Abstract: A speaker module, including: a speaker enclosure, including: a recessed portion; a transducer, including: a top surface; a bottom surface; a perimeter surface positioned between the top surface and the bottom surface; a rubber cap including: a top side; a bottom side; and edges extending between the top side and the bottom side, wherein the edges define an inside perimeter of the rubber cap and include a slot extending along the inside perimeter of the rubber cap, wherein, the transducer is coupled to the rubber cap such that the rubber cap surrounds the transducer and the perimeter surface of the transducer is positioned within the slot of the plurality of edges of the rubber cap, wherein, the transducer is coupled to the speaker enclosure such that the transducer is positioned within the recessed portion of the speaker enclosure and the rubber cap is positioned between the transducer and the speaker.

Abstract: A package structure and method of forming the same are provided. The package structure includes a first die and a second die disposed side by side, a first encapsulant laterally encapsulating the first and second dies, a bridge die disposed over and connected to the first and second dies, and a second encapsulant. The bridge die includes a semiconductor substrate, a conductive via and an encapsulant layer. The semiconductor substrate has a through substrate via embedded therein. The conductive via is disposed over a back side of the semiconductor substrate and electrically connected to the through substrate via. The encapsulant layer is disposed over the back side of the semiconductor substrate and laterally encapsulates the conductive via. The second encapsulant is disposed over the first encapsulant and laterally encapsulates the bridge die.

Abstract: Provided are a liquid crystal polymer (LCP) film and a laminate comprising the same. The LCP film has a first surface and a second surface opposite each other, and a ratio of a ten-point mean roughness relative to a maximum height (Rz/Ry) of the first surface is from 0.30 to 0.62. By controlling Rz/Ry of at least one surface of the LCP film, the peel strength of the LCP film stacked to a metal foil can be increased, and the laminate comprising the same can still maintain the merit of low insertion loss.

Abstract: A data poisoning method and a data poisoning apparatus are provided. In the method, a training dataset and a validation dataset are retrieved. A perturbation is randomly initiated and added to data in the training dataset to generate poisoned training data. Values of multiple kernel functions of the poisoned training data and the validation dataset are computed by using kernel functions in a Gaussian process, and used to compute a mean of the Gaussian process on the validation dataset. A loss between the mean and the data in the validation dataset is computed by using a loss function of the Gaussian process, and used to generate an objective function that maximizes the loss. The objective function is solved to compute the perturbation that can maximize the loss.

Abstract: A flexible electronic device is provided in this disclosure. The flexible electronic device includes a base layer, an electronic unit, and a cover layer. The electronic unit is disposed on the base layer, and the cover layer is disposed on the electronic unit. The base layer has a thickness T1 and a Young's modulus E1, and the cover layer has a thickness T2 and a Young's modulus E2, wherein the electronic unit includes a metal layer, the metal layer is a multi-layer, and when a Young's modulus of the metal layer is less than 90,000 MPa, the thickness T1, the thickness T2, the Young's modulus E1, and the Young's modulus E2 comply with following expression: E2/E1?18.33×(T2/T1)?3.15.

Abstract: An electronic device, including a metal back cover, a front cover, a metal wall, and at least one antenna radiator, is provided. The front cover covers the metal back cover and includes a frame area. The metal wall is disposed between the metal back cover and the front cover, and forms a metal cavity corresponding to the frame area together with the metal back cover. Each of the at least one antenna radiator is disposed in the metal cavity, is connected to a first side wall of the metal back cover, and is spaced apart from the metal wall by a distance.

Abstract: A display apparatus includes a wireless transmission unit and a display panel. The display panel includes a substrate, a plurality of pixel units and a signal line. The substrate includes a display region and a periphery region. The periphery region surrounds the display region. The pixel units are disposed on the display region. Each of the pixel units includes an active device and a pixel electrode. The active device is electrically connected to the pixel electrode. The signal line is on the periphery region. As viewed from a top view, the signal line has an annular shape having a gap and surrounds the display region.

Abstract: An electronic device includes a metal back cover and an antenna module. The metal back cover includes a slit. The antenna module is separated from the metal back cover and disposed far away from the slit. The antenna module includes an antenna radiator, a first ground radiator, and a connection radiator. The antenna radiator includes a first section, a second section, and a third section that are sequentially connected and form bends, and the first section has a feeding end. A first slot is formed between the first ground radiator, the first section, the second section, and a part of the third section. A width and length of the first slot are associated with a center frequency and impedance matching of a high frequency band.

Abstract: A handle assembly includes a bracket, a first handle movably coupled to the bracket, and a second handle movably coupled to the bracket. The bracket can be movably coupled to a housing of a computing device. The first handle is movable between an insertion orientation and an ejection orientation. The second handle is movable between a locked orientation and an unlocked orientation and includes a locking structure to lock the expansion card within the housing. When the bracket is coupled to the housing, movement of the first handle between the insertion orientation and the ejection orientation causes the bracket and the second handle to move linearly within the housing. Movement of the second handle between the locked orientation and the unlocked orientation causes the locking structure to move between a locked position and an unlocked position.

Abstract: A ceramic submount for a semiconductor device and a method for manufacturing the same are provided. The ceramic submount includes a ceramic core board, an electrode layer, and a solder unit. The electrode layer is disposed on one side of the ceramic core board. The solder unit includes a buffer containing layer and a soldering layer. A cross-section of the solder unit has an inversed-trapezoid shape. The buffer containing layer is disposed on a surface of the electrode layer. A receiving space is concavely formed on a top surface of the buffer containing layer, and the soldering layer is filled in the receiving space. The buffer containing layer surrounds the soldering layer.

