Abstract: A sweep voltage generator and a display panel are provided. The sweep voltage generator includes an output node, a current generating block and a voltage regulating block. The output node is used to provide a sweep signal. The current generating block is coupled to the output node, includes a detection path for detecting an output load variation on the output node, and adjusts the sweep signal provided by the output node based on the output load variation. The voltage regulating block is coupled to the output node for regulating a voltage of the output node.

Abstract: An electronic device including a bracket and an antenna is provided. The bracket includes first, second, third, and fourth surfaces. The antenna includes a radiator. The radiator includes first, second, third, and fourth portions. The first portion is located on the first surface and includes connected first and second sections. The second portion is located on the second surface and includes third, fourth, fifth, and sixth sections. The third section, the fourth section, and the fifth sections are bent and connected to form a U shape. The third portion is located on the third surface and is connected to the second section and the fourth section. The fourth portion is located on the fourth surface and is connected to the fifth section, the sixth section, and the third portion. The radiator is adapted to resonate at a low frequency band and a first high frequency band.

Abstract: Provided are an LCP film and a laminate comprising the same. The LCP film is made of an LCP resin comprising a structural unit represented by Formula (1): -L1-Ar-L2- (1), wherein -L1- and -L2- are respectively —O— or —CO—; —Ar— is an arylene group. Formula (1) comprises structural units Based on a total molar number of the structural unit represented by Formula (1), a molar number of the structural unit represented by Formula (I) is in the range from 15 mole % to mole %, and a sum of molar numbers of the structural units represented by Formulae (I) and (II) is in the range from 80 mole % to 100 mole %. The LCP film has a thickness and a transmittance, wherein when values of the thickness (in ?m) and the transmittance are put into Formula (III), the obtained value is from 0.055 to 0.090. Formula (III): Log(1/TT %)/(Thickness)0.5.

Abstract: The present invention discloses a vessel tracking and monitoring system and operating method thereof. Specifically, the vessel tracking and monitoring system comprises at least one camera, a processing module and a storage module. On the other hand, the processing module may keep the water object which is detected and recognized by the at least one camera in the center area of a monitoring screen. Therefore, the present invention may track and recognize the type of the at least one water object, assisting areas such as ports in managing and tracking water object arrivals and departures under various environmental conditions.

Abstract: A security lock has a fixing element and at least one hook. The fixing element is mounted in a security slot of an electronic device. The hook is capable of moving axially with respect to the fixing element, and the hook moves radially outward along a guiding structure of the fixing element to engage with the security slot, the fixing element stays static, i.e., without moving and rotating as the hook is moving. Therefore, the security lock won't press the security slot, and further prevents damage to the security slot caused by frequently or constantly loaded with the security lock. Furthermore, without moving and rotating in a mounting process of the security lock, the fixing element holds the hook to steadily engage with the security slot, and thus an overall anti-pulling and anti-pushing performances are enhanced.

Abstract: A semiconductor package is provided. The semiconductor package includes a heat dissipation substrate including a first conductive through-via embedded therein; a sensor die disposed on the heat dissipation substrate; an insulating encapsulant laterally encapsulating the sensor die; a second conductive through-via penetrating through the insulating encapsulant; and a first redistribution structure and a second redistribution structure disposed on opposite sides of the heat dissipation substrate. The second conductive through-via is in contact with the first conductive through-via. The sensor die is located between the second redistribution structure and the heat dissipation substrate. The second redistribution structure has a window allowing a sensing region of the sensor die receiving light. The first redistribution structure is electrically connected to the sensor die through the first conductive through-via, the second conductive through-via and the second redistribution structure.

Abstract: A package structure includes a thermal dissipation structure, a first encapsulant, a die, a through integrated fan-out via (TIV), a second encapsulant, and a redistribution layer (RDL) structure. The thermal dissipation structure includes a substrate and a first conductive pad disposed over the substrate. The first encapsulant laterally encapsulates the thermal dissipation structure. The die is disposed on the thermal dissipation structure. The TIV lands on the first conductive pad of the thermal dissipation structure and is laterally aside the die. The second encapsulant laterally encapsulates the die and the TIV. The RDL structure is disposed on the die and the second encapsulant.

