Patents by Inventor Chia-I Tsai

Chia-I Tsai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230122849
    Abstract: The present invention relates to a method of treating moderate or severe symptoms of COVID-19 using a plant composition. The plant composition comprises Prepared Monkshood Daughter Root (Aconitum carmichaelii), Fragrant Solomonseal Rhizome (Polygonatum odoratum), Indian Bread (Poria cocos), Pinellia tuber (Pinellia ternata), Oriental Wormwood Herb (Artemisia scoparia), Scutellaria Root (Scutellaria baicalensis), Mongolian Snakegourd Fruit (Trichosanthes kirilowii), Magnolia Bark (Magnolia officinalis), Heartleaf Houttuynia Herb (Houttuynia cordata), and Baked Licorice Root and Rhizome (Glycyrrhiza glabra), which is used as a traditional Chinese medicine composition.
    Type: Application
    Filed: October 19, 2022
    Publication date: April 20, 2023
    Inventors: YI-CHANG SU, WEN-HUI CHIOU, YUH-CHIANG SHEN, WEN-CHI WEI, KENG-CHANG TSAI, CHIA-CHING LIAO, YU-HWEI TSENG, CHUN-TANG CHIOU, YU-CHI LIN, LI-HSIANG WANG, CHIEN-HSIEN HUANG, CHIA-MO LIN, CHI-KUEI LIN, YI-CHIA HUANG, CHIEN-JUNG LIN, JUI-SHAN LIN, YA-SUNG YANG, CHUN-HSIANG CHIU, SHUN-PING CHENG, HSIEN-HWA KUO, WU-PU LIN, CHEN-SHIEN LIN, BO-CHENG LAI, YUAN-NIAN HSU, TSUNG-LUNG TSAI, WEI-CHEN HSU, TIENG-SIONG FONG, YI-WEN HUANG, CHIA-I TSAI, YA-CHEN YANG, MING-CHE TSAI, MING-HUEI CHENG, SHIH-WEI HUANG
  • Publication number: 20150347806
    Abstract: A chip package structure includes a flexible substrate, a patterned circuit layer, a fingerprint sensor chip, a plurality of bumps, a patterned dielectric layer and an encapsulant layer. The patterned circuit layer disposed on the flexible substrate includes a fingerprint sensing circuit and a plurality of terminals. The fingerprint sensor chip disposed on the flexible substrate is electrically connected to the fingerprint sensing circuit and includes an active surface, a back surface, and a plurality of bonding pads disposed on the active surface. The bumps disposed between the fingerprint sensor chip and the patterned circuit layer electrically connect the bonding pads and the terminals. The patterned dielectric layer including a first surface and a second surface having a fingerprint sensing region at least covers the fingerprint sensing circuit with the first surface. The encapsulant layer is filled between the flexible substrate and the fingerprint sensor chip and covers the bumps.
    Type: Application
    Filed: September 5, 2014
    Publication date: December 3, 2015
    Inventors: Li-Chun Li, Chia-I Tsai
  • Publication number: 20070200246
    Abstract: A chip package including a flexible substrate, a plurality of conductive plugs, a wiring layer, and a chip is provided. The flexible substrate has a first surface and a second surface opposite to the first surface. The conductive plugs pass through the flexible substrate. The wiring layer is located on the first surface and has a plurality of inner leads electrically connected to the conductive plugs respectively. The chip has an active surface and a plurality of bumps on the active surface, wherein the chip is disposed on the second surface of the flexible substrate and connected with the conductive plugs by the bumps. As bumps on the chip are electrically connected to the conductive plugs by hot pressing, the chip is quickly and reliably electrically connected to the inner leads.
    Type: Application
    Filed: May 1, 2006
    Publication date: August 30, 2007
    Inventors: Ming-Liang Huang, Chia-I Tsai