Patents by Inventor Chia-Hua Liu
Chia-Hua Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240145132Abstract: An over-current protection device includes first and second electrode layers and a PTC material layer laminated therebetween. The PTC material layer includes a polymer matrix, and a conductive filler. The polymer matrix has a fluoropolymer. The total volume of the PTC material layer is calculated as 100%, and the fluoropolymer accounts for 47-62% by volume of the PTC material layer. The fluoropolymer has a melt viscosity higher than 3000 Pa·s.Type: ApplicationFiled: March 16, 2023Publication date: May 2, 2024Inventors: CHENG-YU TUNG, CHEN-NAN LIU, Chia-Yuan Lee, HSIU-CHE YEN, YUNG-HSIEN CHANG, Yao-Te Chang, FU-HUA CHU
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Publication number: 20240145133Abstract: An over-current protection device includes a first metal layer, a second metal layer and a heat-sensitive layer laminated therebetween. The heat-sensitive layer exhibits a positive temperature coefficient (PTC) characteristic and includes a polymer matrix and a first conductive filler. The polymer matrix includes a polyolefin-based polymer and a fluoropolymer. The fluoropolymer has a melt flow index higher than 1.9 g/10 min, and the polyolefin-based polymer and the fluoropolymer together form an interpenetrating polymer network (IPN). The first conductive filler has a metal-ceramic compound dispersed in the polymer matrix.Type: ApplicationFiled: April 5, 2023Publication date: May 2, 2024Inventors: CHEN-NAN LIU, YUNG-HSIEN CHANG, CHENG-YU TUNG, HSIU-CHE YEN, Chia-Yuan LEE, Yao-Te CHANG, FU-HUA CHU
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Publication number: 20240127988Abstract: An over-current protection device includes a first metal layer, a second metal layer and a heat-sensitive layer laminated therebetween. The heat-sensitive layer exhibits a positive temperature coefficient (PTC) characteristic and includes a first polymer and a conductive filler. The first polymer consists of polyvinylidene difluoride (PVDF), and PVDF exists in different phases such as ?-PVDF, ?-PVDF and ?-PVDF. The total amount of ?-PVDF, ?-PVDF and ?-PVDF is calculated as 100%, and the amount of ?-PVDF accounts for 48% to 55%. The conductive filler has a metal-ceramic compound.Type: ApplicationFiled: March 2, 2023Publication date: April 18, 2024Inventors: HSIU-CHE YEN, YUNG-HSIEN CHANG, CHENG-YU TUNG, Chia-Yuan Lee, CHEN-NAN LIU, Yao-Te Chang, FU-HUA CHU
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Publication number: 20240127989Abstract: An over-current protection device includes a first metal layer, a second metal layer and a heat-sensitive layer laminated therebetween. The heat-sensitive layer exhibits a positive temperature coefficient (PTC) characteristic and includes a first polymer and a conductive filler. The first polymer consists of polyvinylidene difluoride (PVDF), and PVDF exists in different phases such as ?-PVDF, ?-PVDF and ?-PVDF. The total amount of ?-PVDF, ?-PVDF and ?-PVDF is calculated as 100%, and the amount of ?-PVDF accounts for 33% to 42%.Type: ApplicationFiled: January 25, 2023Publication date: April 18, 2024Inventors: CHIA-YUAN LEE, CHENG-YU TUNG, HSIU-CHE YEN, CHEN-NAN LIU, YUNG-HSIEN CHANG, YAO-TE CHANG, FU-HUA CHU
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Publication number: 20240105504Abstract: A semiconductor device includes an insulating base layer, a semiconductor layer, an insulating layer, an isolation trench and a gettering site. The semiconductor layer and the insulating layer are disposed on the insulating base layer in sequence, and the isolation trench is disposed in the semiconductor layer and passes through the insulating layer. The isolation trench includes a first cross-section, a second cross-section and a third cross-section from top to bottom. The first cross-section is higher than the bottom surface of the insulating layer, and the second cross-section and the third cross-section are lower than the bottom surface of the insulating layer. The gettering site is disposed in the semiconductor layer and in contact with the isolation trench, and the vertex of the gettering site is lower than the second cross-section.Type: ApplicationFiled: September 23, 2022Publication date: March 28, 2024Applicant: Vanguard International Semiconductor CorporationInventors: Chrong-Jung Lin, Chia-Shen Liu, Wen-Hua Wen
