Patents by Inventor Chia-hung Chen

Chia-hung Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11901791
    Abstract: A functional module is provided. The functional module is applied to an electronic device, and includes a housing, a functional member, and a motor assembly. Both the functional member and the motor assembly are disposed in the housing. The motor assembly includes a motor and an output shaft. The motor is configured to drive the output shaft to rotate. The output shaft protrudes from one side of the housing.
    Type: Grant
    Filed: February 5, 2021
    Date of Patent: February 13, 2024
    Assignee: ASUSTEK COMPUTER INC.
    Inventors: Chia-Min Cheng, Chui-Hung Chen, Ching-Yuan Yang, Cheng-Han Chung
  • Patent number: 11899367
    Abstract: An electron beam lithography system and an electron beam lithography process are disclosed herein for improving throughput. An exemplary method for increasing throughput achieved by an electron beam lithography system includes receiving an integrated circuit (IC) design layout that includes a target pattern, wherein the electron beam lithography system implements a first exposure dose to form the target pattern on a workpiece based on the IC design layout. The method further includes inserting a dummy pattern into the IC design layout to increase a pattern density of the IC design layout to greater than or equal to a threshold pattern density, thereby generating a modified IC design layout. The electron beam lithography system implements a second exposure dose that is less than the first exposure dose to form the target pattern on the workpiece based on the modified IC design layout.
    Type: Grant
    Filed: December 12, 2022
    Date of Patent: February 13, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD
    Inventors: Shih-Ming Chang, Wen Lo, Chun-Hung Liu, Chia-Hua Chang, Hsin-Wei Wu, Ta-Wei Ou, Chien-Chih Chen, Chien-Cheng Chen
  • Patent number: 11899368
    Abstract: A method of manufacturing a semiconductor device is as below. An exposed photoresist layer is developed using a developer supplied by a developer supplying unit. An ammonia gas by-product of the developer is discharged through a gas outlet of the developer supplying unit into a treating tool. The ammonia gas by-product is retained in the treating tool. A concentration of the ammonia gas by-product is monitored.
    Type: Grant
    Filed: August 9, 2022
    Date of Patent: February 13, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yu-Kai Chen, Chia-Hung Chung, Ko-Bin Kao, Su-Yu Yeh, Li-Jen Wu, Zhi-You Ke, Ming-Hung Lin
  • Publication number: 20240048255
    Abstract: A method for estimating distribution of wireless signal strength, selecting measuring locations to measure wireless signal strength and compensating estimated wireless signal strength is provided, wherein the method for estimating distribution of wireless signal strength estimates the wireless signal strength at an estimation location in accordance with a plurality of single-reflection paths started from a signal emitter, the method for selecting position for measuring wireless signal strength determines whether a signal measuring process should be performed at the specific location, and the method for compensating estimated wireless signal strength compensates an estimated wireless signal strength near a specific location in accordance with a signal strength value measured at the specific location.
    Type: Application
    Filed: July 20, 2023
    Publication date: February 8, 2024
    Inventors: CHIA-SHUO YEH, CHIEN-HSIANG CHEN, JEN-HUNG YANG, SHIH-FANG AO
  • Publication number: 20240041166
    Abstract: Buffing of a footwear component allows for an alteration of the component surface to achieve an intended surface for aesthetics and/or manufacturing purposes. The buffing is performed in a system having a vision module, a sidewall buffing module, an up surface buffing module, and a down surface buffing module. Each of the buffing modules are adapted for the unique shape and sizes of a footwear component to effectively and automatically buff the footwear component.
    Type: Application
    Filed: October 17, 2023
    Publication date: February 8, 2024
    Inventors: Chun-Chieh Chen, Yi-Min Chen, Chia-Hung Lin, Hsien-Kuang Wu, Hung-Yu Wu
  • Publication number: 20240043290
    Abstract: This disclosure is related to an ultraviolet fluid sterilizing box structure. A box (10) includes a chamber (100), a water inlet (101) and a water outlet (102). The water inlet (101) and the water outlet (102) are located on different sides of the box (10). The partition (20) is disposed in the chamber (100) and includes an outer cylinder (21) and an inner cylinder (22). The outer cylinder (21) includes an outer cavity (210) and an inflow inlet (211). The inner cylinder (22) includes an inner cavity (220) and an opening (221). The ultraviolet module (30) is disposed on one side of the box (10) and includes a light-transmitting plate (31) and an ultraviolet lamp set (32). The light-transmitting plate (31) seals the outer cylinder (21). The ultraviolet rays irradiate the inner cavity (220) and the outer cavity (210).