Abstract: Provided are a liquid crystal polymer film (LCP film) and a laminate comprising the same. The LCP film has a first surface and a second surface opposite each other, and the first surface has an arithmetical mean height of a surface (Sa) less than 0.32 ?m. The LCP film with proper Sa is suitable to be stacked with a metal foil, such that a laminate comprising the LCP film can have an advantage of low insertion loss.

Abstract: An electronic device includes a metal back cover, a metal frame, a first antenna module and a second antenna module. The metal frame includes a first and a second disconnection portion, a first and a second connection portion. The first and the second connection portion are connected to the metal back cover. The first disconnection portion is separated from the first connection portion, the metal back cover and the second disconnection portion to form a first slot. The second disconnection portion is connected to the second connection portion and is separated from the metal back cover to form a second slot. The first antenna module is connected to the first disconnection portion, and forms a first antenna path. The second antenna module is connected to the second disconnection portion, and forms a second and a third antenna path with the second disconnection portion and the metal back cover.

Abstract: A radar system includes an ultrasonic radar unit and a warning device. The ultrasonic radar unit is configured to be detachably mounted on a vehicle, and is configured to output a pairing signal when a pairing function is activated and output a warning signal upon detecting an object that is within a range. The warning device is configured to be electrically connected to the ultrasonic radar unit and to be mounted inside the vehicle. The warning device is configured to wirelessly communicate with the ultrasonic radar unit to receive the warning signal and the pairing signal; when receiving the pairing signal, couple the ultrasonic radar unit to one of a plurality of warning areas that is on the warning device according to the pairing signal; control one of the warning areas that is coupled to the ultrasonic radar unit to output a visual warning upon receiving the warning signal.

Abstract: A foldable support, wherein the foldable support comprises two first supporting members, two second supporting members, two first assembly portions, and two second assembly portions. The first supporting members are able to be rotatably unfolded relative to the second supporting members or be drawn together and folded up. First linking members are respectively movable connected to the two first assembly portions close to the ends of a second supporting arm, and the other ends of the two second linking members are respectively correspondingly hinged to the two second supporting members. The two second assembly portions are respectively correspondingly hinged to the two second supporting members, and each of the second assembly portions, close to the ends of the first supporting arm, are movable connected to first linking members. The two first linking members are respectively correspondingly hinged to the two first supporting members.

Abstract: Provided are a liquid crystal polymer film (LCP film) and a laminate comprising the same. The LCP film has a first surface and a second surface opposite each other, and the first surface has an arithmetical mean height of a surface (Sa) less than 0.32 ?m. The LCP film with proper Sa is suitable to be stacked with a metal foil, such that a laminate comprising the LCP film can have an advantage of low insertion loss.

Abstract: Provided are a laminate, a circuit board, and a liquid crystal polymer (LCP) film comprised therein. The laminate comprises a metal foil and an LCP film. The LCP film in the laminate has a dissipation factor before water absorption (Df?0), a dissipation factor after water absorption (Df?1), and a relative percentage difference between dissipation factors (?Df?), which is calculated by the following equation: ? ? Df ? ( % ) = ? "\[LeftBracketingBar]" Df 1 ? - Df 0 ? ? "\[RightBracketingBar]" Df 0 ? × 100 ? % ; wherein ?Df? may be less than or equal to 16%. By controlling ?Df? of the LCP film in the laminate, the insertion loss of a circuit board comprising a laminate during signal transmission in low-, medium-, and/or high-frequency bands is decreased and/or inhibited.

