Abstract: Semiconductor devices and methods of manufacture which utilize lids in order to constrain thermal expansion during annealing are presented. In some embodiments lids are placed and attached on encapsulant and, in some embodiments, over first semiconductor dies. As such, when heat is applied, and the encapsulant attempts to expand, the lid will work to constrain the expansion, reducing the amount of stress that would otherwise accumulate within the encapsulant.

Abstract: A semiconductor structure includes a semiconductor device, a plurality of through semiconductor vias (TSV), a first seal ring, and a second seal ring. The TSVs are in the semiconductor device. Each of the TSVs has a first surface and a second surface opposite to the first surface. The first seal ring is located in proximity to an edge of the semiconductor structure and is physically connected to the first surface of each of the TSVs. The second seal ring is physically connected to the second surface of each of the TSVs.

Abstract: A semiconductor structure includes a semiconductor device, a plurality of through semiconductor vias (TSV), a first seal ring, and a second seal ring. The TSVs are in the semiconductor device. Each of the TSVs has a first surface and a second surface opposite to the first surface. The first seal ring is located in proximity to an edge of the semiconductor structure and is physically connected to the first surface of each of the TSVs. The second seal ring is physically connected to the second surface of each of the TSVs.

Abstract: A semiconductor structure includes a semiconductor device, a plurality of through semiconductor vias (TSV), a first seal ring, and a second seal ring. The TSVs penetrate through the semiconductor device. The TSVs are adjacent to an edge of the semiconductor device. The first seal ring is disposed on and physically connected to one end of each of the TSVs. The second seal ring is disposed on and physically connected to another end of each of the TSVs.

Abstract: A semiconductor structure includes a semiconductor device, a plurality of through semiconductor vias (TSV), a first seal ring, and a second seal ring. The TSVs penetrate through the semiconductor device. The TSVs are adjacent to an edge of the semiconductor device. The first seal ring is disposed on and physically connected to one end of each of the TSVs. The second seal ring is disposed on and physically connected to another end of each of the TSVs.

Abstract: A manufacturing method of a semiconductor structure includes at least the following steps. A semiconductor device having a first surface and a second surface opposite to the first surface is provided. A plurality of through semiconductor vias (TSV) embedded in the semiconductor device is formed. A first seal ring is formed over the first surface of the semiconductor device. The first seal ring is adjacent to edges of the first surface and is physically in contact with the TSVs. A second seal ring is formed over the second surface of the semiconductor device. The second seal ring is adjacent to edges of the second surface and is physically in contact with the TSVs.

Abstract: A manufacturing method of a semiconductor structure includes at least the following steps. A semiconductor device having a first surface and a second surface opposite to the first surface is provided. A plurality of through semiconductor vias (TSV) embedded in the semiconductor device is formed. A first seal ring is formed over the first surface of the semiconductor device. The first seal ring is adjacent to edges of the first surface and is physically in contact with the TSVs. A second seal ring is formed over the second surface of the semiconductor device. The second seal ring is adjacent to edges of the second surface and is physically in contact with the TSVs.

Abstract: A semiconductor structure includes a semiconductor device, a first seal ring, a second seal ring, and a plurality of through semiconductor vias (TSV). The semiconductor device has a first surface and a second surface opposite to the first surface. The first seal ring is disposed on the first surface of the semiconductor device and is adjacent to edges of the first surface. The second seal ring is disposed on the second surface of the semiconductor device and is adjacent to edges of the second surface. The TSVs penetrate through the semiconductor device and physically connect the first seal ring and the second seal ring.

Abstract: A semiconductor structure includes a semiconductor device, a first seal ring, a second seal ring, and a plurality of through semiconductor vias (TSV). The semiconductor device has a first surface and a second surface opposite to the first surface. The first seal ring is disposed on the first surface of the semiconductor device and is adjacent to edges of the first surface. The second seal ring is disposed on the second surface of the semiconductor device and is adjacent to edges of the second surface. The TSVs penetrate through the semiconductor device and physically connect the first seal ring and the second seal ring.

Abstract: A semiconductor structure has a semiconductor device, a first seal ring, and a second seal ring. The semiconductor device has a first surface and a second surface opposite to the first surface. The first seal ring is disposed on the first surface of the semiconductor device and adjacent to edges of the first surface. The second seal ring is disposed on the second surface of the semiconductor device and adjacent to edges of the second surface. A semiconductor manufacturing process is also provided.

Abstract: A multi-input power supply apparatus with regulable output power includes an AC-to-DC conversion unit, a DC-to-DC conversion unit, an output voltage control unit, and an output power status display unit. The AC-to-DC conversion unit has an AC-to-DC stage feedback control subunit. The DC-to-DC conversion unit has a current sensing subunit, a DC-to-DC conversion subunit, a filter subunit, a protective disconnecting switch subunit, and a DC-to-DC stage feedback control subunit. The output voltage control unit provides a signal to the AC-to-DC stage feedback control subunit and the DC-to-DC stage feedback control subunit, thus regulating the output voltage of the AC-to-DC conversion unit and the output voltage of the DC-to-DC conversion unit. The output power status display unit displays the output voltage.

Abstract: A dual input power supply is provided, which comprises a dual input, a connector, a power converter circuit and an output. The dual input has a first input and a second input. The connector is an integrated magnetic element used for integrating the input powers having different power signals from the first input and the second input. The power converter circuit comprises an AC-to-DC converter, a DC-to-DC converter, a feedback circuit and a filter circuit. In the present invention, the dual input uses a set of transformer coils or inductive coils, thus the size of the present power supply can be reduced.