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Patent number: 11942464Abstract: In an embodiment, a method includes: aligning a first package component with a second package component, the first package component having a first region and a second region, the first region including a first conductive connector, the second region including a second conductive connector; performing a first laser shot on a first portion of a top surface of the first package component, the first laser shot reflowing the first conductive connector of the first region, the first portion of the top surface of the first package component completely overlapping the first region; and after performing the first laser shot, performing a second laser shot on a second portion of the top surface of the first package component, the second laser shot reflowing the second conductive connector of the second region, the second portion of the top surface of the first package component completely overlapping the second region.Type: GrantFiled: July 19, 2021Date of Patent: March 26, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Hao-Jan Pei, Hsiu-Jen Lin, Wei-Yu Chen, Philip Yu-Shuan Chung, Chia-Shen Cheng, Kuei-Wei Huang, Ching-Hua Hsieh, Chung-Shi Liu, Chen-Hua Yu
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Publication number: 20240087879Abstract: A method includes performing a plasma activation on a surface of a first package component, removing oxide regions from surfaces of metal pads of the first package component, and performing a pre-bonding to bond the first package component to a second package component.Type: ApplicationFiled: November 14, 2023Publication date: March 14, 2024Inventors: Xin-Hua Huang, Ping-Yin Liu, Hung-Hua Lin, Hsun-Chung Kuang, Yuan-Chih Hsieh, Lan-Lin Chao, Chia-Shiung Tsai, Xiaomeng Chen
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Patent number: 11923409Abstract: A semiconductor device includes a source/drain feature over a semiconductor substrate, channel layers over the semiconductor substrate and connected to the source/drain feature, a gate portion between vertically adjacent channel layers, and an inner spacer between the source/drain feature and the gate portion and between adjacent channel layers. The semiconductor device further includes an air gap between the inner spacer and the source/drain feature.Type: GrantFiled: August 5, 2021Date of Patent: March 5, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Po-Yu Lin, Wei-Yang Lee, Chia-Pin Lin, Tzu-Hua Chiu, Kuan-Hao Cheng, Wei-Han Fan, Li-Li Su, Wei-Min Liu
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Publication number: 20230108785Abstract: A power adapter includes a circuit board, an electromagnetic interference filter, a shielding element, a power factor correction (PFC) inductor, a transformer and heating elements. The circuit board has a front side and a back side corresponding to each other, and a first long side and a second long side parallel to each other. The front side of the circuit board is divided into a first region, a second region and a third region along an extending direction of the first long side. The electromagnetic interference filter is disposed in the first region and close to the first long side. The shielding element is disposed in the first region and close to the electromagnetic interference filter. The PFC inductor is disposed in the first region of the circuit board and close to the second long side. The PFC inductor has a first long axis. The transformer is disposed in the third region and close to the first long side.Type: ApplicationFiled: July 29, 2022Publication date: April 6, 2023Applicant: FSP TECHNOLOGY INC.Inventors: Che-Min Lin, Chia-Hua Liu, Ching-Kai Lin
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Patent number: 10019398Abstract: A system includes a host device, an external bus and a storage device. A driver is installed in the host device. The external bus is connected with the host device. The external bus supports a communication protocol. The storage device includes a controlling circuit and a non-volatile memory. After the storage device issues a request to the host device according to the communication protocol, a reserved space is created in a host memory of the host device in response to the request, and a device information from the storage device is stored into the reserved space. While the host device issues a first command to operate the storage device, the first command is converted into a second command by the driver according to the device information, and then the second command is transmitted to the storage device.Type: GrantFiled: October 18, 2017Date of Patent: July 10, 2018Assignee: LITE-ON TECHNOLOGY CORPORATIONInventors: Jen-Yu Hsu, Yi-Chiang Wang, Chia-Hua Liu, Chao-Ton Yang, Tsung-Ching Chang
