Patents by Inventor Chia-Huang Wang

Chia-Huang Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8901948
    Abstract: A wafer probe card has an adapter module and a probe module detachably mounted together. The adapter module has a holding member and an interposer mounted within the holding plate. The probe module has a frame assembly and a space transformer and a probe assembly mounted within the frame assembly. A fixing plate is mounted on the holding member of the adapter module to constitute an electrical connection among the interposer, space transformer and probe assembly. When any element of the wafer probe card is faulty, the adapter module or the probe module is detached and the faulty element is replaced. The adapter module or the probe module with the replaced element is then reassembled. Alternatively, the adapter module or the probe module can be replaced on a modular basis. Accordingly, it is not necessary that all components be detached entirely, thereby improving the operational speed and efficiency.
    Type: Grant
    Filed: December 5, 2011
    Date of Patent: December 2, 2014
    Assignee: Winway Technology Co., Ltd.
    Inventors: Chia-Huang Wang, Hsin Chieh Lu, Jung Fu Lee
  • Publication number: 20130141130
    Abstract: A wafer probe card has an adapter module and a probe module detachably mounted together. The adapter module has a holding member and an interposer mounted within the holding plate. The probe module has a frame assembly and a space transformer and a probe assembly mounted within the frame assembly. A fixing plate is mounted on the holding member of the adapter module to constitute an electrical connection among the interposer, space transformer and probe assembly. When any element of the wafer probe card is faulty, the adapter module or the probe module is detached and the faulty element is replaced. The adapter module or the probe module with the replaced element is then reassembled. Alternatively, the adapter module or the probe module can be replaced on a modular basis. Accordingly, all components are unnecessarily to be detached entirely, thereby improving the operational speed and efficiency.
    Type: Application
    Filed: December 5, 2011
    Publication date: June 6, 2013
    Inventors: Chia-Huang Wang, Hsin Chieh Lu, Jung Fu Lee