Abstract: A method includes following steps. First transistors are formed over a substrate. An interconnect structure is formed over the plurality of first transistors. A dielectric layer is formed over the interconnect structure. 2D semiconductor seeds are formed over the dielectric layer. The 2D semiconductor seeds are annealed. An epitaxy process is performed to laterally grow a plurality of 2D semiconductor films respectively from the plurality of 2D semiconductor seeds. Second transistors are formed on the plurality of 2D semiconductor films.

Abstract: An IC structure comprises a first transistor formed on a substrate, a first interconnect structure over the first transistor, a dielectric layer over the first interconnect structure, a plurality of 2D semiconductor islands on the dielectric layer, and a plurality of second transistors formed on the plurality of 2D semiconductor islands.

Abstract: A device comprises a plurality of 2D semiconductor nanostructures, a gate structure, a source region, and a drain region. The plurality of 2D semiconductor nanostructures extend in a first direction above a substrate and arranged in a second direction substantially perpendicular to the first direction. The gate structure surrounds each of the plurality of 2D semiconductor nanostructures. The source region and the drain region are respectively on opposite sides of the gate structure.

Abstract: An IC structure comprises a first transistor formed on a substrate, a first interconnect structure over the first transistor, a dielectric layer over the first interconnect structure, a plurality of 2D semiconductor islands on the dielectric layer, and a plurality of second transistors formed on the plurality of 2D semiconductor islands.

Abstract: A method for making a molded composite of a prepreg sheet and a molding material includes steps of: a) providing a mold assembly, b) disposing the molding material, c) placing the prepreg sheet, d) combining a female mold and a male mold of the mold assembly, and e) operating an actuating member to press the molding material against the prepreg sheet.

Abstract: A bicycle rim examination device includes a body having a base and two upright side frames extend from the base. Each of the two side frames has a first cylinder, a second cylinder and a third cylinder connected to the top thereof. Each of the second and third cylinders is connected with a roller. A power supply device is located on one end of the body and has transmission shaft which has a roller and is driven by a motor. The transmission shaft is supported by two slides which are movable along two guide frames. A first detector with a first probe and a second detector with a second probe are connected to the body. The bicycle rim examination device examines the tension of the spokes and the roundness of the rim.

Abstract: A bicycle rim examination device includes a body having a base and two upright side frames extend from the base. Each of the two side frames has a first cylinder, a second cylinder and a third cylinder connected to the top thereof. Each of the second and third cylinders is connected with a roller. A power supply device is located on one end of the body and has transmission shaft which has a roller and is driven by a motor. The transmission shaft is supported by two slides which are movable along two guide frames. A first detector with a first probe and a second detector with a second probe are connected to the body. The bicycle rim examination device examines the tension of the spokes and the roundness of the rim.

Abstract: An ultra-wideband low-noise amplifier circuit with low power consumption includes a cascode amplifier circuit module and an output combining circuit module. The cascode amplifier circuit module receives an input signal, and outputs a first output signal and a second output signal. The output combining circuit module receives the first output signal and the second output signal, and applies respective phase shifts to the first output signal and the second output signal for reducing a phase difference between the first output signal and the second output signal, so as to obtain a combined output signal.

Abstract: An ultra-wideband low-noise amplifier circuit with low power consumption includes a cascode amplifier circuit module and an output combining circuit module. The cascode amplifier circuit module receives an input signal, and outputs a first output signal and a second output signal. The output combining circuit module receives the first output signal and the second output signal, and applies respective phase shifts to the first output signal and the second output signal for reducing a phase difference between the first output signal and the second output signal, so as to obtain a combined output signal.