    Type: Application
    Filed: August 4, 2022
    Publication date: February 8, 2024
    Inventors: Chun-Hung LU, Chia-Te LIN, Chih-Hsin CHEN
  • Patent number: 11895927
    Abstract: A semiconductor memory device includes a substrate having a conductor region thereon, an interlayer dielectric layer on the substrate, and a conductive via electrically connected to the conductor region. The conductive via has a lower portion embedded in the interlayer dielectric layer and an upper portion protruding from a top surface of the interlayer dielectric layer. The upper portion has a rounded top surface. A storage structure conformally covers the rounded top surface.
    Type: Grant
    Filed: May 13, 2021
    Date of Patent: February 6, 2024
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Chia-Chang Hsu, Tang-Chun Weng, Cheng-Yi Lin, Yung-Shen Chen, Chia-Hung Lin
  • Publication number: 20240035612
    Abstract: A foldable support, wherein the foldable support comprises two first supporting members, two second supporting members, two first assembly portions, and two second assembly portions. The first supporting members are able to be rotatably unfolded relative to the second supporting members or be drawn together and folded up. First linking members are respectively movable connected to the two first assembly portions close to the ends of a second supporting arm, and the other ends of the two second linking members are respectively correspondingly hinged to the two second supporting members. The two second assembly portions are respectively correspondingly hinged to the two second supporting members, and each of the second assembly portions, close to the ends of the first supporting arm, are movable connected to first linking members. The two first linking members are respectively correspondingly hinged to the two first supporting members.
    Type: Application
    Filed: May 4, 2023
    Publication date: February 1, 2024
    Inventors: Ming-Yong CHAI, Zhong-Xiong CHENG, Bao-Lin CHEN, Chia-Hung WU
  • Publication number: 20240019620
    Abstract: A display device includes a first image generating unit and a first waveguide glass. The first image generating unit is configured to emit first light. The first waveguide glass faces toward the first image generating unit. The first waveguide glass includes a first microstructure, two second microstructures and a third microstructure. The first microstructure is located between two ends at the same side of the two second microstructures. The third microstructure is located between the two second microstructures. The third microstructure has a first grating and a second grating. An extending direction of the first grating is different from an extending direction of the second grating. The second microstructure is configured to receive the first light of the first image generating unit transmitted through the first microstructure and transmit the first light to the third microstructure.
    Type: Application
    Filed: November 30, 2022
    Publication date: January 18, 2024
    Inventors: Han-Sheng NIAN, Ming-Jui WANG, Chih-Chiang CHEN, Chia-Hsin CHUNG, Yu-Cheng SHIH, Wei-Syun WANG, Cheng-Chan WANG, Hsin-Hung LI, Sheng-Ming HUANG
  • Publication number: 20240012241
    Abstract: A head-up display includes an image generating unit and a waveguide glass. The waveguide glass faces toward the image generating unit. The waveguide glass includes a first microstructure, a second microstructure and a third microstructure. The first microstructure has a first width. The second microstructure is adjacent to the first microstructure. The third microstructure is adjacent to the second microstructure. The third microstructure has tiling areas adjacent to each other. A gap between the two adjacent tiling areas is less than half of the first width.
