Patents by Inventor Chia-Hsuan Chang
Chia-Hsuan Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240153887Abstract: A semiconductor package structure includes a base having a first surface and a second surface opposite thereto, wherein the base comprises a wiring structure, a first electronic component disposed over the first surface of the base and electrically coupled to the wiring structure, a second electronic component disposed over the first surface of the base and electrically coupled to the wiring structure, wherein the first electronic component and the second electronic component are separated by a molding material, a first hole and a second hole formed on the second surface of the base, and a frame disposed over the first surface of the base, wherein the frame surrounds the first electronic component and the second electronic component.Type: ApplicationFiled: January 4, 2024Publication date: May 9, 2024Inventors: Tzu-Hung LIN, Chia-Cheng CHANG, I-Hsuan PENG, Nai-Wei LIU
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Publication number: 20240145389Abstract: A semiconductor chip includes a first intellectual property block. There are a second intellectual property block and a third intellectual property block around the first intellectual property block. There is a multiple metal layer stack over the first intellectual property block, the second intellectual property block, and the third intellectual property block. An interconnect structure is situated in the upper portion of the multiple metal layer stack. The interconnect structure is configured for connecting the first intellectual property block and the second intellectual property block. In addition, at least a part of the interconnect structure extends across and over the third intellectual property block.Type: ApplicationFiled: July 28, 2023Publication date: May 2, 2024Inventors: Li-Chiu WENG, Yew Teck TIEO, Ming-Hsuan WANG, Chia-Cheng CHEN, Wei-Yi CHANG, Jen-Hang YANG, Chien-Hsiung HSU
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Publication number: 20240137061Abstract: A radio frequency receiving circuit includes a first amplification circuit, an oscillation circuit, a frequency mixing and amplification circuit and a dividing circuit. The first amplification circuit is configured to amplify an input signal so as to generate an amplified input signal. The oscillation circuit is configured to provide a local oscillation signal. The frequency mixing and amplification circuit is configured to mix and amplify the amplified input signal according to the local oscillation signal. The dividing circuit is configured to form a dividing loop at a preset frequency for the amplified input signal according to the local oscillation signal when the dividing circuit is driven. A chip including the radio frequency receiving circuit and a main circuit is also provided. The main circuit is configured to drive the dividing circuit when the second input signal is determined to include a signal of the preset frequency.Type: ApplicationFiled: October 17, 2023Publication date: April 25, 2024Applicant: REALTEK SEMICONDUCTOR CORP.Inventors: Ruo-Hsuan GAO, Chia-Yi LEE, Chia-Jun CHANG
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Publication number: 20240121685Abstract: A method of reducing gray energy consumption and achieving optimal gray energy saving for carbon neutralization is proposed. In a cellular network, each cell or BS (group of cells) has renewable (green) and non-renewable (gray, on-grid power) energy sources. The renewable (green) energy is highly variable and unpredictable, while non-renewable (gray, on-grid power) is stable but is not renewable and thus has more carbon impact. Each cell or BS (group of cells) services is associated UEs when it is on. In one novel aspect, a cell or BS (group of cells) that consumes more non-renewable energy can give some or all of its served UEs to another cell or BS (group of cells) that consumes less non-renewable energy.Type: ApplicationFiled: September 21, 2023Publication date: April 11, 2024Inventors: Chien-Sheng Yang, I-Kang Fu, YUAN-CHIEH LIN, Chia-Lin Lai, Yu-Hsin Lin, Yun-Hsuan Chang