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Patent number: 9929675Abstract: An inverter apparatus is provided. The inverter apparatus includes a direct current to direct current (DC/DC) converter, a direct current to alternating current (DC/AC) converter and a control circuit. The DC/DC converter is arranged for converting an input power to a DC power according to a control signal. The DC/AC converter is coupled to the DC/DC converter, and is arranged for receiving the DC power, and generating an AC power according to the DC power. The control circuit is coupled to the DC/DC converter, and is arranged for generating the control signal according to a reference power and the input power so as to control an operation of the DC/DC converter, detecting the control signal to generate a detection result, and controlling the reference power according to the detection result so as to adjust a duty cycle of the control signal.Type: GrantFiled: February 25, 2015Date of Patent: March 27, 2018Assignee: FSP TECHNOLOGY INC.Inventors: Han-Wei Chen, Chun-Hao Yu, Chia-Hua Liu
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Publication number: 20180039590Abstract: A system includes a host device, an external bus and a storage device. A driver is installed in the host device. The external bus is connected with the host device. The external bus supports a communication protocol. The storage device includes a controlling circuit and a non-volatile memory. After the storage device issues a request to the host device according to the communication protocol, a reserved space is created in a host memory of the host device in response to the request, and a device information from the storage device is stored into the reserved space. While the host device issues a first command to operate the storage device, the first command is converted into a second command by the driver according to the device information, and then the second command is transmitted to the storage device.Type: ApplicationFiled: October 18, 2017Publication date: February 8, 2018Inventors: Jen-Yu Hsu, Yi-Chiang Wang, Chia-Hua Liu, Chao-Ton Yang, Tsung-Ching Chang
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Patent number: 9824043Abstract: A system includes a host device, an external bus and a storage device. A driver is installed in the host device. The external bus is connected with the host device. The external bus supports a communication protocol. The storage device includes a controlling circuit and a non-volatile memory. After the storage device issues a request to the host device according to the communication protocol, a reserved space is created in a host memory of the host device in response to the request, and a device information from the storage device is stored into the reserved space. While the host device issues a first command to operate the storage device, the first command is converted into a second command by the driver according to the device information, and then the second command is transmitted to the storage device.Type: GrantFiled: July 14, 2015Date of Patent: November 21, 2017Assignee: LITE-ON TECHNOLOGY CORPORATIONInventors: Jen-Yu Hsu, Yi-Chiang Wang, Chia-Hua Liu, Chao-Ton Yang, Tsung-Ching Chang
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Patent number: 9741503Abstract: The invention provides a control circuit of a switch device. A single output pin of the control unit outputs an enable signal to control terminals of two switch units to control an on-state of the two switch units, and adjust a current size of a control current of the on-state of the switch device. One of the switch units after receiving the enable signal for a predetermined time is switched to an off-state, so as to reduce power consumption of the switch device.Type: GrantFiled: February 16, 2015Date of Patent: August 22, 2017Assignee: FSP TECHNOLOGY INC.Inventors: Han-Wei Chen, Chun-Hao Yu, Chia-Hua Liu
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Patent number: 9614430Abstract: An inverting apparatus and an AC power system are provided. The inverting apparatus includes an inverting circuit, a detection circuit, and a control circuit. The inverting circuit receives a DC input voltage and converts the DC input voltage into an AC output voltage. The detection circuit samples the AC output voltage and compares the sampled AC output voltage respectively with a first reference voltage and a second reference voltage so as to generate a first indication signal and a second indication signal. The control circuit controls the operation of the inverting circuit. The control circuit determines whether the amplitude of the AC output voltage is located within an operating voltage range during each driving cycles according to the first and the second indication signals, and decides whether to enable an overvoltage protection or an undervoltage protection to control the power conversion of the inverting circuit according to the determination results.Type: GrantFiled: February 25, 2015Date of Patent: April 4, 2017Assignee: FSP TECHNOLOGY INC.Inventors: Han-Wei Chen, Chun-Hao Yu, Chia-Hua Liu
