Abstract: A fan control method, a processing device, and a fan control system are provided. The fan control method includes: obtaining at least one temperature-fan speed table and at least one current-fan speed table corresponding to each of at least one fan device; obtaining an estimated temperature value corresponding to a predetermined area according to a sensing result of at least one temperature sensor disposed in the predetermined area; obtaining rotational speed information of a target rotational speed of the at least one fan device according to the estimated temperature value and the at least one temperature-fan speed table; and providing the rotational speed information to a controller configured to control a fan speed in the at least one fan device.

Abstract: A semiconductor package is provided. The semiconductor package includes a heat dissipation substrate including a first conductive through-via embedded therein; a sensor die disposed on the heat dissipation substrate; an insulating encapsulant laterally encapsulating the sensor die; a second conductive through-via penetrating through the insulating encapsulant; and a first redistribution structure and a second redistribution structure disposed on opposite sides of the heat dissipation substrate. The second conductive through-via is in contact with the first conductive through-via. The sensor die is located between the second redistribution structure and the heat dissipation substrate. The second redistribution structure has a window allowing a sensing region of the sensor die receiving light. The first redistribution structure is electrically connected to the sensor die through the first conductive through-via, the second conductive through-via and the second redistribution structure.

Abstract: A package structure includes a thermal dissipation structure, a first encapsulant, a die, a through integrated fan-out via (TIV), a second encapsulant, and a redistribution layer (RDL) structure. The thermal dissipation structure includes a substrate and a first conductive pad disposed over the substrate. The first encapsulant laterally encapsulates the thermal dissipation structure. The die is disposed on the thermal dissipation structure. The TIV lands on the first conductive pad of the thermal dissipation structure and is laterally aside the die. The second encapsulant laterally encapsulates the die and the TIV. The RDL structure is disposed on the die and the second encapsulant.

Abstract: A method and nanoparticle construct provides shielded delivery of a drug or agent to a tissue or treatment site, and release of the agent may be triggered externally. Carbon nanotubes (CNTs) are filled with the therapeutic agent in a temperature sensitive gel, and release of the agent is effected by inductive heating, e.g. applying an alternating or pulsed magnetic field, or electrical field. The CNTs may be functionalized for solubility, drug absorption, responsivity to pH, enzyme catalysis, and/or ambient biological environment. Encapsulation within the nanostructure protects the intracorporal or surrounding cellular environment from the potentially toxic cargo and prevents the degradation of the cargo during delivery. By releasing at or in the target tissue extremely small amounts of the agent may achieve an effective level of treatment, as measured by cell apoptosis, tumor shrinkage or other treatment effect while safely avoiding systemic damage.

Abstract: A VoIP terminal, which supports to make a phone call through both PSTN and Internet is disclosed. A local subscriber may choose to have a conversation through PSTN or Internet on his own. Besides, by reference to a switch such as a relay, the VoIP terminal is able to establish a PSTN connection under some special cases, such as the terminal power off or Internet shutdown.

Abstract: A VoIP terminal, which supports to make a phone call through both PSTN and Internet is disclosed. A local subscriber may choose to have a conversation through PSTN or Internet on his own. Besides, by reference to a switch such as a relay, the VoIP terminal is able to establish a PSTN connection under some special cases, such as the terminal power off or Internet shutdown.