Patents by Inventor CHIA-HSUN CHANG

CHIA-HSUN CHANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11215399
    Abstract: A high temperature reaction system includes a reaction tube including a heating space, a discharge unit, a cooling unit, a feeding unit and an observation and analysis unit. The discharge unit is disposed opposite to an inlet of the heating space and has a discharge space communicating the heating space, and an observation window and a discharge opening which communicate the discharge space. The cooling unit has a cooling space communicating the discharge opening. The feeding unit includes a carrier holding a sample, and a moving module for moving the carrier and the sample. The observation and analysis unit includes an image capture module and an analysis module for analyzing gas released by the sample.
    Type: Grant
    Filed: December 6, 2019
    Date of Patent: January 4, 2022
    Assignee: National Cheng Kung University
    Inventors: In-Gann Chen, Shih-Hsien Liu, Ke-Miao Lu, Chia-Ming Yang, Hao-Hsun Chang
  • Patent number: 10868241
    Abstract: The present disclosure provides a method for fabricating a magnetic semiconductor device, including receiving a semiconductor wafer, disposing the semiconductor wafer under a first electromagnetic element, wherein the first electromagnetic element comprises a primary dimension and a secondary dimension from a top view perspective, the primary dimension being greater than the secondary dimension, and displacing the semiconductor wafer along a predetermined path along the secondary dimension of the first electromagnetic element.
    Type: Grant
    Filed: May 16, 2019
    Date of Patent: December 15, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Jim-Wei Wu, Li Tseng, Chia-Hsun Chang, Wen-Chih Wang, Keith Kuang-Kuo Koai
  • Publication number: 20200365797
    Abstract: The present disclosure provides a method for fabricating a magnetic semiconductor device, including receiving a semiconductor wafer, disposing the semiconductor wafer under a first electromagnetic element, wherein the first electromagnetic element comprises a primary dimension and a secondary dimension from a top view perspective, the primary dimension being greater than the secondary dimension, and displacing the semiconductor wafer along a predetermined path along the secondary dimension of the first electromagnetic element.
    Type: Application
    Filed: May 16, 2019
    Publication date: November 19, 2020
    Inventors: JIM-WEI WU, LI TSENG, CHIA-HSUN CHANG, WEN-CHIH WANG, KEITH KUANG-KUO KOAI
  • Publication number: 20200070301
    Abstract: The present disclosure provides a wet chemical heating system, including a first conduit for transporting wet chemical, a dispensing head connected to the first conduit, and a radiative heating element configured to heat the wet chemical in the first conduit and positioned at an upper stream of the dispensing head.
    Type: Application
    Filed: June 21, 2019
    Publication date: March 5, 2020
    Inventors: JI JAMES CUI, CHIA-HSUN CHANG, CHIH HUNG CHEN, LIANG-GUANG CHEN, TZU KAI LIN, CHYI SHYUAN CHERN, KEITH KUANG-KUO KOAI
  • Publication number: 20200055102
    Abstract: An apparatus includes a first support member coupled to a casing and constructed to move along a first axis through the casing and rotate around the first axis, a second support member coupled to the first support member and constructed to move along a second axis perpendicular to the first axis, and an arm pivotally coupled to the second support member and constructed to rotate around a third axis perpendicular to the first axis and the second axis. The apparatus also includes a cleaning head attached to the arm and constructed to rotate around a longitudinal axis of the arm.
    Type: Application
    Filed: June 14, 2019
    Publication date: February 20, 2020
    Inventors: SHIH-KUO LIU, CHIA-HSUN CHANG, KEITH KUANG-KUO KOAI, WAI HONG CHEAH, MING-CHUAN HUNG