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Patent number: 9608434Abstract: An inverter apparatus includes a direct current to direct current converter (DC/DC converter), a direct current to alternating current converter (DC/AC converter), a primary-side control circuit and a secondary-side control circuit. The DC/DC converter is arranged for outputting a first DC power and a second DC power. The DC/AC converter is coupled to the DC/DC converter, and is arranged for receiving the first DC power. The primary-side control circuit is coupled to the DC/DC converter, and is arranged for controlling an operation of the DC/DC converter. The secondary-side control circuit is coupled to the DC/DC converter and the DC/AC converter, and is arranged for receiving the second DC power, and controlling an operation of the DC/AC converter according to the second DC power.Type: GrantFiled: February 24, 2015Date of Patent: March 28, 2017Assignee: FSP TECHNOLOGY INC.Inventors: Han-Wei Chen, Chun-Hao Yu, Chia-Hua Liu
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Patent number: 9590484Abstract: The invention is directed to an inverter device and a power converting method thereof. A control unit adjusts a pulse width modulation (PWM) signal serving to control power conversion of an inverter circuit according to a current harmonic component detected by a detection unit to generate an offset current to be superposed to an AC current output by the inverter circuit.Type: GrantFiled: February 17, 2015Date of Patent: March 7, 2017Assignee: FSP TECHNOLOGY INC.Inventors: Han-Wei Chen, Chun-Hao Yu, Chia-Hua Liu
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Patent number: 9564830Abstract: An inverting apparatus and a control method thereof are provided. The inverting apparatus includes an inverting circuit, a detection circuit, and a control circuit. The control circuit is coupled to the inverting circuit and the detection circuit and configured to provide a control signal to control the inverting circuit so as to adjust a voltage value of an input voltage into a command voltage represented by the control signal. The control circuit calculates a voltage difference between the detected input voltage and the command voltage so as to determine whether the voltage difference is greater than a preset value. When determining that the voltage difference is greater than the preset value, the control circuit sets the voltage value of the command voltage as the voltage value of the current input voltage.Type: GrantFiled: February 26, 2015Date of Patent: February 7, 2017Assignee: FSP TECHNOLOGY INC.Inventors: Han-Wei Chen, Chun-Hao Yu, Chia-Hua Liu
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Patent number: 9541587Abstract: An inverting apparatus and a control method thereof are provided. The inverting apparatus includes an inverting circuit, a detection circuit, and a control circuit. The inverting circuit converts a DC input power into an AC output power. The detection circuit detects an input voltage and an input current. The control circuit provides a control signal for disturbing the input voltage, such that a voltage value of the input voltage is adjusted to a command voltage represented by the control signal. The control circuit calculates an input power corresponding to each of time points, calculates a power variation between the disturbed power and the undisturbed power, then determines whether the power variation is larger than a predetermined variation, and sets a disturbance voltage according to the determination result, based on an MPPT operation or based on a disturbance direction of the command voltage of the previous time point.Type: GrantFiled: February 26, 2015Date of Patent: January 10, 2017Assignee: FSP TECHNOLOGY INC.Inventors: Han-Wei Chen, Chun-Hao Yu, Chia-Hua Liu
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Patent number: 9515573Abstract: An inverting apparatus and a control method thereof are provided. The inverting apparatus includes an inverting circuit, a capacitor, and a control circuit. The inverting circuit receives a DC input power and is configured to convert the DC input power into an AC output power, wherein an AC output current of the AC output power is preset to a preset output current. The capacitor is connected to an output terminal of the inverting circuit. The control circuit is coupled to the inverting circuit and is configured to control a power conversion of the inverting circuit, wherein the control circuit superimposes a preset capacitor compensation current of which the phase leads to the preset output current on the preset output current, so as to control the inverting circuit to adjust the AC output current and provide the adjusted AC output current to a power grid.Type: GrantFiled: February 26, 2015Date of Patent: December 6, 2016Assignee: FSP TECHNOLOGY INC.Inventors: Han-Wei Chen, Chun-Hao Yu, Chia-Hua Liu