Abstract: A battery charging device suitable for a portable electronic device includes a rechargeable battery, a controlling chip, an adjusting transistor, a feedback circuit and a charger with adjustable output. The charger has an external alternating-current power source and provides a changeable voltage to the rechargeable battery of the portable electronic device. The feedback circuit captures a signal of electric quantities of the rechargeable battery and feeds back to the charger to adjust its output voltage and then the charger is controlled to charge the rechargeable battery. The adjustable transistor is used to control the charging of the rechargeable battery to reduce the number of parts of the battery charging device and waste of circuit traces.

Abstract: The present invention provides a heat sink structure, which includes: a housing located on a material with low thermal conductivity; and a heat conductor placed inside the housing. At least one air gap is formed between the heat conductor and the housing to reduce the conductivity from the heat conductor to the housing, and thus increasing the thermal resistance between the heat conductor and the housing. The surface temperature of the bottom of the housing thus could be reduced and averaged, so as to effectively improve the lifespan, the safety and reliability of a device with the heat sink structure.

Abstract: A dual input AC/DC power converter (10) having dual inputs (12,14) adapted to receive both an AC and DC input and provide a selectable DC voltage output (16) and a second DC output (18). The dual input AC/DC power converter (10) comprises a power converter circuit (20) having an AC-to-DC converter (22), a DC-to-DC booster converter (24), a feedback circuit (26), a filter circuit (25) and a DC-to-DC buck converter (28). Advantageously, the power converter (10) resolves many of the system management problems associated with carrying all of the different interface components necessary to power a wide variety of mobile products from either an AC or DC power supply. In addition, the feedback circuit (26) comprises single feedback loop having stacked photocouplers, one (PH1) controlling the AC-to-DC converter (22) and the other (PH3) controlling the DC-to-DC booster converter (24), to select the overall DC output voltage.

Abstract: The present invention provides a heat sink structure, which includes: a housing located on a material with low thermal conductivity; and a heat conductor placed inside the housing. At least one air gap is formed between the heat conductor and the housing to reduce the conductivity from the heat conductor to the housing, and thus increasing the thermal resistance between the heat conductor and the housing. The surface temperature of the bottom of the housing thus could be reduced and averaged, so as to effectively improve the lifespan, the safety and reliability of a device with the heat sink structure.

Abstract: A dual input AC/DC power converter (10) having dual inputs (12,14) adapted to receive both an AC and DC input and provide a selectable DC voltage output (16) and a second DC output (18). The dual input AC/DC power converter (10) comprises a power converter circuit (20) having an AC-to-DC converter (22), a DC-to-DC booster converter (24), a feedback circuit (26), a filter circuit (25) and a DC-to-DC buck converter (28). Advantageously, the power converter (10) resolves many of the system management problems associated with carrying all of the different interface components necessary to power a wide variety of mobile products from either an AC or DC power supply. In addition, the feedback circuit (26) comprises single feedback loop having stacked photocouplers, one (PH1) controlling the AC-to-DC converter (22) and the other (PH3) controlling the DC-to-DC booster converter (24), to select the overall DC output voltage.

Abstract: A dual input AC/DC power converter (10) having dual inputs (12,14) adapted to receive both an AC and DC input and provide a selectable DC voltage output (16) and a second DC output (18). The dual input AC/DC power converter (10) comprises a power converter circuit (20) having an AC-to-DC converter (22), a DC-to-DC booster converter (24), a feedback circuit (26), a filter circuit (25) and a DC-to-DC buck converter (28). Advantageously, the power converter (10) resolves many of the system management problems associated with carrying all of the different interface components necessary to power a wide variety of mobile products from either an AC or DC power supply. In addition, the feedback circuit (26) comprises single feedback loop having stacked photocouplers, one (PH1) controlling the AC-to-DC converter (22) and the other (PH3) controlling the DC-to-DC booster converter (24), to select the overall DC output voltage.

Abstract: A dual input AC/DC power converter (10) having dual inputs (12,14) adapted to receive both an AC and DC input and provide a selectable DC voltage output (16) and a second DC output (18). The dual input AC/DC power converter (10) comprises a power converter circuit (20) having an AC-to-DC converter (22), a DC-to-DC booster converter (24), a feedback circuit (26), a filter circuit (25) and a DC-to-DC buck converter (28). Advantageously, the power converter (10) resolves many of the system management problems associated with carrying all of the different interface components necessary to power a wide variety of mobile products from either an AC or DC power supply. In addition, the feedback circuit (26) comprises single feedback loop having stacked photocouplers, one (PH1) controlling the AC-to-DC converter (22) and the other (PH3) controlling the DC-to-DC booster converter (24), to select the overall DC output voltage.

Abstract: An apparatus is adapted to be disposed between a heating element and a housing for evenly dissipating heat generated by the heating element. The apparatus includes a first thermal conductor having a first part contacted with the heating element for absorbing the generated heat from the heating element, and having a second part, and a second thermal conductor having a first part with a relatively low thermal conductivity to contact with the first part of the first thermal conductor and a second part with a relatively high thermal conductivity to contact with the second part of the first thermal conductor for transferring the heat from the first thermal conductor to the housing.