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Patent number: 11948895Abstract: A semiconductor package structure includes a substrate having a wiring structure. A first semiconductor die is disposed over the substrate and is electrically coupled to the wiring structure. A second semiconductor die is disposed over the substrate and is electrically coupled to the wiring structure, wherein the first semiconductor die and the second semiconductor die are arranged side-by-side. Holes are formed on a surface of the substrate, wherein the holes are located within a projection of the first semiconductor die or the second semiconductor die on the substrate. Further, a molding material surrounds the first semiconductor die and the second semiconductor die, and surfaces of the first semiconductor die and the second semiconductor die facing away from the substrate are exposed by the molding material.Type: GrantFiled: July 4, 2022Date of Patent: April 2, 2024Assignee: MEDIATEK INC.Inventors: Tzu-Hung Lin, Chia-Cheng Chang, I-Hsuan Peng, Nai-Wei Liu
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Publication number: 20240086633Abstract: A method for generating and outputting a message is implemented using an electronic device the stores a computer program product and a text database. The text database includes a main message template, a template text that includes a placeholder, and a word group that includes a plurality of preset words for replacing the placeholder. The method includes: in response to receipt of a command for execution of the computer program product, displaying an editing interface including the main message template; in response to receipt of user operation of a selection of the main message template, displaying the template text; in response to receipt of user operation of a selection of one of the preset words via the user interface, generating an edited text by replacing the placeholder with the one of the preset words in the template text; and outputting the edited text as a message.Type: ApplicationFiled: April 25, 2023Publication date: March 14, 2024Inventors: Yi-Ru CHIU, Ting-Yi LI, Hong-Xun WANG, Jin-Lin CHEN, Chih-Hsuan YEH, Chia-Chi YIN, Wei-Ting LI, Po-Lun CHANG
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Publication number: 20240088307Abstract: A semiconductor package is provided. The semiconductor package includes a heat dissipation substrate including a first conductive through-via embedded therein; a sensor die disposed on the heat dissipation substrate; an insulating encapsulant laterally encapsulating the sensor die; a second conductive through-via penetrating through the insulating encapsulant; and a first redistribution structure and a second redistribution structure disposed on opposite sides of the heat dissipation substrate. The second conductive through-via is in contact with the first conductive through-via. The sensor die is located between the second redistribution structure and the heat dissipation substrate. The second redistribution structure has a window allowing a sensing region of the sensor die receiving light. The first redistribution structure is electrically connected to the sensor die through the first conductive through-via, the second conductive through-via and the second redistribution structure.Type: ApplicationFiled: November 20, 2023Publication date: March 14, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chih-Hsuan Tai, Hao-Yi Tsai, Yu-Chih Huang, Chih-Hao Chang, Chia-Hung Liu, Ban-Li Wu, Ying-Cheng Tseng, Po-Chun Lin
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Patent number: 11724131Abstract: A wearable ultrasonic therapeutic device controlled by a mobile electronic device is provided, which includes a mobile device, at least one ultrasonic probe module and a strap. The mobile device has a mobile device control interface for setting ultrasonic parameters and displaying an echo wave through a specific software interface of the mobile device. The ultrasonic probe module includes at least one ultrasonic transducer and a control circuit corresponding thereto. The ultrasonic transducer generates and receives an ultrasonic wave. The control circuit has the functions of generating/receiving signals, phase regulation, power amplification and matching. One end of the ultrasonic probe module is electrically connected to the mobile device and the other end of the ultrasonic probe module is connected to the strap.Type: GrantFiled: November 24, 2021Date of Patent: August 15, 2023Assignees: NATIONAL HEALTH RESEARCH INSTITUTES, NATIONAL YANG MING CHIAO TUNG UNIVERSITYInventors: Gin-Shin Chen, Chia-Hsuan Chang, Jung-Chih Chen