    Type: Application
    Filed: November 29, 2022
    Publication date: January 11, 2024
    Inventors: Han-Sheng NIAN, Seok-Lyul LEE, Ming-Jui WANG, Chih-Chiang CHEN, Chia-Hsin CHUNG, Yu-Cheng SHIH, Cheng-Chan WANG, Hsin-Hung LI, Wei-Syun WANG, Sheng-Ming HUANG
  • Patent number: 11871534
    Abstract: A display includes an outer frame, a supporting frame, a display module, and a covering member. The supporting frame is accommodated in the outer frame. The display module is disposed on a supporting member of the supporting frame. The supporting member extends toward a display region of the display module from the supporting frame. On a first surface of the display module, a projection area of the supporting member and a projection area of an first optical film of the display module are partially overlapped with each other. A third surface of the covering member is closely attached to a second optical film of the display module. The covering member has an extension portion. The extension portion extends from a fourth surface opposite to the third surface toward a direction away from the third surface, and the extension portion is coplanar with the outer side surface of the outer frame.
    Type: Grant
    Filed: June 17, 2022
    Date of Patent: January 9, 2024
    Assignee: AUO DISPLAY PLUS CORPORATION
    Inventors: Chia-Hung Chen, Chung-Kuan Ting, Hong-Ming Chen, Yung-Jen Chen
  • Publication number: 20240006769
    Abstract: An electronic device including a metal bottom plate, a metal frame and at least one radiator is provided. The metal bottom plate includes at least one ground terminal. The metal frame includes at least one slot, at least one disconnecting part, at least one first connecting part and at least one second connecting part. The disconnecting part includes a first part and a second part. Each radiator includes a first terminal and a second terminal. The second terminal is connected to a junction between the first part and the second part. The first terminal, the second terminal, the first part, the first connecting part and the ground terminal form a first antenna path radiating at a first frequency band. The first terminal, the second terminal, the second part, the second connecting part and the ground terminal form a second antenna path radiating at a second frequency band.
    Type: Application
    Filed: May 15, 2023
    Publication date: January 4, 2024
    Applicant: PEGATRON CORPORATION
    Inventors: Chien-Yi Wu, Chih-Wei Liao, Chao-Hsu Wu, Hau Yuen Tan, Shih-Keng Huang, Cheng-Hsiung Wu, Chia-Hung Chen, Sheng-Chin Hsu, Hao-Hsiang Yang
  • Publication number: 20240006505
    Abstract: A semiconductor device includes a semiconductor structure, a conductive nitride feature, a third dielectric feature, and a conductive line feature. The semiconductor structure includes a substrate, two source/drain regions disposed in the substrate, a first dielectric feature disposed over the substrate, a gate structure disposed in the first dielectric feature and between the source/drain regions, a second dielectric feature disposed over the first dielectric feature, and a contact feature disposed in the second dielectric feature and being connected to at least one of the source/drain regions and the gate structure. The conductive nitride feature includes metal nitride or alloy nitride, is disposed in the second dielectric feature, and is connected to the contact feature. The third dielectric feature is disposed over the second dielectric feature. The conductive feature is disposed in the third dielectric feature and is connected to the conductive nitride feature opposite to the contact feature.
    Type: Application
    Filed: June 30, 2022
    Publication date: January 4, 2024
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Po-Chin CHANG, Yuting CHENG, Hsu-Kai CHANG, Chia-Hung CHU, Tzu-Pei CHEN, Shuen-Shin LIANG, Sung-Li WANG, Pinyen LIN, Lin-Yu HUANG
  • Publication number: 20240003359
    Abstract: A thinned pump includes a casing, a rotor assembly and a stator assembly. The casing includes a base and a cover. The cover covers the base so as to form a fluid chamber together, the cover has an inlet channel and an outlet channel, and the inlet channel and the outlet channel are in fluid communication with the fluid chamber. The rotor assembly includes an impeller and a magnetic component. The impeller is rotatably disposed in the casing, and the magnetic component is embedded into the impeller. The stator assembly includes a plurality of magnetically conductive pillars and a plurality of coils. The magnetically conductive pillars are mounted at one side of the base located opposite to the fluid chamber, and the coils are respectively disposed on the magnetically conductive pillars.
    Type: Application
    Filed: January 24, 2023
    Publication date: January 4, 2024
    Applicant: COOLER MASTER CO., LTD.
