Patents by Inventor Chia-Hung Lu
Chia-Hung Lu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240157217Abstract: A golf teaching method and a golf teaching system are provided. The golf teaching method includes: configuring image capturing devices and golf simulator to capture swing images and corresponding simulator data records, when a user performs a golf swing; configuring an expert model that includes expert motion information and corresponding correction suggestion information; configuring a computing device to perform an analysis process on the swing images and the simulator data records to divide the golf swing into user motions according to stages and obtaining records of user motion information corresponding to the plurality of stages, and to compare the user motion information with the corresponding expert motion information in each stage through the expert model, and to provide the corresponding correction suggestion information according to a comparison result; and configuring a user interface to provide the correction suggestion information.Type: ApplicationFiled: April 20, 2023Publication date: May 16, 2024Inventors: CHENG-HUNG TSAI, CHIA-YU JIH, CHIH-CHUNG CHIEN, LI-LIN LU, SHAO-JUN TAN, WEN-FU LAI
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Publication number: 20240096781Abstract: A package structure including a semiconductor die, a redistribution circuit structure and an electronic device is provided. The semiconductor die is laterally encapsulated by an insulating encapsulation. The redistribution circuit structure is disposed on the semiconductor die and the insulating encapsulation. The redistribution circuit structure includes a colored dielectric layer, inter-dielectric layers and redistribution conductive layers embedded in the inter-dielectric layers. The electronic device is disposed over the colored dielectric layer and electrically connected to the redistribution circuit structure.Type: ApplicationFiled: March 20, 2023Publication date: March 21, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chun-Ti Lu, Hao-Yi Tsai, Chia-Hung Liu, Yu-Hsiang Hu, Hsiu-Jen Lin, Tzuan-Horng Liu, Chih-Hao Chang, Bo-Jiun Lin, Shih-Wei Chen, Hung-Chun Cho, Pei-Rong Ni, Hsin-Wei Huang, Zheng-Gang Tsai, Tai-You Liu, Po-Chang Shih, Yu-Ting Huang
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Patent number: 8133796Abstract: A method for fabricating shallow trench isolation structures is provided. A patterned pad layer and a patterned mask layer are sequentially formed on a substrate, wherein the substrate includes a memory region and a periphery region. By using the patterned mask layer as a mask, the substrate is partially removed to form a plurality of trenches. A first liner layer is formed on the substrate to cover surfaces of the patterned mask layer, the patterned pad layer and the trenches. After removing the first liner layer in the periphery region, a pull-back process is performed on the patterned mask layer, and a pull-back amount of the patterned mask layer in the periphery region is larger than a pull-back amount of the patterned mask layer in the memory region. An insulating layer is formed in the trenches to form a plurality of shallow trench isolation structures.Type: GrantFiled: March 6, 2011Date of Patent: March 13, 2012Assignee: Winbond Electronics Corp.Inventors: Chih-Jung Ni, Chia-Hung Lu
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Publication number: 20110182022Abstract: A structure of compartmental waterproof casing comprises a mother board and a casing body with multiple compartments. The compartments are closed and sealed in order to prevent moisture or other foreign substance from entering the casing body. Therefore the device installed inside the casing body is waterproof and protected against other damaging substance.Type: ApplicationFiled: March 18, 2010Publication date: July 28, 2011Applicant: CReTE SYSTEMS INC.Inventors: CHIA-HUNG LU, CHIH-TENG YAO
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Patent number: 7957141Abstract: A heat-dissipating mechanism includes a first heat-dissipating device, a first positioning device, a second heat-dissipating device and a second positioning device. The first heat-dissipating device is contacted with a memory module. The first positioning device is disposed on the first heat-dissipating device and includes a protrusion. The second heat-dissipating device is connected with the first heat-dissipating device. The second positioning device has a positioning rail formed in the second heat-dissipating device and corresponding to the protrusion. The second heat-dissipating device is connected with the first heat-dissipating device when the protrusion of the first positioning device is embedded into the positioning rail second positioning device.Type: GrantFiled: August 6, 2010Date of Patent: June 7, 2011Assignee: Asustek Computer Inc.Inventors: Chia-Hsing Chou, Chih-Wei Tsai, Chia-Hung Lu
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Publication number: 20100302732Abstract: A heat-dissipating mechanism includes a first heat-dissipating device, a first positioning device, a second heat-dissipating device and a second positioning device. The first heat-dissipating device is contacted with a memory module. The first positioning device is disposed on the first heat-dissipating device and includes a protrusion. The second heat-dissipating device is connected with the first heat-dissipating device. The second positioning device has a positioning rail formed in the second heat-dissipating device and corresponding to the protrusion. The second heat-dissipating device is connected with the first heat-dissipating device when the protrusion of the first positioning device is embedded into the positioning rail second positioning device.Type: ApplicationFiled: August 6, 2010Publication date: December 2, 2010Applicant: ASUSTEK COMPUTER INC.Inventors: Chia-Hsing Chou, Chih-Wei Tsai, Chia-Hung Lu
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Patent number: 7791881Abstract: A heat-dissipating mechanism includes a first heat-dissipating device, a first positioning device, a second heat-dissipating device and a second positioning device. The first heat-dissipating device is contacted with a memory module. The first positioning device is disposed on the first heat-dissipating device and includes a protrusion. The second heat-dissipating device is connected with the first heat-dissipating device. The second positioning device has a positioning rail formed in the second heat-dissipating device and corresponding to the protrusion. The second heat-dissipating device is connected with the first heat-dissipating device when the protrusion of the first positioning device is embedded into the positioning rail second positioning device.Type: GrantFiled: May 19, 2009Date of Patent: September 7, 2010Assignee: Asustek Computer Inc.Inventors: Chia-Hsing Chou, Chih-Wei Tsai, Chia-Hung Lu
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Publication number: 20090310295Abstract: A heat-dissipating mechanism includes a first heat-dissipating device, a first positioning device, a second heat-dissipating device and a second positioning device. The first heat-dissipating device is contacted with a memory module. The first positioning device is disposed on the first heat-dissipating device and includes a protrusion. The second heat-dissipating device is connected with the first heat-dissipating device. The second positioning device has a positioning rail formed in the second heat-dissipating device and corresponding to the protrusion. The second heat-dissipating device is connected with the first heat-dissipating device when the protrusion of the first positioning device is embedded into the positioning rail second positioning device.Type: ApplicationFiled: May 19, 2009Publication date: December 17, 2009Applicant: ASUSTEK COMPUTER INC.Inventors: Chia-Hsing Chou, Chih-Wei Tsai, Chia-Hung Lu