Patents by Inventor Chia-Hua Liao

Chia-Hua Liao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11957051
    Abstract: An organic semiconductor mixture and an organic optoelectronic device containing the same are provided. A n-type organic semiconductor compound in the organic semiconductor mixture has a novel chemical structure so that the mixture has good thermal stability and property difference during batch production is also minimized. The organic semiconductor mixture is applied to organic optoelectronic devices such as organic photovoltaic devices for providing good energy conversion efficiency while in use.
    Type: Grant
    Filed: March 30, 2023
    Date of Patent: April 9, 2024
    Assignee: RAYNERGY TEK INCORPORATION
    Inventors: Chia-Hua Tsai, Chuang-Yi Liao, Wei-Long Li, Yu-Tang Hsiao
  • Patent number: 11950491
    Abstract: A semiconductor mixed material comprises an electron donor, a first electron acceptor and a second electron acceptor. The first electron donor is a conjugated polymer. The energy gap of the first electron acceptor is less than 1.4 eV. At least one of the molecular stackability, ?-?*stackability, and crystallinity of the second electron acceptor is smaller than the first electron acceptor. The electron donor system is configured to be a matrix to blend the first electron acceptor and the second electron acceptor. The present invention also provides an organic electronic device including the semiconductor mixed material.
    Type: Grant
    Filed: November 17, 2020
    Date of Patent: April 2, 2024
    Assignee: RAYNERGY TEK INCORPORATION
    Inventors: Yi-Ming Chang, Chuang-Yi Liao, Wei-Long Li, Yu-Tang Hsiao, Chun-Chieh Lee, Chia-Hua Li, Huei-Shuan Tan
  • Patent number: 11925101
    Abstract: An organic semiconducting compound and an organic photoelectric component containing the same are provided. The organic semiconducting compound has a novel chemical structure to make the organic semiconducting compound have good response to the infrared light. The organic semiconducting compound can be applied to the organic photoelectric components such as organic photodetector (OPD), organic photovoltaic (OPV) cell, and organic field-effect transistor (OFET). Thus, the organic photoelectric components have better light absorption range and photoelectric response while in use.
    Type: Grant
    Filed: September 9, 2022
    Date of Patent: March 5, 2024
    Assignee: RAYNERGY TEK INCORPORATION
    Inventors: Wei-Long Li, Yu-Tang Hsiao, Chia-Hua Tsai, Chuang-Yi Liao
  • Publication number: 20100172131
    Abstract: A light-emitting diode (LED) street lamp is applicable for street lighting. The LED street lamp includes a casing, an LED module, and a heat dissipation module. The LED module and the heat dissipation module are arranged inside the casing. The LED module includes a frame, a circuit board carrying a plurality of LEDs, and a light regulation mechanism. The frame and the circuit board are set opposing each other with the light regulation mechanism arranged therebetween to interfere with emission light from the LEDs. The emission light, after being interfered with, is projected outside the casing to realize lighting. The heat dissipation module is in physical engagement with the LED module to remove heat generated by the LEDs. As such, the LED street lamp is provided with a broader range of illumination angle and more uniform brightness, so that the same LED street lamp is applicable to various sites and the heat generated by the LEDs can be efficiently dissipated.
    Type: Application
    Filed: January 2, 2009
    Publication date: July 8, 2010
    Inventors: Yun-Chiang Mo, Chia-Hua Liao, Yi-Chun Chen, Yen-Yu Huang, Chia-Hsiang Chuang
  • Publication number: 20090032825
    Abstract: The display module contains a circuit board, a heat-resistant and transparent protective layer, and a transparent and waterproofing enclosing member. The circuit board has a number of LED devices configured on the front surface and at least a terminal on the back surface. The LED devices are electrically and signally wired to the terminal so that electricity and video signals are fed to the LED devices via the terminal. The protective layer is coated on the outer surfaces of the LED devices and the circuit board so as to protect the wiring, the soldering contacts, and the electrical components of the circuit board from being damaged by the high temperature during the process of forming the enclosing member. The enclosing member wraps the circuit board and the LED devices entirely within and exposes only the terminal.
    Type: Application
    Filed: August 2, 2007
    Publication date: February 5, 2009
    Inventors: Yun-Chiang Mo, Yu-Chun Lin, Hsiao-Yi Cheng, Chia-Hua Liao, Ching-Ping Liu