Abstract: An organic semiconductor mixture and an organic optoelectronic device containing the same are provided. A n-type organic semiconductor compound in the organic semiconductor mixture has a novel chemical structure so that the mixture has good thermal stability and property difference during batch production is also minimized. The organic semiconductor mixture is applied to organic optoelectronic devices such as organic photovoltaic devices for providing good energy conversion efficiency while in use.

Abstract: A semiconductor device and method of manufacturing the same are provided. The semiconductor device includes a substrate and a first gate electrode disposed on the substrate and located in a first region of the semiconductor device. The semiconductor device also includes a first sidewall structure covering the first gate electrode. The semiconductor device further includes a protective layer disposed between the first gate electrode and the first sidewall structure. In addition, the semiconductor device includes a second gate electrode disposed on the substrate and located in a second region of the semiconductor device. The semiconductor device also includes a second sidewall structure covering a lateral surface of the second gate electrode.

Abstract: A method includes performing a plasma activation on a surface of a first package component, removing oxide regions from surfaces of metal pads of the first package component, and performing a pre-bonding to bond the first package component to a second package component.

Abstract: An organic semiconducting compound and an organic photoelectric component containing the same are provided. The organic semiconducting compound has a novel chemical structure to make the organic semiconducting compound have good response to the infrared light. The organic semiconducting compound can be applied to the organic photoelectric components such as organic photodetector (OPD), organic photovoltaic (OPV) cell, and organic field-effect transistor (OFET). Thus, the organic photoelectric components have better light absorption range and photoelectric response while in use.

Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above-mentioned memory device is also provided.

Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above- mentioned memory device is also provided.

Abstract: A method of patterning a semiconductor layer includes the following steps. The semiconductor layer is formed on a substrate. A photoresist layer is formed on the semiconductor layer. The photoresist layer is patterned to form an opening exposing an exposed region of the semiconductor layer. The exposed region of the semiconductor layer is dissolved with a solution to pattern the semiconductor layer, in which the solution includes a first organic solvent and a second organic solvent. The solubility of the semiconductor layer in the first organic solvent is greater than 1 mg/mL, and the solubility of the semiconductor layer in the second organic solvent is less than or equal to 1 mg/mL.

Abstract: An organic semiconductor mixture and an organic optoelectronic device containing the same are provided. A n-type organic semiconductor compound in the organic semiconductor mixture has a novel chemical structure so that the mixture has good thermal stability and property difference during batch production is also minimized. The organic semiconductor mixture is applied to organic optoelectronic devices such as organic photovoltaic devices for providing good energy conversion efficiency while in use.

Abstract: The invention relates to organic semiconducting compound and organic photoelectric components containing the organic semiconducting compound. The organic semiconducting compound is designed with a novel chemical structure, so that the compound demonstrates a good response value in the infrared light range, which is suitable for organic photoelectronic components, such as organic photodetector (OPD) or organic field-effect transistor (OFET), which come with a wavelength range of better absorbance and lower interference rate when in use.

Abstract: An organic semiconducting compound and an organic photoelectric component containing the same are provided. The organic semiconducting compound has a novel chemical structure to make the organic semiconducting compound have good response to the infrared light. The organic semiconducting compound can be applied to the organic photoelectric components such as organic photodetector (OPD), organic photovoltaic (OPV) cell, and organic field-effect transistor (OFET). Thus, the organic photoelectric components have better light absorption range and photoelectric response while in use.

Abstract: The present invention relates to an Organic Semiconducting Compound and organic photoelectric components using the same. The innovative chemical structure of the Organic Semiconducting Compound allows improved infrared light range response values and renders it suitable for uses in the organic photoelectric components, such as OPD, OFET, or OPV due to its broadened absorbance wavelength range and improved external quantum efficiency.

Abstract: An organic optoelectronic device comprises a first electrode, a first carrier transport layer, an active layer, a second carrier transport layer and a second electrode. The first electrode is a transparent electrode. The active layer includes a low band gap small molecule material which includes a structure of Formula I: Wherein, o, m, n, p, x and y are independently selected from any integer from 0 to 2. Ar0, Ar1 and A2 are electron-donating groups. A0 is a heteroatom-containg tricyclic structure with or without substituents, and. the heteroatom comprises at least one of S, N, Si, and Se. A1 is an electron withdrawing group with or without substituents, and the structure of the electron-withdrawing group comprises at least one of S, N, Si, Se, C?O, —CN, SO2. The organic optoelectronic device of the present invention has good external quantum efficiency and dark current performance.

Abstract: A device for transferring liquids and liquid samples in certain quantities includes a pressing unit and a liquid extraction assembly. The pressing unit includes a first housing and a second housing. The first housing includes a first sidewall, a first top wall, and an extrusion portion. The second housing includes a second sidewall, a second top wall, and a receiving cavity. The first housing is received in the receiving cavity. The liquid extraction assembly includes a liquid extraction pipe, a liquid extraction head, and a first connecting portion. The first housing is configured to move back and forth along the receiving cavity to drive the extrusion portion to compress and deform the liquid extraction pipe. The liquid extraction assembly is detachably installed in pressing unit and is replaceable and suitable for single-use situations.

Abstract: A nucleic acid detection kit includes a detection chip, an electrophoresis box, and a barrier unit. The detection chip includes a channel and an outlet. The outlet is connected to the channel. The temperature-dependent barrier unit may be in a first state or a second state. The barrier unit is disposed on a side of the outlet close to the channel when the barrier unit is in the first state, so that the channel is disconnected from the electrophoresis box. The barrier unit is away from the outlet when the barrier unit is in the second state, so that the channel is connected to the electrophoresis box. A nucleic acid detection device including the nucleic acid detection kit is also disclosed. The nucleic acid detection device has a simple structure, which is portable, flexible, and convenient, and can be used at home.

Abstract: A device for transferring liquids and liquid samples in certain quantities includes a first housing, a second housing, and a liquid extraction assembly. The first housing includes a first sidewall, a first top wall, an extrusion portion, and a first receiving cavity. The extrusion portion is disposed in the first receiving cavity. The second housing includes a second sidewall, a second top wall, and a second receiving cavity. The first housing is received in the second receiving cavity. The liquid extraction assembly includes a liquid extraction pipe and a liquid extraction head. By thumb or finger pressure, the first housing can be moved into the second receiving cavity to compress the extrusion portion to cause release of a sample, or released to gather a sample.

Abstract: A rechargeable battery includes power storage modules, a charging module and a control module. The charging module is electrically connected to the power storage modules. The control module is electrically connected to the power storage modules. The charging module is configured to selectively charge the power storage modules through a plurality of charging paths. Each power storage module corresponds to one of the charging paths. The control module is configured to command the charging module to charge at least one of the power storage modules according to the SoC of each power storage module.