Patents by Inventor Chia-Hsiung Hsu

Chia-Hsiung Hsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Novel substrate design for semiconductor device
    Publication number: 20080246147
    Abstract: A novel design and method of fabricating a semiconductor device. In a preferred embodiment, the present invention is a flip chip package including a BT substrate. On the side of the substrate facing the die, thin traces are formed of an enhanced conductive material. Conductive bumps such as eutectic solder balls are then mounted on the traces, and the die mounted to the bumps. The die then packaged and mounted to a printed circuit board using, for example, a ball grid array.
    Type: Application
    Filed: April 9, 2007
    Publication date: October 9, 2008
    Inventors: Chao-Yuan Su, Chia Hsiung Hsu, Steven Hsu
  • Semiconductor bond pad structures and methods of manufacturing thereof
    Patent number: 7157734
    Abstract: Described is a semiconductor device having improved semiconductor bond pad reliability and methods of manufacturing thereof. The semiconductor device includes a layer formed over an integrated circuit on a semiconductor substrate. The first layer includes a conductive portion and an insulating portion. A second layer is then formed over the first layer and includes a conductive portion corresponding to the first layer's conductive portion and an insulating portion corresponding to the first layer's insulating portion. A bond pad is then formed over the first and second layers such that the bond pad is substantially situated above the conductive portions and the insulating portions of the first and second layers. A bonding ball is then formed on the bond pad substantially above the conduction portion of the first and second layers.
    Type: Grant
    Filed: May 27, 2005
    Date of Patent: January 2, 2007
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Pei-Haw Tsao, Chender Huang, Shang-Yu Hou, Chao-Yuan Su, Chia-Hsiung Hsu
  • SEMICONDUCTOR BOND PAD STRUCTURES AND METHODS OF MANUFACTURING THEREOF
    Publication number: 20060267008
    Abstract: Described is a semiconductor device having improved semiconductor bond pad reliability and methods of manufacturing thereof. The semiconductor device includes a layer formed over an integrated circuit on a semiconductor substrate. The first layer includes a conductive portion and an insulating portion. A second layer is then formed over the first layer and includes a conductive portion corresponding to the first layer's conductive portion and an insulating portion corresponding to the first layer's insulating portion. A bond pad is then formed over the first and second layers such that the bond pad is substantially situated above the conductive portions and the insulating portions of the first and second layers. A bonding ball is then formed on the bond pad substantially above the conduction portion of the first and second layers.
    Type: Application
    Filed: May 27, 2005
    Publication date: November 30, 2006
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Pei-Haw Tsao, Chender Huang, Shang-Yun Hou, Chao-Yuan Su, Chia-Hsiung Hsu