamber by applying a radio-frequency (RF) power in the CVD chamber.

Abstract: A method for improving EBG (electromagnetic bandgap) structures is provided. First, a multi-layer board having at least one EBG unit is provided. Then, a maximum input impedance of the EBG unit under a predetermined frequency band is measured, in which a frequency corresponding to the maximum input impedance is a resonance frequency, and a capacitance is determined based on the resonance frequency. Besides, a minimum input impedance of the EBG unit is measured, and a logarithmic value corresponding to the maximum input impedance and a logarithmic value corresponding to the minimum input impedance are obtained so as to determine a resistance. Finally, an electronic device having the capacitance and the resistance is coupled to the EBG unit in parallel.

Abstract: A heat dissipation device is used for dissipating heat generated from a plurality of memory modules inserted on a motherboard. The memory modules are parallel to each other. Two hooks are disposed at two ends of the slot of each memory connector, respectively, to clamp the memory module corresponding to the slot when the memory module is inserted in the slot. The heat dissipation device includes two fixing frames, a connection frame, and two fans. The two fixing frames are disposed at two opposite ends of the memory connectors and fastened with the hooks at two ends of each slot, respectively. Additionally, the connection frame is connected between the two fixing frames. The two fans are disposed on the two fixing frames, respectively. An air inlet of one of the two fans faces an air outlet of the other one.

Abstract: A heat-dissipating mechanism includes a first heat-dissipating device, a first positioning device, a second heat-dissipating device and a second positioning device. The first heat-dissipating device is contacted with a memory module. The first positioning device is disposed on the first heat-dissipating device and includes a protrusion. The second heat-dissipating device is connected with the first heat-dissipating device. The second positioning device has a positioning rail formed in the second heat-dissipating device and corresponding to the protrusion. The second heat-dissipating device is connected with the first heat-dissipating device when the protrusion of the first positioning device is embedded into the positioning rail second positioning device.

Abstract: A heat-dissipating mechanism includes a first heat-dissipating device, a first positioning device, a second heat-dissipating device and a second positioning device. The first heat-dissipating device is contacted with a memory module. The first positioning device is disposed on the first heat-dissipating device and includes a protrusion. The second heat-dissipating device is connected with the first heat-dissipating device. The second positioning device has a positioning rail formed in the second heat-dissipating device and corresponding to the protrusion. The second heat-dissipating device is connected with the first heat-dissipating device when the protrusion of the first positioning device is embedded into the positioning rail second positioning device.

Abstract: A signal transmission structure including a first signal pad, a first reference plane surrounding the first signal pad, a second signal pad, a second reference plane surrounding the second signal pad, an electric conductive element, and a conductive wall is provided. The second reference plane is parallel to the first reference plane, and the electrical conductive element is connected between the first signal pad and the second signal pad to transmit a signal. The conductive wall is connected between the first reference plane and the second reference plane and surrounding the electrical conductive element. Furthermore, a package structure applying to the signal transmission structure and a bonding method thereof are provided.

Abstract: A heat-dissipating mechanism includes a first heat-dissipating device, a first positioning device, a second heat-dissipating device and a second positioning device. The first heat-dissipating device is contacted with a memory module. The first positioning device is disposed on the first heat-dissipating device and includes a protrusion. The second heat-dissipating device is connected with the first heat-dissipating device. The second positioning device has a positioning rail formed in the second heat-dissipating device and corresponding to the protrusion. The second heat-dissipating device is connected with the first heat-dissipating device when the protrusion of the first positioning device is embedded into the positioning rail second positioning device.

Abstract: A heat dissipation device is used for dissipating heat generated from a plurality of memory modules inserted on a motherboard. The memory modules are parallel to each other. Two hooks are disposed at two ends of the slot of each memory connector, respectively, to clamp the memory module corresponding to the slot when the memory module is inserted in the slot. The heat dissipation device includes two fixing frames, a connection frame, and two fans. The two fixing frames are disposed at two opposite ends of the memory connectors and fastened with the hooks at two ends of each slot, respectively. Additionally, the connection frame is connected between the two fixing frames. The two fans are disposed on the two fixing frames, respectively. An air inlet of one of the two fans faces an air outlet of the other one.

Abstract: A delay line for a printed circuit board (PCB) is disclosed. The delay line includes a first straight line, a second straight line and a third straight line. The second and third straight lines are respectively disposed at two sides of the first straight line. The first, second and third straight lines are parallel to each other and form a delay path. The current direction of the second straight line is opposite to that of the third straight line.

Abstract: A heat-dissipating mechanism includes a first heat-dissipating device, a first positioning device, a second heat-dissipating device and a second positioning device. The first heat-dissipating device is contacted with a memory module. The first positioning device is disposed on the first heat-dissipating device and includes a protrusion. The second heat-dissipating device is connected with the first heat-dissipating device. The second positioning device has a positioning rail formed in the second heat-dissipating device and corresponding to the protrusion. The second heat-dissipating device is connected with the first heat-dissipating device when the protrusion of the first positioning device is embedded into the positioning rail second positioning device.

Abstract: A method for improving EBG (electromagnetic bandgap) structures is provided. First, a multi-layer board having at least one EBG unit is provided. Then, a maximum input impedance of the EBG unit under a predetermined frequency band is measured, in which a frequency corresponding to the maximum input impedance is a resonance frequency, and a capacitance is determined based on the resonance frequency. Besides, a minimum input impedance of the EBG unit is measured, and a logarithmic value corresponding to the maximum input impedance and a logarithmic value corresponding to the minimum input impedance are obtained so as to determine a resistance. Finally, an electronic device having the capacitance and the resistance is coupled to the EBG unit in parallel.

Abstract: A circuit substrate including a first wiring layer, a second wiring layer, a first reference plane, a second reference plane, a first conductive via, and a plurality of second conductive vias is provided. The first wiring layer and the second wiring layer have a first signal trace and a second signal trace respectively. The first conductive via is disposed between the first wiring layer and the second wiring layer for connecting the first signal trace with the second signal trace. The second conductive vias are disposed between the first reference plane and the second reference plane for connecting the first reference plane with the second reference plane, wherein the first conductive via is surrounded by the second conductive vias.

Abstract: A signal transmission structure including a first signal pad, a first reference plane surrounding the first signal pad, a second signal pad, a second reference plane surrounding the second signal pad, an electric conductive element, and a conductive wall is provided. The second reference plane is parallel to the first reference plane, and the electrical conductive element is connected between the first signal pad and the second signal pad to transmit a signal. The conductive wall is connected between the first reference plane and the second reference plane and surrounding the electrical conductive element. Furthermore, a package structure applying to the signal transmission structure and a bonding method thereof are provided.