Abstract: A resin composition includes 10 parts by weight of a first prepolymer and 5 parts by weight to 30 parts by weight of a vinyl group-containing polyphenylene ether resin, wherein the first prepolymer is prepared by subjecting a reaction mixture to a prepolymerization reaction, and the reaction mixture including a polyphenylmethane maleimide, a compound of Formula (1) and a compound of Formula (2) at a weight ratio of 100:10-30:15-45, and the resin composition is absent of a second prepolymer which is prepared by subjecting a maleimide and bis(trifluoromethyl)benzidine to a prepolymerization reaction. An article made from the resin composition may achieve improvement in at least one of the properties including ratio of electroless copper plating, storage modulus and copper foil peeling strength.

Abstract: A hemming path planning method and a hemming system are provided. The hemming path planning method includes the following steps. An initial contour data of a target is scanned to obtain. A first segment of the hemming path is planned according to the initial contour data. The first segment corresponds to a first bending angle. A second segment of the hemming path is planned according to the initial contour data and an expected springback amount related to the first bending angle. The second segment corresponds to a second bending angle. The first segment and the second segment are combined to obtain a continuous hemming path.

Abstract: Provided are a laminate, a circuit board, and a liquid crystal polymer (LCP) film comprised therein. The laminate comprises a metal foil and an LCP film. The LCP film in the laminate has a dissipation factor before water absorption (Df?0), a dissipation factor after water absorption (Df?1), and a relative percentage difference between dissipation factors (?Df?), which is calculated by the following equation: ? ? Df ? ( % ) = ? "\[LeftBracketingBar]" Df 1 ? - Df 0 ? ? "\[RightBracketingBar]" Df 0 ? × 100 ? % ; wherein ?Df? may be less than or equal to 16%. By controlling ?Df? of the LCP film in the laminate, the insertion loss of a circuit board comprising a laminate during signal transmission in low-, medium-, and/or high-frequency bands is decreased and/or inhibited.

Abstract: Provided are a liquid crystal polymer (LCP) film and a laminate comprising the same. The LCP film has a first surface and a second surface opposite each other, and a Kurtosis (Rku) of the first surface ranges from 3.0 to 60.0. With the Rku, the LCP film is able to improve the peel strength with a metal foil and ensure that a laminate comprising the same maintains the merit of low insertion loss.

Abstract: Provided are a liquid crystal polymer (LCP) film and a laminate comprising the same. The LCP film has a first surface and a second surface opposite each other, and a ratio of a ten-point mean roughness relative to a maximum height (Rz/Ry) of the first surface is from 0.30 to 0.62. By controlling Rz/Ry of at least one surface of the LCP film, the peel strength of the LCP film stacked to a metal foil can be increased, and the laminate comprising the same can still maintain the merit of low insertion loss.

Abstract: Provided are a liquid crystal polymer (LCP) film and a laminate comprising the same. The LCP film has a first surface and a second surface opposite each other, and a ratio of a ten-point mean roughness relative to a maximum height (Rz/Ry) of the first surface is from 0.30 to 0.62. By controlling Rz/Ry of at least one surface of the LCP film, the peel strength of the LCP film stacked to a metal foil can be increased, and the laminate comprising the same can still maintain the merit of low insertion loss.

Abstract: Provided are a laminate, a circuit board, and a liquid crystal polymer (LCP) film comprised therein. The laminate comprises a metal foil and an LCP film. The LCP film in the laminate has a dissipation factor before water absorption (Df?0), a dissipation factor after water absorption (Df?1), and a relative percentage difference between dissipation factors (?Df?), which is calculated by the following equation: ? ? D ? f ? ? ? ( % ) = ? Df 1 ? - D ? f 0 ? ? D ? f 0 ? × 1 ? 00 ? % ; wherein ?Df? may be less than or equal to 16%. By controlling ?Df? of the LCP film in the laminate, the insertion loss of a circuit board comprising a laminate during signal transmission in low-, medium-, and/or high-frequency bands is decreased and/or inhibited. In addition, the difference between the insertion losses of signal transmission before and after water absorption is decreased, so the laminate is suitable for high-end or outdoor high-frequency electronic products.