Abstract: A memory structure including a substrate, a first doped region, a second doped region, a first gate, a second gate, a first charge storage structure, and a second charge storage structure is provided. The first gate is located on the first doped region. The second gate is located on the second doped region. The first charge storage structure is located between the first gate and the first doped region. The first charge storage structure includes a first tunneling dielectric layer, a first dielectric layer, and a first charge storage layer. The second charge storage structure is located between the second gate and the second doped region. The second charge storage structure includes a second tunneling dielectric layer, a second dielectric layer, and a second charge storage layer. The thickness of the second tunneling dielectric layer is greater than the thickness of the first tunneling dielectric layer.

Abstract: In some implementations, one or more semiconductor processing tools may form a metal cap on a metal gate. The one or more semiconductor processing tools may form one or more dielectric layers on the metal cap. The one or more semiconductor processing tools may form a recess to the metal cap within the one or more dielectric layers. The one or more semiconductor processing tools may perform a bottom-up deposition of metal material on the metal cap to form a metal plug within the recess and directly on the metal cap.

Abstract: A display device including a substrate and a plurality of pixels is provided. The pixels are disposed on the substrate. At least one of the pixels includes a thin film transistor, a bonding pad, a light emitting unit, and a metal layer. The bonding pad is electrically connected to the thin film transistor. The light emitting unit is disposed on the bonding pad. The metal layer is insulated from the bonding pad and surrounds the bonding pad in a top view direction of the display device.

Abstract: A display device including a substrate and a plurality of pixels is provided. The pixels are disposed on the substrate. At least one of the pixels includes a thin film transistor, a bonding pad, a light emitting unit, and a metal layer. The bonding pad is electrically connected to the thin film transistor. The light emitting unit is disposed on the bonding pad. The metal layer is insulated from the bonding pad and surrounds the bonding pad in a top view direction of the display device.

Abstract: The disclosure relates to a display device, including a first substrate, a light emitting component, an insulating layer, and a conductive element. The first substrate has a driving component and a common line. The light emitting component is disposed on the first substrate and has a first electrode and a second electrode. The first electrode is electrically connected to the driving component. The insulating layer is disposed to the first substrate and has a first opening and a second opening. The first opening exposes the second electrode of the light emitting component. The second opening exposes the common line. The common line is electrically connected to the second electrode through the conductive element.

Abstract: A display device is provided. The display device includes a substrate, and a light-emitting unit disposed on the substrate. The light-emitting unit includes a first conductive layer overlapping a second conductive layer, a first semiconductor layer disposed between the first conductive layer and the second conductive layer, a second semiconductor layer disposed between the first semiconductor layer and the first conductive layer, a quantum well structure disposed between the first semiconductor layer and the second semiconductor layer, and a via hole penetrated through the first semiconductor layer and the quantum well structure. The second conductive layer is electrically connected with the second semiconductor layer through a conductive material disposed in the via hole.

Abstract: The disclosure relates to a display device, including a first substrate, a light emitting component, an insulating layer, and a conductive element. The first substrate has a driving component and a common line. The light emitting component is disposed on the first substrate and has a first electrode and a second electrode. The first electrode is electrically connected to the driving component. The insulating layer is disposed to the first substrate and has a first opening and a second opening. The first opening exposes the second electrode of the light emitting component. The second opening exposes the common line. The common line is electrically connected to the second electrode through the conductive element.

Abstract: A method for manufacturing an electronic device is provided. The method includes testing a plurality of first light-emitting units on a first substrate to select one of the plurality of first light-emitting unit that is to be replaced; removing the one of the plurality of first light-emitting units from the first substrate so that the first substrate has a vacant position; transferring a second light-emitting unit to a second substrate; and transferring at least part of the plurality of first light-emitting units that are not replaced from the first substrate to the second substrate. The vacant position on the first substrate corresponds to the second light-emitting unit. An electronic device manufactured by the method is also provided.

Abstract: A display device is provided. The display device includes a substrate, and a light-emitting unit disposed on the substrate. The light-emitting unit includes a first conductive layer overlapping a second conductive layer, a first semiconductor layer disposed between the first conductive layer and the second conductive layer, a second semiconductor layer disposed between the first semiconductor layer and the first conductive layer, a quantum well structure disposed between the first semiconductor layer and the second semiconductor layer, and a via hole penetrated through the first semiconductor layer and the quantum well structure. The second conductive layer is electrically connected with the second semiconductor layer through a conductive material disposed in the via hole.

Abstract: The disclosure relates to a display device, including a first substrate, a light emitting component, an insulating layer, and a conductive element. The first substrate has a driving component and a common line. The light emitting component is disposed on the first substrate and has a first electrode and a second electrode. The first electrode is electrically connected to the driving component. The insulating layer is disposed to the first substrate and has a first opening and a second opening. The first opening exposes the second electrode of the light emitting component. The second opening exposes the common line. The common line is electrically connected to the second electrode through the conductive element.