Abstract: A method of determining the reliability of a high-voltage PMOS (HVPMOS) device includes determining a bulk resistance of the HVPMOS device, and evaluating the reliability of the HVPMOS device based on the bulk resistance.

Abstract: A method of manufacturing a package structure at least includes the following steps. An encapsulant laterally is formed to encapsulate the die and the plurality of through vias. A plurality of first connectors are formed to electrically connect to first surfaces of the plurality of through vias. A warpage control material is formed over the die, wherein the warpage control material is disposed to cover an entire surface of the die. A protection material is formed over the encapsulant and around the plurality of first connectors and the warpage control material. A coefficient of thermal expansion of the protection material is less than a coefficient of thermal expansion of the encapsulant.

Abstract: In an embodiment, a method includes: aligning a first package component with a second package component, the first package component having a first region and a second region, the first region including a first conductive connector, the second region including a second conductive connector; performing a first laser shot on a first portion of a top surface of the first package component, the first laser shot reflowing the first conductive connector of the first region, the first portion of the top surface of the first package component completely overlapping the first region; and after performing the first laser shot, performing a second laser shot on a second portion of the top surface of the first package component, the second laser shot reflowing the second conductive connector of the second region, the second portion of the top surface of the first package component completely overlapping the second region.

Abstract: A method includes depositing a first passivation layer over a conductive feature, wherein the first passivation layer has a first dielectric constant, forming a capacitor over the first passivation layer, and depositing a second passivation layer over the capacitor, wherein the second passivation layer has a second dielectric constant greater than the first dielectric constant. The method further includes forming a redistribution line over and electrically connecting to the capacitor, depositing a third passivation layer over the redistribution line, and forming an Under-Bump-Metallurgy (UBM) penetrating through the third passivation layer to electrically connect to the redistribution line.

Abstract: A package structure includes a die, an encapsulant laterally encapsulating the die, a warpage control material disposed over the die, and a protection material disposed over the encapsulant and around the warpage control material. A coefficient of thermal expansion of the protection material is less than a coefficient of thermal expansion of the encapsulant.

Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above- mentioned memory device is also provided.

Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above-mentioned memory device is also provided.

Abstract: A heat pump rental management system includes a detector, a transmission unit, a cloud server, a deduction unit and an electronic apparatus. The detector detects one of a temperature, a water flow rate, a pressure, and a power consumption of a heat pump apparatus. The cloud server receives the temperature, the water flow rate, the pressure, and the power consumption of the heat pump apparatus through the transmission unit, and the cloud server generates a rental fee according to a rate corresponding to account information.

Abstract: A heat pump rental management system includes a detector, a transmission unit, a cloud server, a deduction unit and an electronic apparatus. The detector detects one of a temperature, a water flow rate, a pressure, and a power consumption of a heat pump apparatus. The cloud server receives the temperature, the water flow rate, the pressure, and the power consumption of the heat pump apparatus through the transmission unit, and the cloud server generates a rental fee according to a rate corresponding to account information.

Abstract: A projection screen including a light absorbing film and a projection film is provided. The light absorbing film includes a transparent layer and a plurality of light absorbing microstructures, where the light absorbing microstructures are embedded in the transparent layer and arranged at intervals, each of the light absorbing microstructures is asymmetrical to a reference plane, the transparent layer has two surfaces opposite to each other, and the reference plane passes through a geometric center of each of the light absorbing microstructures and is parallel to each of the surfaces, and there is a space between each of the light absorbing microstructures and each of the surfaces. The projection film and the light absorbing film are stacked on each other. A light absorbing film is also provided, and the projections screen and the light absorbing film have good optical quality.

Abstract: A writable projection screen includes a substrate, a reflective layer and a writing layer. The reflective layer is disposed on the substrate, and the writing layer has a light receiving surface. The light receiving surface is adapted to receive a projection light beam. A roughness of the light receiving surface is between 5 ?m and 30 ?m. The substrate is disposed between the reflective layer and the writing layer, or the reflective layer is disposed between the substrate and the writing layer. The writable projection screen has good quality for displaying an image and can be used for being written by a variety of pens.