    Inventors: Chiu Yu YEH, Wen-Hsien LIN, Chia-Hao SUNG, Wen-Hung CHEN
  • Patent number: 11859045
    Abstract: Provided are a liquid crystal polymer film (LCP film) and a laminate comprising the same. The LCP film has a first surface and a second surface opposite each other, and the first surface has an arithmetical mean height of a surface (Sa) less than 0.32 ?m. The LCP film with proper Sa is suitable to be stacked with a metal foil, such that a laminate comprising the LCP film can have an advantage of low insertion loss.
    Type: Grant
    Filed: December 18, 2020
    Date of Patent: January 2, 2024
    Assignee: CHANG CHUN PLASTICS CO., LTD.
    Inventors: An-Pang Tu, Chia-Hung Wu, Chien-Chun Chen
  • Patent number: 11862866
    Abstract: An antenna module includes a first, a second, a third radiators, and a ground radiator. The first radiator includes a first section and a second section. The second radiator is connected to the first radiator, and includes a third section and a fourth section connected to each other. The fourth section includes a feed end. The third radiator is connected to the third section of the second radiator. The ground radiator is connected to the third radiator. The first, the second, the third, and the ground radiator are sequentially connected in a bent manner to form a stepped shape. The first section of the first radiator and the fourth section of the second radiator jointly resonate at a low frequency band, and the second section of the first radiator, the second radiator, the third radiator, and the ground radiator jointly resonate at a high frequency band.
    Type: Grant
    Filed: February 21, 2022
    Date of Patent: January 2, 2024
    Assignee: PEGATRON CORPORATION
    Inventors: Cheng-Hsiung Wu, Chien-Yi Wu, Chao-Hsu Wu, Hau Yuen Tan, Ching-Hsiang Ko, Shih-Keng Huang, Chia-Hung Chen
  • Publication number: 20230420344
    Abstract: A semiconductor apparatus is provided. The semiconductor apparatus includes: a first circuit, including a first semiconductor substrate, a first group of circuit components formed on the first semiconductor substrate, and a first group of metal layers, wherein, the first group of circuit components are distributed to at least one circuit block, and traces for each circuit block are formed in at least some of the first group of metal layers; a second circuit, including a second semiconductor substrate, a second group of circuit components formed on the second semiconductor substrate, and a second group of metal layers, wherein, the second group of circuit components are distributed to at least one circuit block, and traces for each circuit block are formed in at least some of the second group of metal layers, and the first circuit and the second circuit being face-to-face stacked and bonded.
    Type: Application
    Filed: June 28, 2023
    Publication date: December 28, 2023
    Inventors: Hsueh-Yi Lee, Chun-Hung Chen, Chia-Hsin Tung, Wen-Pin Tsai
  • Publication number: 20230417081
    Abstract: An electronic door lock with up-pushed locking is provided and includes a housing, a fixed latch assembly assembled in the housing, a linkage member and a first driving member. The first driving member is linked with an outer handle located outside a door. When a user lifts the outer handle, the first driving member is pulled to drive the linkage member, so that the linkage member abuts against a protruding rod located at a rear end of the fixed latch assembly, thereby pushing the fixed latch assembly to actuate, so that a fixed latch head of the fixed latch assembly protrudes out of the housing and the electronic door lock is locked. Accordingly, the problem that the user must use a key to lock the electronic door lock when the user is outside the door can be solved.
    Type: Application
    Filed: May 18, 2023
    Publication date: December 28, 2023
    Applicant: TLHM CO., LTD.
    Inventors: Po-Yang CHEN, Chia-Hung YEN
  • Patent number: D1010656
    Type: Grant
    Filed: September 30, 2021
    Date of Patent: January 9, 2024
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Chia-Chi Sun, Chun-Chieh Chen, Hao-Jen Fang, Po-Yang Chien, Sheng-Hung Lee
  • Patent number: D1014506
    Type: Grant
    Filed: September 30, 2021
    Date of Patent: February 13, 2024
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Chia-Chi Sun, Chun-Chieh Chen, Hao-Jen Fang, Po-Yang Chien, Sheng-Hung Lee