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Publication number: 20230059663Abstract: A wearable ultrasonic therapeutic device controlled by a mobile electronic device is provided, which includes a mobile device, at least one ultrasonic probe module and a strap. The mobile device has a mobile device control interface for setting ultrasonic parameters and displaying an echo wave through a specific software interface of the mobile device. The ultrasonic probe module includes at least one ultrasonic transducer and a control circuit corresponding thereto. The ultrasonic transducer generates and receives an ultrasonic wave. The control circuit has the functions of generating/receiving signals, phase regulation, power amplification and matching. One end of the ultrasonic probe module is electrically connected to the mobile device and the other end of the ultrasonic probe module is connected to the strap.Type: ApplicationFiled: November 24, 2021Publication date: February 23, 2023Inventors: GIN-SHIN CHEN, CHIA-HSUAN CHANG, JUNG-CHIH CHEN
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Patent number: 11020594Abstract: The invention relates to an electrochemical dephosphorylation technique for treating Alzheimer's disease and a use thereof. It comprises a gold electrode provided with a negative potential of ?0.2 V to ?0.6 V on a surface thereof.Type: GrantFiled: June 14, 2019Date of Patent: June 1, 2021Assignee: National Chiao Tung UniversityInventors: Jung-Chih Chen, I-Chiu Li, Kun-Che Li, Ching-Cheng Chuang, Mei-Lan Ko, Hsin-Yu Chen, Chia-Hsuan Chang, Hsin-Yi Tsai, Chien-Chih Hsu
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Publication number: 20200391033Abstract: The invention relates to an electrochemical dephosphorylation technique for treating Alzheimer's disease and a use thereof. It comprises a gold electrode provided with a negative potential of ?0.2 V to ?0.6 V on a surface thereof.Type: ApplicationFiled: June 14, 2019Publication date: December 17, 2020Inventors: JUNG-CHIH CHEN, I-CHIU LI, KUN-CHE LI, CHING-CHENG CHUANG, MEI-LAN KO, HSIN-YU CHEN, CHIA-HSUAN CHANG, HSIN-YI TSAI, CHIEN-CHIH HSU
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Patent number: 8142159Abstract: A fan includes a plurality of blades and a motor. The motor includes a hub and a shaft having an end connected to the hub, a bushing, a bearing, and an oil-sealing structure. The blades are connected with and surrounding around the hub. The bushing is for supporting the other end of the shaft, and the bearing is disposed in the bushing and used to telescope the shaft. The shaft passes through the oil-sealing structure. The oil-sealing structure is telescoped to the shaft to fit tightly and the oil-sealing structure includes a main body and a barricade inwardly extending toward the shaft so that the oil-sealing structure is fixedly connected with the bushing.Type: GrantFiled: August 14, 2008Date of Patent: March 27, 2012Assignee: Delta Electronics, Inc.Inventors: Chia-Hsuan Chang, Meng-Yu Chen, Yung-Hao Chiu, Te-Tsai Chuang, Chung-Yuan Tsang, Wei-Pang Huang
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Publication number: 20090045588Abstract: A fan includes a plurality of blades and a motor. The motor includes a hub and a shaft having an end connected to the hub, a bushing, a bearing, and an oil-sealing structure. The blades are connected with and surrounding around the hub. The bushing is for supporting the other end of the shaft, and the bearing is disposed in the bushing and used to telescope the shaft. The shaft passes through the oil-sealing structure. The oil-sealing structure oil-sealing structure is telescoped to the shaft to fit tightly and the oil-sealing structure includes a main body and a barricade inwardly extending toward the shaft so that the oil-sealing structure is fixedly connected with the bushing.Type: ApplicationFiled: August 14, 2008Publication date: February 19, 2009Inventors: Chia-Hsuan CHANG, Meng-Yu CHEN, Yung-Hao CHIU, Te-Tsai CHUANG, Chung-Yuan TSANG, Wei-Pang HUANG
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Publication number: 20060292307Abstract: A coating method for a clear polishing paint to prevent adhesion marks, includes: providing a plastic substrate coated with a base coat, and a clear polishing paint mixture solution, the clear polishing paint mixture solution contains a hardener part and a PU clear paint; coating the clear polishing paint mixture solution on a surface of the substrate, and heating the substrate coated with the clear polishing paint mixture solution at 60° C.˜75° C. for 0.5˜2 hours; and keeping the substrate coated with the clear polishing paint mixture solution stationary.Type: ApplicationFiled: November 9, 2005Publication date: December 28, 2006Applicant: Hannspree, Inc.Inventors: Ying-Tang Hsu, Kevin Chean, Chun-Chung Chiou, Chia-Hsuan Chang, Stephen Tsai, Yao-To Tseng, Yu-Cheng Teng, Jay Zhong