Abstract: A rear projection screen includes a prism film, a first diffusion layer, a second diffusion layer and a plurality of light absorbing structures sequentially arranged in a first direction. The prism film includes a first light transmissive substrate and a plurality of prism structures. The first light transmissive substrate has a first surface away from the first diffusion layer. The prism structures are disposed on the first surface. The prism structures receive the image beam and guide the image beam to be transmitted in the first direction. The first diffusion layer and the second diffusion layer have different refractive indices. The light absorbing structures have a gap therebetween. The second diffusion layer has a second surface facing the light absorbing structures. An area occupied by an orthographic projection of the light absorbing structures on the second surface is A1, a total area of the second surface is A2, and 1?(A2?A1)/A1?5.

Abstract: A projection screen including a light absorbing film and a projection film is provided. The light absorbing film includes a transparent layer and a plurality of light absorbing microstructures, where the light absorbing microstructures are embedded in the transparent layer and arranged at intervals, each of the light absorbing microstructures is asymmetrical to a reference plane, the transparent layer has two surfaces opposite to each other, and the reference plane passes through a geometric center of each of the light absorbing microstructures and is parallel to each of the surfaces, and there is a space between each of the light absorbing microstructures and each of the surfaces. The projection film and the light absorbing film are stacked on each other. A light absorbing film is also provided, and the projections screen and the light absorbing film have good optical quality.

Abstract: A housing includes two base each having at least one sidewall, a gap defined between the two bases and a non-conductive member positioned in the gap, the sidewall has a plurality of grooves, the non-conductive member is filled into the grooves to enhance bonding strength between the non-conductive member and the two bases. An electronic device having the housing and a method of making the housing are also provided.

Abstract: A hair curler with adjustable torque includes a working portion for connected with a hair roller, a driving device for driving the working portion to rotate, a circuit board for controlling the driving device, a control portion connected with the circuit board to make the driving device drive the working portion to rotate via the circuit board, a torque detecting device connected to the working portion to detect the torque of the working portion and to send it to the circuit board, a torque display device connected with the torque detecting device for displaying the value of torque, a torque setting portion connected with the circuit board for setting a predetermined torque. When the detected torque reaches the predetermined value, the circuit board makes the driving device drive the working portion to stop rotating so as to prevent hair from over-rotated.

Abstract: A housing includes two base each having at least one sidewall, a gap defined between the two bases and a non-conductive member positioned in the gap, the sidewall has a plurality of grooves, the non-conductive member is filled into the grooves to enhance bonding strength between the non-conductive member and the two bases. An electronic device having the housing and a method of making the housing are also provided.

Abstract: A reflector, a light source module, and a display device are disclosed. The reflector includes a substrate and slant reflecting surfaces disposed on the substrate and arranged from a first side to an opposite second side of the reflector. Each slant reflecting surface has an arc-shaped orthogonal projection on the substrate and is not parallel to the substrate. The light source module includes a light guide plate, a light emitting device, and the reflector, and the display device further includes a display panel. The light guide plate has a first surface, at least one opposite second surface, and a light incident surface connecting therebetween. The reflector is disposed at one side of the second surface. The slant reflecting surfaces are parallel to the second surface but not parallel to the first surface. The reflector offers improved luminous efficiency, and the light source module and the display device offer improved brightness.

Abstract: A sliding module includes a first section, a second section, a pivot plate, a hinge module and an assist lever. Two sides of the pivot plate are respectively rotatably connected to the first section and the hinge module. The hinge module is positioned on the second section. Two ends of the assist lever are respectively rotatably connected to the first section and the second section. The first section brings the pivot plate to rotate relative to the hinge module, and elevates the assist lever, the pivot plate and the assist lever bring the first section to move and rotate relative to the second section in a tilted orientation.

Abstract: A portable electronic device includes a main body, a first cover and a second cover. The main body includes a display formed on a surface thereof. The first cover is rotatably connected to one end of the main body and the second cover is rotatably connected to another end of the main body. When the first cover and the second cover are in a closed state, the first cover and the second cover are positioned at an opposite surface of the display. When the first cover and the second cover are unfolded like wings to be in an open state, the first cover and the second cover are positioned to extend from opposite sides of the display.

Abstract: A hinge assembly includes a shaft, a main body drive member, a follower, and a resilient member. The main body drive member, the follower, and the resilient member are mounted with the shaft in turn. One end of the main body drive member has a cam. One end of the follower has a cam engaging with the cam of the main body drive member. The resilient member causes the cam of the follower to resist the cam of the main body drive member due to the decompression of the resilient member, and when the follower is manually rotated relative to the main body drive member about an angle, the follower automatically rotates relative to the main body drive member due to the decompression of the resilient member.