Abstract: A method of forming a semiconductor device includes forming a photoresist over a target layer, where the target layer includes a substrate. The photoresist is patterned to form a patterned photoresist. Scum remains between portions of the patterned photoresist. The substrate is tilted relative to a direction of propagation of an ion beam. An ion treatment is performed on the scum. A pattern of the patterned photoresist is transferred to the target layer.

Abstract: A package structure including a first redistribution layer, a semiconductor die, through insulator vias, an insulating encapsulant and a second redistribution layer. The first redistribution layer includes a dielectric layer, a conductive layer, and connecting portions electrically connected to the conductive layer. The dielectric layer has first and second surfaces, the connecting portions has a first side, a second side, and sidewalls joining the first side to the second side. The first side of the connecting portions is exposed from and coplanar with the first surface of the dielectric layer. The semiconductor die is disposed on the second surface of the dielectric layer. The through insulator vias are connected to the conductive layer. The insulating encapsulant is disposed on the dielectric layer and encapsulating the semiconductor die and the through insulator vias. The second redistribution layer is disposed on the semiconductor die and over the insulating encapsulant.

Abstract: An optical sensor circuit is provided. In the optical sensor circuit, an output stage circuit transmits a voltage of first and second node to the output line according to a first driving signal. A first sensor is configured to generate a first photocurrent according to a first color light that senses an ambient light, and generate a second photocurrent according to a second color light. A second sensor is configured to generate a third photocurrent according to a third color light, and generate a fourth photocurrent according to the second color light. In a sensing phase, when the first sensor senses the first color light, and the second sensor senses the third color light, the first sensor adjusts a voltage level of the voltage according to the first photocurrent, and the second sensor adjusts the voltage level of the voltage according to the third photocurrent.

Abstract: A power module structure includes a first housing, a second housing, a wind generating unit and a power socket. The first housing includes a first plate and a first side portion. The second housing is attached to the first housing and includes a second plate arranged opposite to the first plate and a second side portion arranged opposite to the first side portion. Furthermore, a ventilation bracket is integrally bent and extended from the second housing and provided for the installation of the wind generating unit. The power socket is arranged side by side with the wind generating unit. The power socket and the wind generating unit are located between the first plate and the second plate. Moreover, the ventilation bracket includes a securement portion, and the securement portion is extended to inside of the first plate or the second plate for securement.

Abstract: Provided are a liquid crystal polymer resin and a formed material comprising the same. The liquid crystal polymer resin comprises a structure unit represented by Formula (I). The thermal weight loss of the liquid crystal polymer resin is greater than 0.038% and less than 0.108%. The formed material made from the liquid crystal polymer resin has tensile strength of 1300 kgf/cm2 or more, tensile modulus of 5000 MPa or more, and elongation at break of 8.0% or less. Besides, the formed material made from the recycled liquid crystal polymer resin contains similar mechanical properties as the formed material made from the one before recycling, which indicates that the recycled liquid crystal polymer resin has potential to product reprocessing and meet the requirement of green process.

Abstract: A riser bracket for a computing device includes a plurality of structural members configured to receive a computing component and an adjustable fixing bracket mechanically coupled to the plurality of structural members. The adjustable fixing bracket has a plurality of configurations that includes a first configuration and a second configuration. The adjustable fixing bracket has a first height in the first configuration that is greater than a second height in the second configuration. The adjustable fixing bracket includes a first slide bracket that is slidably mounted to a support bracket. The support bracket is fixed relative to the first slide bracket and the plurality of structural members. The first slide bracket is slidable along the support bracket to change the adjustable fixing bracket between the first configuration and the second configuration.

Abstract: Disclosed is a method for collecting and presenting physiological signal data and location information, comprising: receiving physiological signal data; providing a first user interface to receive a first user input, the first user interface including a first representation of human body or a part thereof, and the first user input including a first location of the first representation; converting the first location to a first location information according to a predetermined first mapping relationship; storing the physiological signal data in association with an identification of the first location information; and in response to a request, providing a second user interface, the second user interface including a selection function, which provides a second representation corresponding to the first representation, wherein when a second location in the second representation corresponding to the first location information is selected, the second user interface presents the physiological signal data.

Abstract: A hemming path planning method and a hemming system are provided. The hemming path planning method includes the following steps. An initial contour data of a target is scanned to obtain. A first segment of the hemming path is planned according to the initial contour data. The first segment corresponds to a first bending angle. A second segment of the hemming path is planned according to the initial contour data and an expected springback amount related to the first bending angle. The second segment corresponds to a second bending angle. The first segment and the second segment are combined to obtain a continuous hemming path.

Abstract: Provided are an LCP film and a laminate comprising the same. The LCP film is made of an LCP resin comprising a structural unit represented by Formula (1): -L1-Ar-L2- (1), wherein -L1- and -L2- are respectively —O— or —CO—; —Ar— is an arylene group. Formula (1) comprises structural units Based on a total molar number of the structural unit represented by Formula (1), a molar number of the structural unit represented by Formula (I) is in the range from 15 mole % to mole %, and a sum of molar numbers of the structural units represented by Formulae (I) and (II) is in the range from 80 mole % to 100 mole %. The LCP film has a thickness and a transmittance, wherein when values of the thickness (in ?m) and the transmittance are put into Formula (III), the obtained value is from 0.055 to 0.090. Formula (III): Log(1/TT %)/(Thickness)0.5.

Abstract: Provided are a liquid crystal polymer film (LCP film) and a laminate comprising the same. The LCP film has a first surface and a second surface opposite each other, and the first surface has an arithmetical mean height of a surface (Sa) less than 0.32 ?m. The LCP film with proper Sa is suitable to be stacked with a metal foil, such that a laminate comprising the LCP film can have an advantage of low insertion loss.